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1.0mm-4-Layer-Mixed-Hybrid-PCB-with-High-Quality-4mil-Rogers-RO4350B-and-0.3mm-High-Tg-FR-4  
   
(As PCBs are custom - produced goods, the picture and parameters shown are only intended for reference.)  
   

Hello, everyone!

 

Today, we'll be discussing a 4-layer high-frequency PCB that combines 4mil RO4350B and FR-4 materials. The 4-layer configuration of this PCB was chosen for its simplicity and cost-effectiveness, which is crucial for entering new markets.

 

Now, let's start by examining the initial build-up process.

 
   

 
   

Between the first and second layers, as well as the third and fourth layers, we use the Rogers core, specifically 4mil (0.102mm) RO4350B. This core has a fixed thickness, which plays a crucial role in determining the electrical length of the RF lines on the circuit board. Sandwiched in the middle is the FR - 4 epoxy glass dielectric material. It serves to bond the cores on both the top and bottom sides. The inner layer of the PCB has a copper weight of 0.5 ounces, while the outer layer has a copper weight of 1 ounce.

 
 

Now, let's delve into the detailed specifications of this board:

Base material: RO4350B 0.102mm + Tg 170℃ FR4 0.30mm

Layer count: 4 layers

Panel: 55mm x 132mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 um/ Inner layer 18 um

Solder mask / Legend: green / white

Final PCB height: 1.0 mm

Special technology: via in pad (hole filled) under BGA

Standard: IPC 6012 Class 2

Packing: 25 panels are packed for shipment.

Lead time: 12 working days

Shelf life: 6 months

 
 
This 4-layer high-frequency PCB combines 4mil RO4350B and FR-4 materials, offering a simple and cost-effective solution ideal for entering new markets. The RO4350B hybrid PCB is widely used in applications such as preamplifiers, radar sensors, digital transmitters, and splitter modules; GPS antennas, communication relays, analog transmitters, and 4G antennas; as well as RF transmitters, WiFi amplifiers, RFID systems, and attenuators.
 
The advantages of RO4350B hybrid PCBs:  

1. Stable Dielectric Constant:

RO4350B maintains a consistent dielectric constant across a wide frequency range, making it an excellent choice for broadband applications.

 

2. Enhanced Signal Integrity:

It outperforms stack-ups using only FR4 materials, ensuring superior signal performance.

 

3. Cost Efficiency:

By combining RO4350B with other materials, it offers a more cost-effective solution compared to all low-loss material stack-ups.

 

4.Reduced High-Frequency Signal Loss:

It minimizes signal loss at high frequencies, ensuring reliable performance in demanding applications.

 

5. Expert Manufacturing Support:

Leverage our robust capabilities, from prototyping to mass production, backed by IATF 16949 (2016), ISO14001 (2015), ISO9001 (2015), and UL certifications, guaranteeing top-tier quality for your PCBs.

 
   

That concludes today’s update. Thank you for your time, and feel free to reach out to us for any RF PCB inquiries—we’re here to assist!

 
   

Appendix: Our PCB Capability 2022

 

 

Parameter

Value

 Layer Counts 

1-32

 Substrate Material

 RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.

 Maximum Size

 Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm

 Board Outline Tolerance

 ±0.0059" (0.15mm)

 PCB Thickness

0.0157" - 0.3937" (0.40mm--10.00mm)

Thickness Tolerance(T≥0.8mm)

 ±8%

Thickness Tolerance(t0.8mm)

 ±10%

 Insulation Layer Thickness

0.00295" - 0.1969" (0.075mm--5.00mm)

 Minimum Track

0.003" (0.075mm)

 Minimum Space

 0.003" (0.075mm)

 Outer Copper Thickness

 35µm--420µm (1oz-12oz)

 Inner Copper Thickness

 17µm--350µm (0.5oz - 10oz)

 Drill Hole(Mechanical)

0.0059" - 0.25" (0.15mm--6.35mm)

 Finished Hole(Mechanical)

0.0039"-0.248" (0.10mm--6.30mm)

DiameterTolerance(Mechanical)

0.00295" (0.075mm)

 Registration (Mechanical)

0.00197" (0.05mm)

 Aspect Ratio

 12:1

 Solder Mask Type

 LPI

 Min Soldermask Bridge

0.00315" (0.08mm)

 Min Soldermask Clearance

0.00197" (0.05mm)

 Plug via Diameter

0.0098" - 0.0236" (0.25mm--0.60mm)

Impedance Control Tolerance

 ±10%

 Surface Finish

HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc.

 

 

 

 

 
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