10mil-10-Layer-High-Frequency-PCB-with-5-Cores-Rogers-RO4350B-and-4mil-RO4450F

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13.3mil-RO4350B-and-31mil-RT/Duroid-5880-3-Layer-Hybrid-RF-PCB-High-Frequency-with-Advanced-Performance-and-Reliability

(As PCBs are custom - produced goods, the picture and parameters shown are only intended for reference.)

Hello everyone,

Warm greetings!

Hybrid PCBs can combine FR-4 with high-frequency materials or mix high-frequency materials with different dielectric constants (DK), such as RT/duroid 5880 and RO4350B.

Today, we’ll discuss a specific hybrid high-frequency PCB constructed using 13.3mil (0.338mm) RO4350B and 31mil (0.787mm) RT/duroid 5880. This design is tailored for multi-coupler antenna applications.

This is a three-layer PCB design where one of the layers has been selectively etched away.

The basic specifications are as follows:

Base material: RO4350B 13.3mil (0.338mm) + RT/duroid 5880 31 mil (0.787mm)

Dielectric constant: 3.48+/-0.05

Layer count: 3 layers

Via type: Through holes, blind vias

Format: 160mm x 90mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35μm | Inner layer 35μm

Solder mask / Legend: Green / White

Final PCB height: 1.3 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 20 working days

Shelf life: 6 months

Features and benefits

1. Minimized electrical loss for reinforced PTFE material

2. Superior electrical performance

3. 16,000 square meter production facility

4. Monthly production capacity of 30,000 square meters

5. Capability to produce 8,000 PCB varieties per month

6. Over 17 years of expertise in PCB manufacturing

Applications

Point to Point Digital Radio Antennas, WiFi Amplifier, Tower-mounted Booster, Power Amplifier, RF Module

Properties of RT/duroid 5880

RT/duroid 5880 Typical Value
Property	RT/duroid 5880		Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	2.20 2.20±0.02 spec.		Z	N/A	C24/23/50 C24/23/50	1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign	2.2		Z	N/A	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0004 0.0009		Z	N/A	C24/23/50 C24/23/50	1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε	-125		Z	ppm/℃	-50℃to 150℃	IPC-TM-650 2.5.5.5
Volume Resistivity	2 x 10⁷		Z	Mohm cm	C/96/35/90	ASTM D 257
Surface Resistivity	3 x 10⁷		Z	Mohm	C/96/35/90	ASTM D 257
Specific Heat	0.96(0.23）		N/A	j/g/k (cal/g/c)	N/A	Calculated
Tensile Modulus	Test at 23℃	Test at 100℃	N/A	MPa(kpsi)	A	ASTM D 638
	1070(156)	450(65)	X
	860(125)	380(55)	Y
Ultimate Stress	29(4.2)	20(2.9)	X
	27(3.9）	18(2.6)	Y
Ultimate Strain	6	7.2	X	%
	4.9	5.8	Y
Compressive Modulus	710(103)	500(73)	X	MPa(kpsi)	A	ASTM D 695
	710(103)	500(73)	Y
	940(136)	670(97)	Z
Ultimate Stress	27(3.9)	22(3.2)	X
	29(5.3)	21(3.1)	Y
	52(7.5)	43(6.3)	Z
Ultimate Strain	8.5	8.4	X	%
	7.7	7.8	Y
	12.5	17.6	Z
Moisture Absorption	0.02		N/A	%	0.62"(1.6mm) D48/50	ASTM D 570
Thermal Conductivity	0.2		Z	W/m/k	80℃	ASTM C 518
Coefficient of Thermal Expansion	31 48 237		X Y Z	ppm/℃	0-100℃	IPC-TM-650 2.4.41
Td	500		N/A	℃ TGA	N/A	ASTM D 3850
Density	2.2		N/A	gm/cm³	N/A	ASTM D 792
Copper Peel	31.2(5.5)		N/A	Pli(N/mm)	1oz(35mm)EDC foil after solder float	IPC-TM-650 2.4.8
Flammability	V-0		N/A	N/A	N/A	UL 94
Lead-free Process Compatible	Yes		N/A	N/A	N/A	N/A

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