14-Layer-Rigid-Flex-PCB-R-F777-Polyimide-and-S1000-2M-FR-4

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14-Layer-Rigid-Flex-PCB-R-F777-Polyimide-and-S1000-2M-FR-4-High-Density-and-High-Reliability-for-Demanding-Robotic-Applications

(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

Product Overview

This 14-layer rigid-flex PCB integrates polyimide (PI) flexible substrates with FR-4 rigid boards, engineered for high-density interconnects, dynamic flexing, and complex spatial configurations. Featuring an optimized symmetrical structure with three independent flex zones, it delivers both the mechanical stability of rigid PCBs and the adaptable mounting benefits of flexible circuits. The design meets stringent reliability requirements for industrial automation systems, medical devices, automotive electronics, and aerospace applications.

Core Features

1. High-Density Integration & Ultra-Thin Design

Rigid section: 2.0mm thickness (green solder mask/white silkscreen)

Flex section: 0.21mm thickness (yellow coverlay/white silkscreen), supports dynamic bending (radius ≤3mm)

14-layer stackup (2 flex layers) with symmetrical architecture for signal integrity and mechanical stability

2. Precision Impedance and Signal Performance

Tight ±10% impedance control for high-frequency signals (RF/high-speed applications)

Optimized copper distribution (inner: 0.5oz / outer: 1oz) for current capacity and thermal management

3. Enhanced Reliability and Durability

Immersion gold finish (≥3μ" thickness) for solderability and corrosion resistance

Panasonic R-F777 polyimide base (Tg≥260℃, high-flex endurance)

4. Quality Assurance

IPC-A-600 Class 3 compliance (military-grade validation)

Serialized traceability for production tracking

Detailed Technical Parameter Table

Size of Flex-Rigid PCB	238mm x 42mm=1 PCS
Number of Layers	14
Board Type	Rigid-Flex PCB
Board Thickness	2.0mm -Rigid, 0.21mm - flex
Board Material	FR-4 / Polyimide 3mil
Board Material Supplier	Shengyi / Panasonic
Tg Value of Board Material	170℃
PTH Cu thickness	≥20 µm
Inner Iayer Cu thicknes	18 µm
Surface Cu thickness	35 µm
Coverlay Colour	Yellow coverlay / Green solder mask
Number of Coverlay	2
Thickness of Coverlay	25 µm
Stiffener Material	N/A
Stiffener Thickness	N/A
Type of Silkscreen Ink	IJR-4000 MW300
Supplier of Silkscreen	TAIYO
Color of Silkscreen	White
Number of Silkscreen	1
Peeling test of Coverlay	No peelable
Legend Adhesion	3M 90℃ No peeling after Min. 3 times test
Surface Finish	Immersion Gold
Thickness of Surface Finish	Au: 0.03µm(Min.); Ni 2-4µm
RoHS Required	Yes
Famability	94-V0
Thermal Shock Test	Pass, -25℃±125℃, 1000 cycles.
Thermal Stress	Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6013C Class 3
Impedance Control	Required impedance, Ohm	Layer	Reference layer

	Single ended impedance (Z₀) 40±10%	TOP	IN1
		IN3	IN2/IN4
		IN6	IN5/IN7
		IN8	IN7/IN9
		IN10	IN9/IN11
		BOT	IN12
	Single ended impedance (Z₀) 50±10%	TOP	IN1
		IN3	IN2/IN4
		IN6	IN5/IN7
		IN8	IN7/IN9
		BOT	IN12
	Single ended impedance (Z₀) 50±10%	IN6 (flex part)	IN7 (flex part)
	Differential impedance (Z_diff) 80±10%	TOP	IN1
		IN3	IN2/IN4
		IN8	IN7/IN9
		IN10	IN9/IN11
	Differential impedance (Z_diff) 100±10%	TOP	IN1
		IN3	IN2/IN4
		IN6	IN5/IN7
		BOT	IN12
	Differential impedance (Z_diff) 100±10%	IN6 (flex part)	IN7 (flex part)

Application Fields

Industrial Equipment: Control modules of robotic arms, interconnection of high-precision sensors.

Medical Electronics: Flexible circuits for endoscopes, portable monitoring devices.

Automotive Electronics: Onboard cameras, high-speed signal transmission in ADAS systems.

Consumer Electronics: Folding screen devices, miniaturized smart wearable products.

Quality Control and Service

Precision Manufacturing: Laser drilling and LDI exposure ensure 3mil microvia accuracy in base materials

Comprehensive Testing: Includes impedance test reports and AOI/X-ray inspection documentation

Packaging and Delivery: Individually packaged units (238×42mm) with small-batch customization and volume production support

Hot Tags:

14-Layer Rigid Flex PCB

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R-F777 and S1000-2M FR-4 Substrate