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15mil 0.381mm RT/Duroid 5880 Rogers High Frequency PCB for Millimeter Wave Applications |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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When it comes to high - frequency applications that demand precision and reliability, Rogers RT/duroid 5880 is the go - to material. This glass microfiber reinforced PTFE composite is tailor - made for stripline and microstrip circuits. In commercial airline broadband antennas, it ensures seamless communication. For military radar systems and missile guidance systems, its consistent dielectric constant over a wide frequency range is crucial. In millimeter - wave applications and point - to - point digital radio antennas, its low dissipation factor, which extends to the Ku - band and above, is a game - changer. RT/duroid 5880 is not only excellent in performance but also easy to work with. It can be effortlessly cut, sheared, and machined, and it resists all common etching and plating solvents. |
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PCB Specifications |
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Rogers RT/Duroid 5880 15mil 0.381mm High Frequency PCB for Millimeter Wave Applications |
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PCB SIZE |
160 x 70mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
RT/duroid 5880 0.381mm |
copper ------- 18um(0.5oz) + plate BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
4 mil / 15 mil |
Minimum / Maximum Holes: |
0.254 mm / 4.0mm |
Number of Different Holes: |
4 |
Number of Drill Holes: |
125 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
RT/duroid 5880 0.381mm |
Final foil external: |
1.0 oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.4 mm ±0.1 |
PLATING AND COATING |
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Surface Finish |
Immersion gold |
Solder Mask Apply To: |
N/A |
Solder Mask Color: |
N/A |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
N/A |
Colour of Component Legend |
N/A |
Manufacturer Name or Logo: |
N/A |
VIA |
Plated through hole(PTH), minimum size 0.2mm. Via tented. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Data Sheet of Rogers RT/duroid 5880 |
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RT/duroid 5880 Typical Value |
Property |
RT/duroid 5880 |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
2.20
2.20±0.02 spec. |
Z |
N/A |
C24/23/50
C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
Dielectric Constant,εDesign |
2.2 |
Z |
N/A |
8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.0004
0.0009 |
Z |
N/A |
C24/23/50
C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5 |
Thermal Coefficient of ε |
-125 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
2 x 107 |
Z |
Mohm cm |
C/96/35/90 |
ASTM D 257 |
Surface Resistivity |
3 x 107 |
Z |
Mohm |
C/96/35/90 |
ASTM D 257 |
Specific Heat |
0.96(0.23） |
N/A |
j/g/k
(cal/g/c) |
N/A |
Calculated |
Tensile Modulus |
Test at 23℃ |
Test at 100℃ |
N/A |
MPa(kpsi) |
A |
ASTM D 638 |
1070(156) |
450(65) |
X |
860(125) |
380(55) |
Y |
Ultimate Stress |
29(4.2) |
20(2.9) |
X |
27(3.9） |
18(2.6) |
Y |
Ultimate Strain |
6 |
7.2 |
X |
% |
4.9 |
5.8 |
Y |
Compressive Modulus |
710(103) |
500(73) |
X |
MPa(kpsi) |
A |
ASTM D 695 |
710(103) |
500(73) |
Y |
940(136) |
670(97) |
Z |
Ultimate Stress |
27(3.9) |
22(3.2) |
X |
29(5.3) |
21(3.1) |
Y |
52(7.5) |
43(6.3) |
Z |
Ultimate Strain |
8.5 |
8.4 |
X |
% |
7.7 |
7.8 |
Y |
12.5 |
17.6 |
Z |
Moisture Absorption |
0.02 |
N/A |
% |
0.62"(1.6mm) D48/50 |
ASTM D 570 |
Thermal Conductivity |
0.2 |
Z |
W/m/k |
80℃ |
ASTM C 518 |
Coefficient of Thermal Expansion |
31
48
237 |
X
Y
Z |
ppm/℃ |
0-100℃ |
IPC-TM-650 2.4.41 |
Td |
500 |
N/A |
℃ TGA |
N/A |
ASTM D 3850 |
Density |
2.2 |
N/A |
gm/cm3 |
N/A |
ASTM D 792 |
Copper Peel |
31.2(5.5) |
N/A |
Pli(N/mm) |
1oz(35mm)EDC foil
after solder float |
IPC-TM-650 2.4.8 |
Flammability |
V-0 |
N/A |
N/A |
N/A |
UL 94 |
Lead-free Process Compatible |
Yes |
N/A |
N/A |
N/A |
N/A |
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RT/Duroid 5880 High Frequency PCB |
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