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10mil 0.254mm Taconic RF-35TC High Frequency Printed Circuit Board with Immersion Gold |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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RF-35TC is a high - frequency material developed by Taconic company. It stands out with its "best in class" low dissipation factor combined with high thermal conductivity. This makes it the perfect choice for high - power applications where even the slightest difference of 1/10th of a dB can be crucial. In such applications, the PCB substrate, like RF - 35TC, is expected to efficiently dissipate heat away from both transmission lines and surface - mount components such as transistors.
RF-35TC is a PTFE - based, ceramic - filled fiberglass substrate. One of its significant advantages is its stability. Unlike its synthetic rubber (hydrocarbon) competitors, RF - 35TC will not oxidize, turn yellow, or experience an upward drift in dielectric constant and dissipation factor. This stability ensures consistent performance over time.
This laminate features a low dielectric constant value of 3.50 and an extremely low Df of 0.0011. These characteristics result in a low dissipation factor. Coupled with its high thermal conductivity, RF - 35TC also bonds very well to low - profile copper. This excellent bonding ability further reduces insertion loss, enhancing the overall performance of the circuits.
The RF - 35TC laminates are highly suitable for a range of applications, including antennas, satellites, filters, couplers, and power amplifiers. Their unique properties make them an optimal choice for these high - frequency and high - performance applications. |
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PCB Specifications |
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PCB SIZE |
75 x 86mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
YES |
LAYER STACKUP |
Copper ------- 35um(1 oz)+plate TOP layer |
RF-35TC 0.254mm |
Copper ------- 35um(1oz) + plate BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
7.1 mil / 5 mil |
Minimum / Maximum Holes: |
0.4 mm / 5.2 mm |
Number of Different Holes: |
6 |
Number of Drill Holes: |
41 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
3 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
RF-35TC 0.254mm |
Final foil external: |
1.5 oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.3 mm ±0.1mm |
PLATING AND COATING |
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Surface Finish |
Immersion gold |
Solder Mask Apply To: |
TOP, 12micron Minimum |
Solder Mask Color: |
Green, PSR-2000GT600D, Taiyo Supplied. |
Solder Mask Type: |
LPSM |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
TOP |
Colour of Component Legend |
White, IJR-4000 MW300, Taiyo brand |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
Plated through hole(PTH), minimum size 0.4mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Data Sheet of RF-35TC |
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RF-35TC TYPICAL VALUES |
Property |
Test Method |
Unit |
Value |
Unit |
Value |
DK @10 GHz |
IPC-650 2.5.5.5.1(modified) |
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3.5 |
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3.5 |
Tck(-30 to 120℃) |
IPC-650 2.5.5.5.1(modified) |
ppm |
24 |
ppm |
24 |
Df @10 GHz |
IPC-650 2.5.5.5.1(modified) |
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0.0011 |
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0.0011 |
Dielectric Breakdown |
IPC-650 2.5.6(in-Plane,Two Pins in Oil) |
kV |
56.7 |
kV |
56.7 |
