0.508mm 20mil RT/Duroid 5880 Rogers High Frequency PCB

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0.508mm 20mil RT/Duroid 5880 Rogers High Frequency PCB for Radar Systems

(Printed Circuit Boards are custom-made products. The picture and parameters shown are for reference only.)

Unleash the power of high - frequency performance with Rogers RT/duroid 5880! This revolutionary glass microfiber reinforced PTFE composite is designed to redefine stripline and microstrip circuit applications. Its unique randomly oriented microfibers offer unrivaled dielectric constant uniformity. No matter the panel or frequency range, the dielectric constant remains rock - solid.

With a low dissipation factor that reaches the Ku - band and higher, RT/duroid 5880 is a cut above the rest. And the best part? It's a breeze to cut, shear, and machine, and it's impervious to all etching and plating solvents. From commercial airline broadband antennas to military - grade radar systems, RT/duroid 5880 is the material that makes it all possible.

General description

This is a double-sided RF PCB constructed with RT/duroid 5880, specifically designed for radar system applications.

PCB Specifications

Base material: RT/duroid 5880 20mil (0.508mm)

Dielectric constant: 2.20+/-0.02

Layer count: 2 layers

Type: Through holes

Format: 128mm x 62mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm

Solder mask | Legend: No | No

Final PCB height: 0.52 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 7 working days

Shelf life: 6 months

Applications

Commercial Airline Broadband Antennas, Microstrip and Stripline Circuits, Millimeter Wave Applications, Military Radar Systems, Missile Guidance Systems, Point to Point Digital Radio Antennas.

Data Sheet of Rogers RT/duroid 5880

RT/duroid 5880 Typical Value
Property	RT/duroid 5880		Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	2.20 2.20±0.02 spec.		Z	N/A	C24/23/50 C24/23/50	1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign	2.2		Z	N/A	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0004 0.0009		Z	N/A	C24/23/50 C24/23/50	1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε	-125		Z	ppm/℃	-50℃to 150℃	IPC-TM-650 2.5.5.5
Volume Resistivity	2 x 10⁷		Z	Mohm cm	C/96/35/90	ASTM D 257
Surface Resistivity	3 x 10⁷		Z	Mohm	C/96/35/90	ASTM D 257
Specific Heat	0.96(0.23）		N/A	j/g/k (cal/g/c)	N/A	Calculated
Tensile Modulus	Test at 23℃	Test at 100℃	N/A	MPa(kpsi)	A	ASTM D 638
	1070(156)	450(65)	X
	860(125)	380(55)	Y
Ultimate Stress	29(4.2)	20(2.9)	X
Ultimate Stress	27(3.9）	18(2.6)	Y
Ultimate Strain	6	7.2	X	%
Ultimate Strain	4.9	5.8	Y	%
Compressive Modulus	710(103)	500(73)	X	MPa(kpsi)	A	ASTM D 695
	710(103)	500(73)	Y
	940(136)	670(97)	Z
Ultimate Stress	27(3.9)	22(3.2)	X
	29(5.3)	21(3.1)	Y
	52(7.5)	43(6.3)	Z
Ultimate Strain	8.5	8.4	X	%
	7.7	7.8	Y
	12.5	17.6	Z
Moisture Absorption	0.02		N/A	%	0.62"(1.6mm) D48/50	ASTM D 570
Thermal Conductivity	0.2		Z	W/m/k	80℃	ASTM C 518
Coefficient of Thermal Expansion	31 48 237		X Y Z	ppm/℃	0-100℃	IPC-TM-650 2.4.41
Td	500		N/A	℃ TGA	N/A	ASTM D 3850
Density	2.2		N/A	gm/cm³	N/A	ASTM D 792
Copper Peel	31.2(5.5)		N/A	Pli(N/mm)	1oz(35mm)EDC foil after solder float	IPC-TM-650 2.4.8
Flammability	V-0		N/A	N/A	N/A	UL 94
Lead-free Process Compatible	Yes		N/A	N/A	N/A	N/A

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