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0.8mm F4BTMS265 High-Frequency PCB 1oz Copper Immersion Gold Black Solder Mask for Satellite Communications from Wangling |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Brief Introduction |
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Wangling F4BTMS265 PCB features a 2-layer copper design and is exclusively equipped with surface mount components. The board dimensions are 120mm x 65mm, with 1 piece per panel. It begins with a 17μm (0.5 oz) copper base, which is plated on both the top and bottom layers. The core material, F4BTMS265, has a thickness of 0.762mm and is positioned centrally. The surface finish is immersion gold, and the top layer is coated with a black solder mask. |
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Basic specifications |
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F4BTMS265 High Frequency PCB 0.8mm Substrates 1oz Copper With Immersion Gold and Black Solder Mask |
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PCB SIZE |
120 x 65mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 17um(0.5 oz)+plate TOP layer |
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F4BTMS265 -0.762mm |
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copper ------- 17um(0.5 oz) + plate BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
5 mil / 5 mil |
Minimum / Maximum Holes: |
0.35 mm / 0.6 mm |
Number of Different Holes: |
6 |
Number of Drill Holes: |
81 |
Number of Milled Slots: |
1 |
Number of Internal Cutouts: |
1 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
F4BTMS265 Dk2.65 |
Final foil external: |
1oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.8 mm ±10% |
PLATING AND COATING |
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Surface Finish |
Immersion Gold |
Solder Mask Apply To: |
Top, Black |
Solder Mask Color: |
no |
Solder Mask Type: |
no |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
Top |
Colour of Component Legend |
NO |
Manufacturer Name or Logo: |
Marked on the board in a conductor and leged FREE AREA |
VIA |
Plated through hole(PTH), minimum size 0.35mm. |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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F4BTMS High Frequency Material |
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The F4BTMS series represents an enhanced iteration of the F4BTM series, incorporating substantial technological improvements in both material composition and production techniques. This advanced material integrates a high ceramic content and employs ultra-thin, ultra-fine fiberglass cloth reinforcement, significantly boosting its overall performance. These upgrades have expanded the range of dielectric constants, making it a highly reliable material ideal for aerospace applications and a viable alternative to comparable international products.
By blending a modest amount of ultra-thin, ultra-fine fiberglass cloth reinforcement with a well-distributed mix of specialized nanoceramics and polytetrafluoroethylene resin, the material minimizes the fiberglass effect during electromagnetic wave propagation. This reduction in dielectric loss enhances dimensional stability while decreasing anisotropy across the X/Y/Z axes. As a result, the material supports higher frequency applications, increased electrical strength, and improved thermal conductivity. Additionally, it features a low coefficient of thermal expansion and stable dielectric properties across varying temperatures.
The F4BTMS series is equipped with RTF low-roughness copper foil as standard, which not only reduces conductor loss but also ensures exceptional peel strength. It is compatible with both copper-based and aluminum-based configurations, offering versatility and superior performance. |
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Typical Applications |
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Aerospace equipment, space, cabin equipment
Microwave, Radio frequency
Radar, military radar
Feed network
Phase-sensitive antenna, phased array antenna
Satellite communications. |
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Our PCB Capability (F4BTMS) |
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PCB Capability (F4BTMS) |
PCB Material: |
PTFE，Ultra-thin and ultra-fine fiberglass, ceramics. |
Designation (F4BTMS ) |
F4BTMS |
DK (10GHz) |
DF (10 GHz) |
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F4BTMS220 |
2.2±0.02 |
0.0009 |
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F4BTMS233 |
2.33±0.03 |
0.0010 |
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F4BTMS255 |
2.55±0.04 |
0.0012 |
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F4BTMS265 |
2.65±0.04 |
0.0012 |
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F4BTMS294 |
