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10.7mil RO4350B LoPro High-Frequency PCB Rogers Reverse-Treated Foil Circuit Board With Low Loss  

(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

 
   

RO4350B LoProPCBs leverage a patented Rogers' technology. This technology enables the reverse - treated foil to form a bond with the standard RO4350B dielectric. The end result is a laminate featuring low conductor loss, which enhances insertion loss performance and signal integrity. At the same time, it preserves all the other favorable characteristics of the standard RO4350B PCB system.

 
 
   
Features and Benefits:  

RO4350B materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

1. Lower insertion loss

2. Low PIM

3. Increased signal integrity

4. High circuit density

 

Low Z-axis coefficient of thermal expansion

1. Multi-layer board capability

2. Design flexibility

 

Lead-free process compatible

1. High temperature processing

2. Meets environmental concerns

 

CAF resistant

 
   
 
   
PCB Capability(RO4350B LoPro)  

Our PCB Capability (RO4350B LoPro)

PCB Material:

Hydrocarbon Ceramic Laminates

Designation:

RO4350B LoPro

Dielectric constant:

3.48±0.05

Layer count:

Double Layer, Multilayer, Hybrid PCB

Copper weight:

0.5oz (17 µm), 1oz (35µm), 2oz (70µm)

PCB thickness:

10.7mil (0.272mm), 14mil (0.356mm), 17.3mil (0.439mm), 20.7mil(0.526mm), 30.7mil (0.780mm), 60.7mil(1.542mm)

PCB size:

≤400mm X 500mm

Solder mask:

Green, Black, Blue, Yellow, Red etc.

Surface finish:

Bare copper, HASL, ENIG, OSP, Immersion tin etc..

 
   
Typical applications:  

1.Digital applications such as servers, routers, and high speed back planes

2.Cellular base station antennas and power amplifiers

3.LNB’s for direct broadcast satellites

4.RF Identification Tags

 
 
Typical Properties of RO4350B LoPro

Typical Properties of RO4350B LoPro

Property

Typical Value

Direction

Units

Condition

Test Method

Dielectric Constant, Process

3.48 ± 0.05

z

--

10 GHz/23°C

IPC-TM-650                 2.5.5.5            Clamped Stripline

Dielectric Constant, Design

3.55

z

--

8 to 40 GHz

Differential Phase Length Method

Dissipation Factor tan, d

0.0037    0.0031

z

--

10 GHz/23°C 2.5 GHz/23°C

IPC-TM-650     2.5.5.5

Thermal Coeffifi cient of er

50

z

ppm/°C

-50°C to 150°C

IPC-TM-650 2.5.5.5

Volume Resistivity

1.2 X 1010

 

MΩ•cm

COND A

IPC-TM-650 2.5.17.1

Surface Resistivity

5.7 X 109

 

COND A

IPC-TM-650 2.5.17.1

Electrical Strength

31.2(780)

z

KV/mm(V/mil)

0.51mm(0.020”)

IPC-TM-650 2.5.6.2

Tensile Modulus

11473(1664)

Y

MPa(kpsi)

RT

ASTM D638

Tensile Strength

175(25.4)

Y

MPa(kpsi)

RT

ASTM D638

Flexural Strength

255(37)

 

MPa(kpsi)

 

IPC-TM-650 2.4.4

Dimensional Stability

<0.5

X,Y

mm/m(mils/inch)

after etch +E2/150°C

IPC-TM-650 2.4.39A

Coeffifi cient of Thermal Expansion

14

x

ppm/°C

-55 to 288°C

IPC-TM-650 2.1.41

 

16

y

 

 

 

 

35

z

 

 

 

Tg

>280

 

°C TMA

A

IPC-TM-650 2.4.24.3

Td

390

 

°C TGA

 

ASTM D3850

Thermal Conductivity

0.62

 

W/m/°K

80°C

ASTM C518

Moisture Absorption

0.06

 

%

48 hrs immersion 0.060” sample Temperature 50°C

ASTM D570

Density

1.86

 

gm/cm3

23°C

ASTM D792

Copper Peel Strength

0.88(5.0)

 

N/mm(pli)

after solder float 1 oz. TC Foil

IPC-TM-650 2.4.8

Flammability

V-0

 

 

 

UL 94

Lead-Free Process Compatible

Yes

 

 

 

 
   
   
   
Hot Tags:

RO4350B LoPro PCB

RO4350B High Frequency PCB

Rogers RO4350B RFT Foil PCB

RO4350B PCB Immersion Gold

2-Layer Rogers RO4350B PCB

 

 

 

 

 
   
 
                                     
       
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