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1.5mm F4BTM350 PTFE High Frequency PCB Board with 3oz Copper and Immersion Silver |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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PCB Specifications Overview
This 2 layers printed circuit board is fabricated on F4BTM350 high-frequency substrates. It features a relatively small size of 67mm x 85mm and is equipped with top surface mount components. The layer stack configuration combines 3oz thick copper layers and F4BTM350 dielectric material, endowing the PCB with outstanding electrical conductivity and efficient thermal management capabilities. To improve solderability and offer surface protection, the PCB is finished with immersion silver plating. Additionally, a green solder mask is applied to the top side, not only enhancing its visual appearance but also ensuring durability. The following presents the comprehensive and detailed specifications of this particular PCB design: |
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F4BTM350 High Frequency PCB Board 1.5mm PTFE Plate with 3oz Copper and Immersion Silver |
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PCB SIZE |
67mm x 85 mm =1up |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 105 um(2 oz+plate) TOP layer |
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F4BTM350 - 1.524mm |
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copper ------- 105 um(2 oz + plate) BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
7.9 mil / 5.9 mil |
Minimum / Maximum Holes: |
0.4 mm / 0.4 mm |
Number of Different Holes: |
1 |
Number of Drill Holes: |
1 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
F4BTM350 DK3.5 |
Final foil external: |
3 oz |
Final foil internal: |
N/A |
Final height of PCB: |
1.6 mm |
PLATING AND COATING |
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Surface Finish |
Immersion Silver |
Solder Mask Apply To: |
Top side |
Solder Mask Color: |
Green |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
N/A |
Colour of Component Legend |
N/A |
Manufacturer Name or Logo: |
N/A |
VIA |
Plated through hole(PTH), minimum size 0.4mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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F4BTM High Frequency Laminates
The F4BTM series high-frequency materials are made up of glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene resin. They are produced via scientific formulation and strict pressing processes. These products are based on the F4BM dielectric layer and incorporate high-dielectric, low-loss nanoscale ceramics. This leads to a higher dielectric constant, better heat resistance, a lower thermal expansion coefficient, increased insulation resistance, and improved thermal conductivity, while still maintaining the low-loss features. |
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F4BTM Features
DK 2.98-3.5 optional
Adding ceramic improves performance
Excellent PIM indicators
Rich thickness ranging 0.254mm to 12mm
Diversified size 460mm x 610mm to 914mm x 1220mm
Cost saving
Commercialization for mass production
High cost performance
Anti radiation
Low exhaust |
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Optional copper foil
ED copper of 0.5oz, 1oz, 1.5oz, 2oz |
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Data Sheets (F4BTM) |
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Product Technical Parameters |
Product Models & Data Sheet |
Product Features |
Test Conditions |
Unit |
F4BTM298 |
F4BTM300 |
F4BTM320 |
F4BTM350 |
Dielectric Constant (Typical) |
10GHz |
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2.98 |
3.0 |
3.2 |
3.5 |
Dielectric Constant Tolerance |
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±0.06 |
±0.06 |
±0.06 |
±0.07 |
Loss Tangent (Typical) |
10GHz |
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0.0018 |
0.0018 |
0.0020 |
0.0025 |
20GHz |
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0.0023 |
0.0023 |
0.0026 |
0.0035 |
Dielectric Constant Temperature Coefficient |
-55 º~150ºC |
PPM/℃ |
-78 |
-75 |
-75 |
-60 |
Peel Strength |
1 OZ F4BTM |
N/mm |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
1 OZ F4BTME |
N/mm |
>1.4 |
>1.4 |
>1.4 |
>1.4 |
Volume Resistivity |
Standard Condition |
MΩ.cm |
≥1×10^7 |
≥1×10^7 |
≥1×10^7 |
≥1×10^7 |
Surface Resistivity |
Standard Condition |
MΩ |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
Electrical Strength (Z direction) |
5KW，500V/s |
KV/mm |
>26 |
>30 |
>32 |
>32 |
Breakdown Voltage (XY direction) |
5KW，500V/s |
KV |
>34 |
>35 |
>40 |
>40 |
Coefficientof Thermal Expansion |
XY direction |
-55 º~288ºC |
ppm/ºC |
15，16 |
15，16 |
13，15 |
10，12 |
Z direction |
-55 º~288ºC |
ppm/ºC |
78 |
72 |
58 |
51 |
Thermal Stress |
260℃, 10s，3 times |
No delamination |
No delamination |
No delamination |
No delamination |
Water Absorption |
20±2℃, 24 hours |
% |
≤0.05 |
≤0.05 |
≤0.05 |
≤0.05 |
Density |
Room Temperature |
g/cm3 |
2.25 |
2.25 |
2.20 |
2.20 |
Long-Term Operating Temperature |
High-Low Temperature Chamber |
℃ |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
Thermal Conductivity |
Z direction |
W/(M.K) |
0.42 |
0.42 |
0.50 |
0.54 |
PIM |
Only applicable to F4BTME |
dBc |
≤-160 |
≤-160 |
≤-160 |
≤-160 |
Flammability |
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UL-94 |
V-0 |
V-0 |
V-0 |
V-0 |
Material Composition |
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PTFE, Fiberglass Cloth, nano-ceramics
F4BTM paired with ED copper foil, F4BTME paired with reverse-treated (RTF) copper foil. |
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Hot Tags:
F4BTM Series Laminates |
Wangling F4BTM350 Substrate |
1.5mm F4BTM350 High Frequency PCB |
2-Layer Low Dissipation PCB |
PTFE Plate F4BTM350 PCB |
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