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10mil 0.254mm Rogers RT/Duroid 5870 High Frequency PCB for Commercial Aireline Broadband Antennas  

(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

 
   

Rogers RT/duroid 5870 is a high-frequency material composed of glass microfiber reinforced PTFE composites, specifically designed for demanding stripline and microstrip circuit applications. Its exceptional dielectric constant uniformity is achieved through randomly oriented microfibers, ensuring consistent dielectric properties across different panels and over a wide frequency range. The low dissipation factor allows RT/duroid 5870 to be effective in Ku-band applications and beyond.

This material is easily cut, sheared, and machined to various shapes, and it is resistant to all solvents and reagents, both hot and cold, commonly used in etching printed circuits and plating edges and holes.

Typical applications include commercial airline broadband antennas, microstrip and stripline circuits, millimeter wave systems, military radar systems, missile guidance systems, and point-to-point digital radio antennas.

 
   
 
   
PCB Specifications  

 

RT/Duroid 5870 10mil 0.254mm High Frequency PCB for Commercial Aireline Broadband Antennas

 

 

PCB SIZE

100 x 68mm=1up

BOARD TYPE

Double sided PCB

Number of Layers

2 layers

Surface Mount Components

YES

Through Hole Components

NO

LAYER STACKUP

copper ------- 35um(1 oz)+plate TOP layer

RT/duroid 5870 0.254mm

copper ------- 35um(1oz) + plate  BOT Layer

TECHNOLOGY

 

Minimum Trace and Space:

8.8 mil / 10.5mil

Minimum / Maximum Holes:

no

Number of Different Holes:

no

Number of Drill Holes:

no

Number of Milled Slots:

0

Number of Internal Cutouts:

0

Impedance Control:

no

Number of Gold finger:

0

BOARD MATERIAL

 

Glass Epoxy:

RT/duroid 5870 0.254mm

Final foil external:

1oz

Final foil internal:

N/A

Final height of PCB:

0.3 mm ±0.1

PLATING AND COATING

 

Surface Finish

OSP

Solder Mask Apply To:

N/A

Solder Mask Color:

N/A

Solder Mask Type:

N/A

CONTOUR/CUTTING

Routing

MARKING

 

Side of Component Legend

N/A

Colour of Component Legend

N/A

Manufacturer Name or Logo:

N/A

VIA

NO

FLAMIBILITY RATING

UL 94-V0 Approval MIN.

DIMENSION TOLERANCE

 

Outline dimension:  

0.0059"

Board plating:

0.0029"

Drill tolerance:

0.002"

TEST

100% Electrical Test prior shipment

TYPE OF ARTWORK TO BE SUPPLIED

email file, Gerber RS-274-X, PCBDOC etc

SERVICE AREA

Worldwide, Globally.

 

 
Data Sheet of Rogers RT/duroid 5870

RT/duroid 5870 Typical Value

Property

RT/duroid 5870

Direction

Units

Condition

Test Method

Dielectric Constant,εProcess

2.33
2.33±0.02 spec.

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Dielectric Constant,εDesign

2.33

Z

N/A

8GHz to 40 GHz

Differential Phase Length Method

Dissipation Factor,tanδ

0.0005
0.0012

Z

N/A

C24/23/50
C24/23/50

1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5

Thermal Coefficient of ε

-115

Z

ppm/

-50to 150

IPC-TM-650 2.5.5.5

Volume Resistivity

2 x 107

Z

Mohm cm

C/96/35/90

ASTM D 257

Surface Resistivity

3 x 107

Z

Mohm

C/96/35/90

ASTM D 257

Specific Heat

0.96(0.23)

N/A

j/g/k
(cal/g/c)

N/A

Calculated

Tensile Modulus

Test at 23

Test at 100

N/A

MPa(kpsi)

A

ASTM D 638

 

1300(189)

490(71)

X

 

 

 

 

1280(185)

430(63)

Y

 

 

 

Ultimate Stress

50(7.3)

34(4.8)

X

 

 

 

 

42(6.1)

34(4.8)

Y

 

 

 

Ultimate Strain

9.8

8.7

X

%

 

 

 

9.8

8.6

Y

 

 

 

Compressive Modulus

1210(176)

680(99

X

MPa(kpsi)

A

ASTM D 695

 

1360(198)

860(125)

Y

 

 

 

 

803(120)

520(76)

Z

 

 

 

Ultimate Stress

30(4.4)

23(3.4

X

 

 

 

 

37(5.3)

25(3.7)

Y

 

 

 

 

54(7.8)

37(5.3)

Z

 

 

 

Ultimate Strain

4

4.3

X

%

 

 

 

3.3

3.3

Y

 

 

 

 

8.7

8.5

Z

 

 

 

Moisture Absorption

0.02

N/A

%

0.62"(1.6mm) D48/50

ASTM D 570

Thermal Conductivity

0.22

Z

W/m/k

80

ASTM C 518

Coefficient of Thermal Expansion

22
28
173

X
Y
Z

ppm/

0-100

IPC-TM-650 2.4.41

Td

500

N/A

 TGA

N/A

ASTM D 3850

Density

2.2

N/A

gm/cm3

N/A

ASTM D 792

Copper Peel

27.2(4.8)

N/A

Pli(N/mm)

1oz(35mm)EDC foil
after solder float

IPC-TM-650 2.4.8

Flammability

V-0

N/A

N/A

N/A

UL 94

Lead-free Process Compatible

Yes

N/A

N/A

N/A

N/A

 
   
   
   

 

 
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Rogers RT/duroid 5870Price 10 mil RT/duroid 5870

 

 

 

 

 
   
 
                                     
       
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