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10mil 2-Layer Rogers 3003 Circuit Board Rogers RO3003 High Frequency PCB DK3.0 DF 0.001 Microwave PCB |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Rogers RO3003 high-frequency circuit materials are ceramic-filled PTFE composites designed for commercial microwave and RF applications. They provide exceptional electrical and mechanical stability at competitive prices. The consistent mechanical properties enable designers to create multi-layer board designs without facing warpage or reliability issues. RO3003 materials have a coefficient of thermal expansion (CTE) of 17 ppm/°C in the X and Y axes, matching that of copper for excellent dimensional stability. Typically, etch shrinkage is less than 0.5 mils per inch after etching and baking. The Z-axis CTE is 24 ppm/°C, ensuring superior reliability for plated through-holes, even in harsh environments. |
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Typical applications:
1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers |
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PCB Specifications |
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Rogers RO3003 10mil 0.254mm High Frequency PCB DK3.0 RF PCB for Automotive Radar Applications |
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PCB SIZE |
100 x 100mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
NO |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 35 um(1 oz) |
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RO3003 0.254mm |
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copper ------- 35 um(1 oz) |
TECHNOLOGY |
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Minimum Trace and Space: |
5mil / 5mil |
Minimum / Maximum Holes: |
0.3mm / 0.8mm |
Number of Different Holes: |
N/A |
Number of Drill Holes: |
N/A |
Number of Milled Slots: |
N/A |
Number of Internal Cutouts: |
N/A |
Impedance Control: |
N/A |
Number of Gold finger: |
N/A |
BOARD MATERIAL |
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Glass Epoxy: |
RO3003 0.254mm |
Final foil external: |
1oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.3 mm ±0.1 |
PLATING AND COATING |
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Surface Finish |
N/A |
Solder Mask Apply To: |
N/A |
Solder Mask Color: |
N/A |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
N/A |
Colour of Component Legend |
N/A |
Manufacturer Name or Logo: |
N/A |
VIA |
N/A |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
N/A |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Data Sheet of Rogers 3003 (RO3003) |
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RO3003 Typical Value |
Property |
RO3003 |
Direction |
Units |
Condition |
Test Method |
Electrical Properties |
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Dielectric Constant,εProcess |
3.0±0.04 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
3 |
Z |
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8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.001 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
-3 |
Z |
ppm/℃ |
10 GHz -50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
107 |
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MΩ.cm |
COND A |
IPC 2.5.17.1 |
Surface Resistivity |
107 |
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MΩ |
COND A |
IPC 2.5.17.1 |
Thermal Properties |
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Td |
500 |
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℃ TGA |
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ASTM D 3850 |
Coefficient of Thermal Expansion
(-55 to 288℃) |
17
16
25 |
X
Y
Z |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.4.1 |
Thermal Conductivity |
0.5 |
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W/M/K |
50℃ |
ASTM D 5470 |
Mechanical Properties |
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Copper Peel Stength |
12.7 |
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Ib/in. |
1oz,EDC After Solder Float |
IPC-TM 2.4.8 |
Young's Modulus |
930
823 |
X
Y |
MPa |
23℃ |
ASTM D 638 |
Dimensional Stability |
-0.06
0.07 |
X
Y |
mm/m |
COND A |
IPC-TM-650 2.2.4 |
Physical Properties |
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Flammability |
V-0 |
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UL 94 |
Moisture Absorption |
0.04 |
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% |
D48/50 |
IPC-TM-650 2.6.2.1 |
Density |
2.1 |
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gm/cm3 |
23℃ |
ASTM D 792 |
Specific Heat |
0.9 |
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j/g/k |
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Calculated |
Lead-free Process Compatible |
Yes |
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Hot Tags:
Rogers RO3003 Tg |
Rogers RO3003 Thickness |
RO3003 Material |
Rogers RO3003 Substrate |
RO3003 Loss Tangent |
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