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2 Layer PCB Rogers 60mil (1.524mm) RO4350B RF Circuit Board for Patch Antenna |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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RO4350B hydrocarbon ceramic laminates are crafted to deliver outstanding high frequency performance and enable low-cost circuit fabrication. When operational frequencies climb to 500 MHz and above, the range of laminates typically accessible to designers shrinks significantly.
The RO4350B material holds the properties that designers of RF microwave circuits, matching networks, and controlled impedance transmission lines require. Its low dielectric loss makes it suitable for numerous applications where higher operating frequencies restrict the use of traditional circuit board materials.
The temperature coefficient of dielectric constant of this material is among the lowest of all circuit board materials, and the dielectric constant remains stable across a wide frequency spectrum. |
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The thermal coefficient of expansion (CTE) of RO4350B material endows PCB designers with several crucial advantages. Notably, the expansion coefficient of RO4350B closely resembles that of copper, affording the material remarkable dimensional stability. This property is of utmost importance for the construction of mixed dielectric multi-layer boards.
Moreover, the low Z-axis CTE of RO4350B guarantees reliable plated through-hole quality, even under the duress of severe thermal shock conditions. With a glass transition temperature (Tg) exceeding 280°C, RO4350B material ensures that its expansion characteristics remain unwavering throughout the entire gamut of PCB processing temperatures.
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RO4350B PCB Specifications |
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High Frequency PCB Rogers 60mil 1.524mm RO4350B Double Sided RF Patch Antenna PCB |
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PCB SIZE |
135 x 135mm=1PCS |
BOARD TYPE |
High frequency PCB, RF PCB |
Number of Layers |
Double sided PCB |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
copper ------- 35um(1oz)+PLATE |
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RO4350B 60mil |
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copper ------- 35um(1oz)+PLATE |
TECHNOLOGY |
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Minimum Trace and Space: |
11mil/12mil |
Minimum / Maximum Holes: |
0.3/2.2mm |
Number of Different Holes: |
5 |
Number of Drill Holes: |
184 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control |
NO |
BOARD MATERIAL |
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Glass Epoxy: |
RO4350B 60mil, Tg 288℃ |
Final foil external: |
1.5oz |
Final foil internal: |
0oz |
Final height of PCB: |
1.6mm ±0.16 |
PLATING AND COATING |
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Surface Finish |
Electroless nickel over Immersion Gold (ENIG)( 2 micoinch over 100 microinch nickel) |
Solder Mask Apply To: |
NO |
Solder Mask Color: |
NO |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
NO |
Colour of Component Legend |
NO |
Manufacturer Name or Logo: |
N/A |
VIA |
Plated Through Hole(PTH) |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" (0.15mm) |
Board plating: |
0.0030" (0.076mm) |
Drill tolerance: |
0.002" (0.05mm) |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Typical applications: |
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Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power amplifiers
RFID |
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Data sheet of Rogers 4350B (RO4350B ) |
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RO4350B Typical Value |
Property |
RO4350B |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.48±0.05 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
3.66 |
Z |
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8 to 40 GHz |
Differential Phase Length Method |
Dissipation Factortan,δ |
0.0037
0.0031 |
Z |
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10 GHz/23℃
2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
+50 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
1.2 x 1010 |
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MΩ.cm |
COND A |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
5.7 x109 |
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MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
31.2(780) |
Z |
Kv/mm(v/mil) |
0.51mm(0.020") |
IPC-TM-650 2.5.6.2 |
Tensile Modulus |
16,767(2,432)
14,153(2,053) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
Tensile Strength |
203(29.5)
130(18.9) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
Flexural Strength |
255
(37) |
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MPa
(kpsi) |
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IPC-TM-650 2.4.4 |
Dimensional Stability |
<0.5 |
X,Y |
mm/m
(mil/inch) |
after etch+E2/150℃ |
IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion |
10
12
32 |
X
Y
Z |
ppm/℃ |
-55℃to288℃ |
IPC-TM-650 2.4.41 |
Tg |
>280 |
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℃ TMA |
A |
IPC-TM-650 2.4.24.3 |
Td |
390 |
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℃ TGA |
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ASTM D 3850 |
Thermal Conductivity |
0.69 |
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W/M/oK |
80℃ |
ASTM C518 |
Moisture Absorption |
0.06 |
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% |
48hrs immersion 0.060"
sample Temperature 50℃ |
ASTM D 570 |
Density |
1.86 |
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gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
0.88
(5.0) |
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N/mm
(pli) |
after solder float 1 oz.
EDC Foil |
IPC-TM-650 2.4.8 |
Flammability |
(3)V-0 |
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UL 94 |
Lead-free Process Compatible |
Yes |
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