(FPC’s are custom-made products. The picture and parameters shown are for reference only.)

This is a 2-layer flexible printed circuit (FPC) designed for keypad applications, with a thickness of 0.2mm. It utilizes ITEQ base laminate and is manufactured to IPC 6012 Class 2 standards using provided Gerber files. A polyimide stiffener is applied to the inserting section to enhance structural integrity.

Features and Benefits

1. Excellent flexibility

2. Reducing the volume

3. Weight reduction

4. Consistency of assembly

5. Increased reliability

6. Low cost

7. Continuity of processing

8. The end can be whole soldered

9. Offer small quantity, prototypes and production.

10. DDU Door to door shipment with competitive shipping cost.

A flexible circuit consists of copper foil, dielectric substrate and coverlay and adhesive.

Copper foil is available in two different types of copper: ED Copper and RA copper.

ED copper is an electro-deposited copper foil produced similarly to the copper foil used in rigid printed circuit boards. This means the copper undergoes a "treatment" process, resulting in a slightly rough surface on one side—an attribute that enhances adhesion when bonding the foil to the base material.

RA copper is a rolled and annealed copper foil derived from electrolytically deposited cathode copper, which is melted and cast into ingots. The process begins with hot-rolling the ingots to a specified size and milling all surfaces, followed by cold-rolling and annealing until the desired thickness is achieved.

Copper foil is available in thicknesses of 12, 18, 35, and 70 μm.

Polyimide films are the most common materials for dielectric substrates and coverlays, and they can also serve as coverlays themselves. Polyimide is ideal for flexible circuits due to the following characteristics:

1. High temperature resistance, which allows soldering operations without damaging the flexible circuits.

2. Excellent electrical properties.

3. Good chemical resistance.

Polyimide is available in thicknesses of 12.5, 20, 25, and 50 μm. In rigid printed circuit boards, base laminates consist of copper foils bonded to base materials, with adhesive derived from prepreg during lamination. Flexible circuits differ in that copper foil is laminated to film materials using an adhesive system. There are two primary adhesive systems: thermoplastic and thermoset adhesives. The choice between them depends partly on processing requirements and partly on the intended application of the finished flexible circuit.

More Displays of Flexible Circuits