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0.762mm 30mil Rogers RO3003 High Frequency Printed Circuit Board 2-Layer Rogers 3003 PCB with Low CTE |
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(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.) |
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Rogers RO3003 high-frequency circuit materials are crafted from ceramic-filled PTFE composites for use in commercial microwave and RF applications. They are engineered to deliver exceptional electrical and mechanical stability while remaining competitively priced. The reliable mechanical properties allow designers to create multi-layer board designs without issues of warpage or reliability. These materials have a coefficient of thermal expansion (CTE) of 17 ppm/°C in both the X and Y axes, which matches that of copper, ensuring excellent dimensional stability. The typical etch shrinkage after etching and baking is less than 0.5 mils per inch. With a Z-axis CTE of 24 ppm/°C, RO3003 maintains outstanding plated through-hole reliability, even in extreme environments. |
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Typical applications:
1) Automotive radar
2) Cellular telecommunications systems
3) Datalink on cable systems
4) Direct broadcast satellites
5) Global positioning satellite antennas
6) Patch antenna for wireless communications
7) Power amplifiers and antennas
8) Power backplanes
9) Remote meter readers |
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PCB Specifications |
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Rogers RO3003 30mil 0.762mm High Frequency PCB DK3.0 RF PCB for Cellular Telecommunications Systems |
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PCB SIZE |
81 x 45mm=1PCS |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 18um(0.5 oz)+plate TOP layer |
RO3003 0.762mm |
copper ------- 18um(0.5oz) + plate BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
5 mil / 5 mil |
Minimum / Maximum Holes: |
0.5mm / 2.0mm |
Number of Different Holes: |
1 |
Number of Drill Holes: |
1 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
RO3003 0.762mm |
Final foil external: |
1oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.8 mm ±0.1 |
PLATING AND COATING |
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Surface Finish |
Immersion gold (31%) |
Solder Mask Apply To: |
NO |
Solder Mask Color: |
N/A |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
Top Side |
Colour of Component Legend |
Black |
Manufacturer Name or Logo: |
Marked on the board in a conductor and legend FREE AREA |
VIA |
N/A |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Data Sheet of Rogers 3003 (RO3003) |
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RO3003 Typical Value |
Property |
RO3003 |
Direction |
Units |
Condition |
Test Method |
Electrical Properties |
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Dielectric Constant,εProcess |
3.0±0.04 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
3 |
Z |
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8GHz to 40 GHz |
Differential Phase Length Method |
Dissipation Factor,tanδ |
0.001 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
-3 |
Z |
ppm/℃ |
10 GHz -50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
107 |
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MΩ.cm |
COND A |
IPC 2.5.17.1 |
Surface Resistivity |
107 |
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MΩ |
COND A |
IPC 2.5.17.1 |
Thermal Properties |
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Td |
500 |
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℃ TGA |
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ASTM D 3850 |
Coefficient of Thermal Expansion
(-55 to 288℃) |
17
16
25 |
X
Y
Z |
ppm/℃ |
23℃/50% RH |
IPC-TM-650 2.4.4.1 |
Thermal Conductivity |
0.5 |
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W/M/K |
50℃ |
ASTM D 5470 |
Mechanical Properties |
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Copper Peel Stength |
12.7 |
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Ib/in. |
1oz,EDC After Solder Float |
IPC-TM 2.4.8 |
Young's Modulus |
930
823 |
X
Y |
MPa |
23℃ |
ASTM D 638 |
Dimensional Stability |
-0.06
0.07 |
X
Y |
mm/m |
COND A |
IPC-TM-650 2.2.4 |
Physical Properties |
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Flammability |
V-0 |
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UL 94 |
Moisture Absorption |
0.04 |
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% |
D48/50 |
IPC-TM-650 2.6.2.1 |
Density |
2.1 |
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gm/cm3 |
23℃ |
ASTM D 792 |
Specific Heat |
0.9 |
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j/g/k |
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Calculated |
Lead-free Process Compatible |
Yes |
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