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0.254mm 10mil High Frequency PCB Rogers RO4350B Double Sided RF PCB for LTE |
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(Printed Circuit Boards are custom products. The image and specifications provided are for reference purposes only.) |
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RO4350B hydrocarbon ceramic laminates are engineered to deliver excellent high-frequency performance while enabling cost-effective circuit fabrication. As operational frequencies rise to 500 MHz and above, the range of laminates available to designers becomes significantly limited. RO4350B material offers the essential properties required for RF microwave circuits, matching networks, and controlled impedance transmission lines. Its low dielectric loss makes RO4350B suitable for various applications where conventional circuit board materials may fall short at higher frequencies. |
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The dielectric constant of RO4350B material exhibits exceptional stability across a wide frequency range, with one of the lowest temperature coefficients among circuit board materials. Its thermal coefficient of expansion (CTE) offers significant advantages to PCB designers. The expansion coefficient of RO4350B closely matches that of copper, ensuring excellent dimensional stability—an essential property for constructing mixed dielectric multi-layer boards. Additionally, the material's low Z-axis CTE ensures reliable plated through-hole quality, even under extreme thermal shock conditions. With a glass transition temperature (Tg) exceeding 280°C, RO4350B maintains stable expansion characteristics throughout the full range of PCB processing temperatures.
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Parameters of a type of 0.3mm RO4350B PCB |
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High Frequency PCB Rogers 10mil 0.254mm RO4350B Double Sided RF PCB for LTE |
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PCB SIZE |
30 x 80mm=1up |
BOARD TYPE |
Double sided PCB |
Number of Layers |
2 layers |
Surface Mount Components |
YES |
Through Hole Components |
NO |
LAYER STACKUP |
copper ------- 35um(1 oz)+plate TOP layer |
RO4350B 0.254mm |
copper ------- 35um(1oz) + plate BOT Layer |
TECHNOLOGY |
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Minimum Trace and Space: |
N/A |
Minimum / Maximum Holes: |
N/A |
Number of Different Holes: |
N/A |
Number of Drill Holes: |
0 |
Number of Milled Slots: |
0 |
Number of Internal Cutouts: |
0 |
Impedance Control: |
no |
Number of Gold finger: |
0 |
BOARD MATERIAL |
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Glass Epoxy: |
RO4350B Tg280℃, er<3.48, Rogers Corp. |
Final foil external: |
1.5 oz |
Final foil internal: |
N/A |
Final height of PCB: |
0.3 mm ±0.1 |
PLATING AND COATING |
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Surface Finish |
Immersion gold, 16% |
Solder Mask Apply To: |
N/A |
Solder Mask Color: |
N/A |
Solder Mask Type: |
N/A |
CONTOUR/CUTTING |
Routing |
MARKING |
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Side of Component Legend |
N/A |
Colour of Component Legend |
N/A |
Manufacturer Name or Logo: |
N/A |
VIA |
NO |
FLAMIBILITY RATING |
UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE |
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Outline dimension: |
0.0059" |
Board plating: |
0.0029" |
Drill tolerance: |
0.002" |
TEST |
100% Electrical Test prior shipment |
TYPE OF ARTWORK TO BE SUPPLIED |
email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA |
Worldwide, Globally. |
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Typical applications: |
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Automotive Radar and Sensors
Cellular Base Station Antennas
Direct Broadcast Satellites
Low Noise Block
Power amplifiers
RFID |
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Data sheet of Rogers 4350B (RO4350B ) |
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RO4350B Typical Value |
Property |
RO4350B |
Direction |
Units |
Condition |
Test Method |
Dielectric Constant,εProcess |
3.48±0.05 |
Z |
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10 GHz/23℃ |
IPC-TM-650 2.5.5.5 Clamped Stripline |
Dielectric Constant,εDesign |
3.66 |
Z |
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8 to 40 GHz |
Differential Phase Length Method |
Dissipation Factortan,δ |
0.0037
0.0031 |
Z |
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10 GHz/23℃
2.5 GHz/23℃ |
IPC-TM-650 2.5.5.5 |
Thermal Coefficient of ε |
+50 |
Z |
ppm/℃ |
-50℃to 150℃ |
IPC-TM-650 2.5.5.5 |
Volume Resistivity |
1.2 x 1010 |
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MΩ.cm |
COND A |
IPC-TM-650 2.5.17.1 |
Surface Resistivity |
5.7 x109 |
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MΩ |
COND A |
IPC-TM-650 2.5.17.1 |
Electrical Strength |
31.2(780) |
Z |
Kv/mm(v/mil) |
0.51mm(0.020") |
IPC-TM-650 2.5.6.2 |
Tensile Modulus |
16,767(2,432)
14,153(2,053) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
Tensile Strength |
203(29.5)
130(18.9) |
X
Y |
MPa(ksi) |
RT |
ASTM D 638 |
Flexural Strength |
255
(37) |
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MPa
(kpsi) |
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IPC-TM-650 2.4.4 |
Dimensional Stability |
<0.5 |
X,Y |
mm/m
(mil/inch) |
after etch+E2/150℃ |
IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion |
10
12
32 |
X
Y
Z |
ppm/℃ |
-55℃to288℃ |
IPC-TM-650 2.4.41 |
Tg |
>280 |
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℃ TMA |
A |
IPC-TM-650 2.4.24.3 |
Td |
390 |
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℃ TGA |
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ASTM D 3850 |
Thermal Conductivity |
0.69 |
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W/M/oK |
80℃ |
ASTM C518 |
Moisture Absorption |
0.06 |
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% |
48hrs immersion 0.060"
sample Temperature 50℃ |
ASTM D 570 |
Density |
1.86 |
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gm/cm3 |
23℃ |
ASTM D 792 |
Copper Peel Stength |
0.88
(5.0) |
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N/mm
(pli) |
after solder float 1 oz.
EDC Foil |
IPC-TM-650 2.4.8 |
Flammability |
(3)V-0 |
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UL 94 |
Lead-free Process Compatible |
Yes |
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