Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
WELCOME TO BICHENG

LATEST SHIPMENT
 
B RO4003C PCB
   
B Fast Prototype PCB
   
B CSP Via in Pad PCB
   
B RO4350B PCB
   
B Hybrid PCB / Mixed PCB
   
 
B Heavy Copper MCPCB (8oz)
 
B RT/duroid 5880 PCB
 
B RT/duroid 6010 PCB
 
B Rogers TC350 PCB
 
B Multilayer PCB
 
 
B Flexible PCB Board
 
B Impedance Controlled PCB
 
B Double Layer MCPCB
 
B Rigid-Flex PCB
 
B Taconic RF-35TC PCB
 
 

 

 

 

 
Rogers TC350 High Frequency PCB Built on 30mil Substrate
 
  1.1 General description
  This is a type of double sided PCB built on 30mil TC350 substrate for the application of power dividers. It's 0.8 mm finished thick with blue solder mask and immersion silver on pads. Mininum tracks and gaps are 5mil and 6mil. All vias are designed to be tented. It's supplied by individual PCB at 90mm x 53mm. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 50 boards are packed for shipment.
 
  1.2 Features and benifits
 

1.“Best in Class” Thermal Conductivity (1.0 W/mK) and Dielectric Constant Stability across Wide Temperatures (-9 ppm/oC)
2. Very Low Loss Tangent provides Higher Amplifier or Antenna Efficiency
3. Priced Affordably for Commercial Applications
4. High Peel Strength for Reliable Copper Adhesion in thermally stressed applications
5. Heat Dissipation and Management
6. Large Panel Sizes for Multiple Circuit Layout for lowered Processing Costs
7. Comprehensive PCB Equipment Management and Maintenance and Process Control
8. Powerful PCB Capabilities Support Your Research and Development, Sales and Marketing
9. Customer Complaint Rate: <1%

 
  1.3 Applications
 

1. Microwave Combiner and Power Dividers
2. Power Amplifiers, Filters and Couplers
3. Thermally Cycled Antennas Sensitive to dielectric drift
4. Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB)

   
  1.4 Parameter and data sheet
 
Base Material: TC350 30 mil (0.762 mm)
Copper Weight: 2 oz each layer
Board Thickness: 0.8 mm ±10%
Layer Count: 2 layers
Board Size: 90mm x53mm=1design = 1PCS
Solder Mask: Blue solder mask | White silkscreen
Surface Finish: Immersion silver
Via: via tented
Warpage: <0.75%
Net Weight: 0.007 kg / PCS
Acceptable Standard: IPC-Class-2
Lead time for prototype: 10 working days
Shelflife: 6 months
   
 
 

 

 

 
 

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