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15mil-20mil-25mil-30mil-50mil-60mil-Rogers-TMM4-Microwave-PCB-with-Immersion-Gold, Precision-Engineered-and-Durable |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Rogers TMM4 PCB is a high-performance thermoset microwave material composed of a ceramic-hydrocarbon thermoset polymer composite, specifically engineered for stripline and microstrip applications requiring exceptional plated-through-hole reliability. With a dielectric constant (Dk) of 4.70, TMM4 laminate combines the advantageous electrical and mechanical properties of both ceramic and traditional PTFE-based microwave materials, while eliminating the need for specialized manufacturing processes. Notably, it does not require sodium napthanate treatment before electroless plating, simplifying production.
One of the standout features of high frequency TMM4 is its remarkably low thermal coefficient of dielectric constant, typically under 30 PPM/°C. This ensures stable electrical performance across a wide temperature range. Additionally, its isotropic coefficient of thermal expansion is closely matched to copper, enabling the production of highly reliable plated through holes and minimizing etch shrinkage. TMM4 substrate also boasts thermal conductivity approximately twice that of conventional PTFE/ceramic materials, making it highly effective for heat dissipation.
As a thermoset resin-based material, TMM4 PCB does not soften when exposed to heat, ensuring excellent dimensional stability. This property allows for reliable wire bonding of component leads to circuit traces without the risk of pad lifting or substrate deformation, making it an ideal choice for demanding RF and microwave applications. |
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Our PCB Capability (TMM4) |
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PCB Material: |
Composite of Ceramic, hydrocarbon and thermoset polymer |
Designator: |
TMM4 |
Dielectric constant: |
4.5 ±0.045 (process); 4.7 (design) |
Layer count: |
Single Sided, Double Sided, Multi-layer, Hybrid designs |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Laminate thickness: |
15mil (0.381mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm), 150mil (3.810mm), 200mil (5.08mm), 250mil (6.35mm), 500mil (12.7mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion tin, Immersion Silver, Pure gold (no nickle under gold), OSP, ENEPIG |
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Typical Applications |
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Chip testers
Dielectric polarizers and lenses
Filters and coupler
Global Positioning Systems Antennas
Patch Antennas
Power amplifiers and combiners
RF and microwave circuitry
Satellite communication systems |
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Data Sheet of TMM4 |
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TMM4 Typical Value |
Property |
TMM4 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
4.5±0.045 |
Z |
|
10 GHz |
IPC-TM-650 2.5.5.5 |
Dielectric Constant,εDesign |
4.7 |
- |
- |
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor (process) |
0.002 |
Z |
- |
10 GHz |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of dielectric constant |
+15 |
- |
ppm/°K |
-55℃-125℃ |
IPC-TM-650 2.5.5.5 |
Insulation Resistance |
>2000 |
- |
Gohm |
C/96/60/95 |
ASTM D257 |
Volume Resistivity |
6 x 108 |
- |
Mohm.cm |
- |
ASTM D257 |
Surface Resistivity |
1 x 109 |
- |
Mohm |
- |
ASTM D257 |
Electrical Strength(dielectric strength) |
371 |
Z |
V/mil |
- |
IPC-TM-650 method 2.5.6.2 |
Thermal Properties |
Decompositioin Temperature(Td) |
425 |
425 |
℃TGA |
- |
ASTM D3850 |
Coefficient of Thermal Expansion - X |
16 |
X |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Y |
16 |
Y |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Coefficient of Thermal Expansion - Z |
21 |
Z |
ppm/K |
0 to 140 ℃ |
ASTM E 831 IPC-TM-650, 2.4.41 |
Thermal Conductivity |
0.7 |
Z |
W/m/K |
80 ℃ |
ASTM C518 |
Mechanical Properties |
Copper Peel Strength after Thermal Stress |
5.7 (1.0) |
X,Y |
lb/inch (N/mm) |
after solder float 1 oz. EDC |
IPC-TM-650 Method 2.4.8 |
Flexural Strength (MD/CMD) |
15.91 |
X,Y |
kpsi |
A |
ASTM D790 |
Flexural Modulus (MD/CMD) |
1.76 |
X,Y |
Mpsi |
A |
ASTM D790 |
Physical Properties |
Moisture Absorption (2X2) |
1.27mm (0.050") |
0.07 |
- |
% |
D/24/23 |
ASTM D570 |
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3.18mm (0.125") |
0.18 |
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Specific Gravity |
2.07 |
- |
- |
A |
ASTM D792 |
Specific Heat Capacity |
0.83 |
- |
J/g/K |
A |
Calculated |
Lead-Free Process Compatible |
YES |
- |
- |
- |
- |
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