Dielectric Strength |
ASTM D 149(Through Plane) |
V/mil |
570 |
V/mm |
22,441 |
Arc Resistance |
IPC-650 2.5.1 |
Seconds |
304 |
Seconds |
304 |
Moisture Absorption |
IPC-650 2.6.2.1 |
% |
0.05 |
% |
0.05 |
Flexural Strength(MD) |
ASTM D 790/IPC-650 2.4.4 |
psi |
12,900 |
N/mm2 |
88.94 |
Flexural Strength(CD) |
ASTM D 790/IPC-650 2.4.4 |
psi |
11,700 |
N/mm2 |
80.67 |
Tensile Strength(MD) |
ASTM D 3039/IPC-TM-650 2.4.19 |
psi |
9,020 |
N/mm2 |
62.19 |
Tensile Strength(CD) |
ASTM D 3039/IPC-TM-650 2.4.19 |
psi |
7,740 |
N/mm2 |
53.37 |
Elongation at Break(MD) |
ASTM D 3039/IPC-TM-650 2.4.19 |
% |
1.89 |
N/mm |
1.89 |
Elongation at Break(CD) |
ASTM D 3039/IPC-TM-650 2.4.19 |
% |
1.7 |
% |
1.7 |
Young's Modulus(MD) |
ASTM D 3039/IPC-TM-650 2.4.19 |
psi |
667,000 |
N/mm2 |
4,599 |
Young's Modulus(CD) |
ASTM D 3039/IPC-TM-650 2.4.19 |
psi |
637,000 |
N/mm2 |
4,392 |
Poisson's Ratio(MD) |
ASTM D 3039/IPC-TM-650 2.4.19 |
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0.18 |
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0.18 |
Poisson's Ratio(CD) |
ASTM D 3039/IPC-TM-650 2.4.19 |
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0.23 |
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0.18 |
Compressive Modulus |
ASTM D 695(23℃) |
psi |
560,000 |
N/mm2 |
3,861 |
Flexural Strength(MD) |
ASTM D 790/IPC-650 2.4.4 |
psi |
1.46 x 106 |
N/mm2 |
10,309 |
Flexural Strength(CD) |
ASTM D 790/IPC-650 2.4.4 |
psi |
1.50 x 106 |
N/mm2 |
10,076 |
Peel Stength(½ oz.CVH) |
IPC-650 2.4.8(Thermal Stress.) |
Ibs./inch |
7 |
g/cm3 |
1.25 |
Thermal Conductivity(Unclad,125℃) |
ASTM F433(Guarded Heat Flow) |
W/(mK) |
0.6 |
W/(mK) |
0.6 |
Thermal Conductivity(C1/C1,125℃) |
ASTM F433(Guarded Heat Flow) |
W/(mK) |
0.92 |
W/(mK) |
0.92 |
Thermal Conductivity(CH/CH,125℃) |
ASTM F433(Guarded Heat Flow) |
W/(mK) |
0.87 |
W/(mK) |
0.87 |
Dimensional Stability(MD) |
IPC-650-2.4.39 Sec.5.4(After Etch) |
mils/in. |
0.23 |
mm/M |
0.23 |
Dimensional Stability(CD) |
IPC-650-2.4.39 Sec.5.4(After Etch) |
mils/in. |
0.64 |
mm/M |
0.64 |
Dimensional Stability(MD) |
IPC-650-2.4.39 Sec.5.5(Thermal Stress.) |
mils/in. |
-0.04 |
mm/M |
-0.04 |
Dimensional Stability(CD) |
IPC-650-2.4.39 Sec.5.5(Thermal Stress.) |
mils/in. |
0.46 |
mm/M |
0.46 |
Surface Resistivity |
IPC-650 2.5.17.1(after elevated temp.) |
Mohms |
8.33 x 107 |
Mohms |
8.33 x 107 |
Surface Resistivity |
IPC-650 2.5.17.1(after humidity) |
Mohms |
6.42 x 107 |
Mohms |
6.42 x 107 |
Volume Resistivity |
IPC-650 2.5.17.1(after elevated temp.) |
Mohms/cm |
5.19 x 108 |
Mohms/cm |
5.19 x 108 |
Volume Resistivity |
IPC-650 2.5.17.1(after humidity) |
Mohms/cm |
2.91 x 108 |
Mohms/cm |
2.91 x 108 |
CTE(X axis)(25-260℃) |
IPC-650 2.4.41/ASTM D 3386 |
ppm/℃ |
11 |
ppm/℃ |
11 |
CTE(Y axis)(25-260℃) |
IPC-650 2.4.41/ASTM D 3386 |
ppm/℃ |
13 |
ppm/℃ |
13 |
CTE(Z axis)(25-260℃) |
IPC-650 2.4.41/ASTM D 3386 |
ppm/℃ |
34 |
ppm/℃ |
34 |
Density |
ASTM D 792 |
g/cm3 |
2.35 |
g/cm3 |
2.35 |
Hardness |
ASTM D 2240(Shore D) |
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79.1 |
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79.1 |
Strain at Break(MD) |
ASTM D 790/IPC-650 2.4.4 |
% |
0.014 |
% |
0.014 |
Strain at Break(CD) |
ASTM D 790/IPC-650 2.4.4 |
% |
0.013 |
% |
0.013 |
Specific Heat |
ASTM E 1269-05,E 967-08,E968-02 |
j/(g℃) |
0.94 |
j/(g℃) |
0.94 |
Td(2% Weight Loss) |
IPC-650 2.4.24.6/TGA |
oF |
788 |
℃ |
420 |
Td(5% Weight Loss) |
IPC-650 2.4.24.6/TGA |
oF |
817 |
℃ |
436 |
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Taconic RF-35TC Substrate |
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