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0.15mm-Polyimide(PI)-Based-Assembled-Flexible-PCB-with-Immersion-Gold-for-Portable-Sound-System |
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(FPC’s are custom-made products. The picture and parameters shown are for reference only.) |
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General description |
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This assembled flexible PCB is designed for portable sound systems. It's built on a polyimide substrate with a Tg (glass transition temperature) of 60°C. The 2 - layer FPC has a thickness of 0.15 mm. There's a white silkscreen on the yellow coverlay (solder mask) that covers both sides of the PCB, and the pads are treated with immersion gold. On the back of one end of the PCB, a polyimide stiffener is applied. The base material of the PCB is sourced from Shengyi. Each panel can supply 34 PCBs. The manufacturing process adheres to IPC 6012 Class 2 standards, using the provided Gerber data. For shipment, every 25 panels are packed together. |
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Specifications |
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PCB Size: |
29 x 4.0mm, 121 x 75.5mm=34 pcs |
Number of Layers |
2 layers |
Board Type |
Flexbile cirucit |
Board Thickness |
0.15mm +/-10% |
Board Material |
Polyimide (PI) 25um |
Board Material Supplier |
Shengyi |
Tg Value of Board Material |
60℃ |
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PTH Cu thickness |
20 um |
Inner Iayer Cu thicknes |
N/A |
Surface Cu thickness |
35 um (1oz) |
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Coverlay Colour |
Yellow |
Number of Coverlay |
2 |
Thickness of Coverlay |
25 um |
Stiffener |
Polyimide 0.3mm |
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Type of Silkscreen Ink |
Taiyo |
Supplier of Silkscreen |
Taiyo |
Color of Silkscreen |
White |
Number of Silkscreen |
1 |
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Minimum via (mm) |
0.3 |
Minimum Trace (mil) |
8.0 |
Minimum Gap(mil) |
7.3 |
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Surface Finish |
Immersion Gold |
RoHS Required |
Yes |
Famability |
94-V0 |
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Thermal Shock Test |
Pass, -25℃±125℃, 1000 cycles. |
Thermal Stress |
Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
Function |
100% Pass electrical test |
Workmanship |
Compliance with IPC-A-600H & IPC-6013C Class 2 |
Type of artwork to be supplied |
email file, Gerber RS-274-X, PCBDOC etc |
Service area |
Worldwide, Globally. |
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Features and Benefits
1. Excellent flexibility
2. Reducing the volume
3. Weight reduction
4. Consistency of assembly
5. SMT process is resistant to reflow soldering, resistant to rework
6. Comprehensive equipment management and maintenance and process control
7. Strict WIP inspection and monitoring as well as working instruction
8. Small quantity order is accepted
9. 12 hours quotation
10. Prototype PCB capability
11. Volume Production capability |
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Applications |
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Thin-film switch, Capacitive touch screen / panel, mobile phone antenna flex board, mobile phone module flex board, FFC for industrial control equipment, industrial control touch remote control soft board, Tablet PC camera soft board, Tablet computer battery soft board |
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Clarifications of FPC |
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Based on the combination of base material and copper foil, flexible circuit boards can be categorized into two types: adhesive-based flexible boards and adhesive-free flexible boards. Although the price of adhesive-free flexible PCBs is significantly higher than that of adhesive-based ones, they offer superior flexibility, stronger bonding force between copper foil and substrate, and better solder pad flatness. As a result, they are only used in high-demand scenarios, such as COF (Chip On Flex, a flexible board with bare chips requiring high pad flatness). Due to cost considerations, most flexible PCBs on the market remain adhesive-based. Since flexible circuit boards are primarily used in bending applications, improper design or processes can easily lead to defects like micro-cracks and soldering issues.
Economy of Using FPC
For relatively simple circuit designs with small overall volume and suitable space, traditional internal connections are much more cost-effective. Flexible circuits become a preferable design choice when circuits are complex, handle multiple signals, or have special electrical/mechanical requirements. When application size and performance exceed the capabilities of rigid circuits, flexible assemblies offer the best economic solution. Features like 12mil pads with 5mil through-holes and 3mil line/spacing can be fabricated on thin films, enabling direct chip mounting on the film with higher reliability. These films contain no flame retardants that could act as ion sources and can be protected or solidified at higher temperatures to achieve higher glass transition temperatures. Flexible materials are also less costly than rigid alternatives due to the elimination of connectors. |
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More Displays of Flexible Circuits |
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Hot Tags:
2-layer Flexible PCB |
Shengyi Polyimide Flexible PCB |
Shengyi Assembled FPC |
Assembled Flexible PCB |
Flexible PCB with yellow solder mask |
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