2.94±0.04 |
0.0012 |
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F4BTMS300 |
3.0±0.04 |
0.0013 |
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F4BTMS350 |
3.5±0.05 |
0.0016 |
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F4BTMS430 |
4.3±0.09 |
0.0015 |
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F4BTMS450 |
4.5±0.09 |
0.0015 |
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F4BTMS615 |
6.15±0.12 |
0.0020 |
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F4BTMS1000 |
10.2±0.2 |
0.0020 |
Layer count: |
Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB |
Copper weight: |
0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
Dielectric thickness |
0.09mm (3.5mil), 0.127mm (5mil), 0.254mm(10mil),0.508mm(20mil), 0.635mm(25mil), 0.762mm(30mil), 0.787mm(31mil), 1.016mm(40mil), 1.27mm(50mil), 1.5mm(59mil), 1.524mm(60mil), 1.575mm(62mil), 2.03mm(80mil), 2.54mm(100mil), 3.175mm(125mil), 4.6mm(160mil), 5.08mm(200mil), 6.35mm(250mil) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc.. |
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Data Sheet (F4BTMS) |
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Product Technical Parameters |
Product Models & Data Sheet |
Product Features |
Test Conditions |
Unit |
F4BTMS220 |
F4BTMS233 |
F4BTMS255 |
F4BTMS265 |
F4BTMS294 |
F4BTMS300 |
F4BTMS350 |
F4BTMS430 |
F4BTMS450 |
F4BTMS615 |
F4BTMS1000 |
Dielectric Constant (Typical) |
10GHz |
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2.2 |
2.33 |
2.55 |
2.65 |
2.94 |
3.00 |
3.50 |
4.30 |
4.50 |
6.15 |
10.20 |
Dielectric Constant Tolerance |
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±0.02 |
±0.03 |
±0.04 |
±0.04 |
±0.04 |
±0.04 |
±0.05 |
±0.09 |
±0.09 |
±0.12 |
±0.2 |
Dielectric Constant (Design) |
10GHz |
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2.2 |
2.33 |
2.55 |
2.65 |
2.94 |
3.0 |
3.50 |
4.3 |
4.5 |
6.15 |
10.2 |
Loss Tangent (Typical) |
10GHz |
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0.0009 |
0.0010 |
0.0012 |
0.0012 |
0.0012 |
0.0013 |
0.0016 |
0.0015 |
0.0015 |
0.0020 |
0.0020 |
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20GHz |
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0.0010 |
0.0011 |
0.0013 |
0.0014 |
0.0014 |
0.0015 |
0.0019 |
0.0019 |
0.0019 |
0.0023 |
0.0023 |
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40GHz |
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0.0013 |
0.0015 |
0.0016 |
0.0018 |
0.0018 |
0.0019 |
0.0024 |
0.0024 |
0.0024 |
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Dielectric Constant Temperature Coefficient |
-55 º~150ºC |
PPM/℃ |
-130 |
-122 |
-92 |
-88 |
-20 |
-20 |
-39 |
-60 |
-58 |
-96 |
-320 |
Peel Strength |
1 OZ RTF copper |
N/mm |
>2.4 |
>2.4 |
>1.8 |
>1.8 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
>1.2 |
Volume Resistivity |
Standard Condition |
MΩ.cm |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
Surface Resistivity |
Standard Condition |
MΩ |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
≥1×10^8 |
Electrical Strength (Z direction) |
5KW，500V/s |
KV/mm |
>26 |
>30 |
>32 |
>34 |
>40 |
>40 |
>42 |
>44 |
>45 |
>48 |
>23 |
Breakdown Voltage (XY direction) |
5KW，500V/s |
KV |
>35 |
>38 |
>40 |
>42 |
>48 |
>52 |
>55 |
>52 |
>54 |
>55 |
>42 |
Coefficientof Thermal Expansion (X, Y direction) |
-55 º~288ºC |
ppm/ºC |
40, 50 |
35, 40 |
15, 20 |
15, 20 |
10, 12 |
10, 11 |
10, 12 |
13, 12 |
12, 12 |
10, 12 |
16, 18 |
Coefficientof Thermal Expansion (Z direction) |
-55 º~288ºC |
ppm/ºC |
290 |
220 |
80 |
72 |
22 |
22 |
20 |
47 |
45 |
40 |
32 |
Thermal Stress |
260℃, 10s，3 times |
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No delamination
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Water Absorption |
20±2℃, 24 hours |
% |
0.02 |
0.02 |
0.025 |
0.025 |
0.02 |
0.025 |
0.03 |
0.08 |
0.08 |
0.1 |
0.03 |
Density |
Room Temperature |
g/cm3 |
2.18 |
2.22 |
2.26 |
2.26 |
2.25 |
2.28 |
2.3 |
2.51 |
2.53 |
2.75 |
3.2 |
Long-Term Operating Temperature |
High-Low Temperature Chamber |
℃ |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
-55～+260 |
Thermal Conductivity |
Z direction |
W/(M.K) |
0.26 |
0.28 |
0.31 |
0.36 |
0.58 |
0.58 |
0.6 |
0.63 |
0.64 |
0.67 |
0.81 |
Flammability |
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UL-94 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
V-0 |
Material Composition |
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PTFE，Ultra-thin and ultra-fine (quartz) fiberglass. |
PTFE，Ultra-thin and ultra-fine fiberglass, ceramics. |
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Hot Tags:
Wangling F4BTMS Datasheet |
0.8mm F4BTMS265 High Frequency PCB |
F4BTMS265 PCB Price |
F4BTMS265 Black Solder Mask |
2-layer F4BTMS265 Substrate |
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