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1.0mm-F4BTME320-High-Frequency-Circuit-Board-2oz-Copper-Immersion-Gold-Offering-Enhanced-Durability-and-Aesthetics |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Brief Introduction |
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This is a 2-layer high-frequency printed circuit board (PCB) constructed using Wangling F4BTME320 substrates. Both the top and bottom layers are built with 70 µm (2 oz) copper, starting from a base of 1 oz plating. The design supports surface mount components exclusively on the top side, with no through-hole components incorporated.
Key technical specifications include a minimum trace width of 4 mil and a minimum spacing of 6 mil, enabling high-precision circuit layout. The surface finish is immersion gold, which improves solderability and offers superior corrosion resistance. A black solder mask is applied to the top layer, providing durability, an attractive appearance, and protection against environmental factors for the underlying circuitry.
Detailed specifications are summarized in the table below. |
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F4BTME320 High Frequency PCB 2oz Copper 1.0mm Thick With Immersion Gold |
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PCB SIZE |
70 x 70mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 70 um(1 oz+plate) TOP layer |
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F4BTME320 - 1.0mm |
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copper ------- 70um(1 oz + plate) BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
4 mil / 6 mil |
Minimum / Maximum Holes: |
0.4 mm / 1.2 mm |
Number of Different Holes: |
7 |
Number of Drill Holes: |
92 |
Number of Milled Slots: |
2 |
Number of Internal Cutouts: |
1 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
F4BTME320 Dk3.2 |
Final foil external: |
2 oz |
Final foil internal: |
N/A |
Final height of PCB: |
1.1 mm ±10% |
PLATING AND COATING |
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Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
Top, Black |
Solder Mask Color: |
no |
Solder Mask Type: |
no |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
Top |
Colour of Component Legend |
White |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
Plated through hole(PTH), minimum size 0.4mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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F4BTME High Frequency Laminates |
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F4BTME high-frequency laminates are manufactured through a scientific preparation process and precise pressing, utilizing a combination of glass fiber cloth, nano-ceramic fillers, and polytetrafluoroethylene resin.
This product series is built on the F4BM dielectric layer, enhanced with high-dielectric, low-loss nanoscale ceramics. These additions result in a higher dielectric constant, improved heat resistance, a lower coefficient of thermal expansion, increased insulation resistance, and better thermal conductivity, all while maintaining the material's low-loss characteristics.
F4BTME laminates are clad with reverse-treated copper foil (RTF), which offers an excellent PIM index, more precise line control, and reduced conductor loss. The copper foil is available in optional thicknesses of 0.5 oz and 1 oz to suit various design requirements. |
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Data Sheet (F4BTME) |
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Product Technical Parameters |
Product Model & Data Sheet |
Product Features |
Test Conditions |
Unit |
F4BME217 |
F4BME220 |
F4BME233 |
F4BME245 |
F4BME255 |
F4BME265 |
F4BME275 |
F4BME294 |
F4BME300 |
Dielectric Constant (Typical) |
10GHz |
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2.17 |
2.2 |
2.33 |
2.45 |
2.55 |
2.65 |
2.75 |
2.94 |
3.0 |
Dielectric Constant Tolerance |
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±0.04 |
±0.04 |
±0.04 |
±0.05 |
±0.05 |
±0.05 |
±0.05 |
±0.06 |
±0.06 |
Loss Tangent (Typical) |
10GHz |
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0.001 |
0.001 |
0.0011 |
0.0012 |
0.0013 |
0.0013 |
0.0015 |
0.0016 |
0.0017 |
20GHz |
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0.0014 |
0.0014 |
0.0015 |
0.0017 |
0.0018 |
0.0019 |
0.0021 |
0.0023 |
0.0025 |
Dielectric Constant Temperature Coefficient |
-55ºC～150ºC |
PPM/℃ |
-150 |
-142 |
-130 |
-120 |
-110 |
-100 |
-92 |
-85 |
-80 |
Peel Strength |
1 OZ F4BM |
N/mm |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
>1.8 |
1 OZ F4BME |
N/mm |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
>1.6 |
Volume Resistivity |
Standard Condition |
MΩ.cm |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
≥6×10^6 |
Surface Resistivity |
Standard Condition |
MΩ |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
≥1×10^6 |
Electrical Strength (Z direction) |
5KW，500V/s |
KV/mm |
>23 |
>23 |
>23 |
>25 |
>25 |
>25 |
>28 |
>30 |
>30 |
Breakdown Voltage (XY direction) |
5KW，500V/s |
KV |
>30 |
>30 |
>32 |
>32 |
>34 |
>34 |
>35 |
>36 |
>36 |
Coefficientof Thermal Expansion |
XY direction |
-55 º~288ºC |
ppm/ºC |
25, 34 |
25, 34 |
22, 30 |
20, 25 |
16, 21 |
14, 17 |
14, 16 |
12, 15 |
12, 15 |
Z direction |
-55 º~288ºC |
ppm/ºC |
240 |
240 |
205 |
187 |
173 |
142 |
112 |
98 |
95 |
Thermal Stress |
260℃, 10s，3 times |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
No delamination |
Water Absorption |
20±2℃, 24 hours |
% |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
≤0.08 |
Density |
Room Temperature |
g/cm3 |
2.17 |
2.18 |
2.20 |
2.22 |
2.25 |
2.25 |
2.28 |
2.29 |
2.29 |
Long-Term Operating Temperature |
High-Low Temperature Chamber |
℃ |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
Thermal Conductivity |
Z direction |
W/(M.K) |
0.24 |
0.24 |
0.28 |
0.30 |
0.33 |
0.36 |
0.38 |
0.41 |
0.42 |
PIM |
Only applicable to F4BME |
dBc |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
≤-159 |
Flammability |
/ |
UL-94 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
Material Composition |
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PTFE, Fiberglass Cloth
F4BM paired with ED copper foil, F4BME paired with reverse-treated (RTF) copper foil. |
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Our PCB Capability (F4BTME) |
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PCB Capability (F4BTME) |
PCB Material: |
PTFE / glass fiber cloth / Nano-ceramic filler |
Designation (F4BTME ) |
F4BTM |
DK (10GHz) |
DF (10 GHz) |
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F4BTME298 |
2.98±0.06 |
0.0018 |
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F4BTME300 |
3.0±0.06 |
0.0018 |
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F4BTME320 |
3.2±0.06 |
0.0020 |
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F4BTME350 |
3.5±0.07 |
0.0025 |
Layer count: |
Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Dielectric thickness (or overall thickness) |
0.25mm, 0.508mm, 0.762mm, 0.8mm, 1.0mm, 1.016mm, 1.27mm, 1.524mm, 2.0mm, 3.0mm, 4.0mm, 5.0mm, 6.0mm, 8.0mm, 10.0mm, 12.0mm |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. |
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Hot Tags:
F4BTME320 High-Frequency PCB |
Wangling F4BTME Datasheet |
F4BTME320 2oz Copper |
F4BTME320 Immersion-Gold PCB |
2-layer F4BTME320 Laminate |
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