Design for manufacture(DFM)

WELCOME TO BICHENG

	Design For Manufacture

	Inner Layer

	Laminating

	Drill

	Etching

	Outer Layer

	Solder Mask

	Silkscreen

	Carbon Ink

	Peelable Mask

	Surface Finish

	Contour

	Special Tolerance

Serial NO.	Procedure	Item	Manufacturing capability
			Large volume （S<100 m2）	Middle volume （S<10 m2）	Prototype（S<1m2）
			Large volume （S<100 m2）	Middle volume （S<10 m2）	Prototype（S<1m2）
1	Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value )	Min.isolation of layers	0.1mm	0.1mm	0.06mm
2		Min.track and spacing	5/5mil(18um)	4/4mil(18um)	3/3.5mil(18um)
3			5/5mil(35um)	4/4mil(35um)	3/4mil(35um)
4			7/9mil(70um)	6/8mil(70um)	6/7mil(70um)
5			9/11mil(105um)	8/10mil(105um)	8/9mil(105um)
6			13/13mil(140um)	12/12mil(140um)	12/11mil(140um)
7		Min.distance from drill to conductor	4 Layer 10mil，6 layer 10mil，8-12 layer 12mil	4 layer 8mil，6 layer 8mil，8-12 layer 10mil，14-20 layer 14mil，22-32 layer 18mil	4 layer 6mil，6 layer 6mil，8-14 layer 8mil，16-22 layer 12mil，24-32 layer 14mil
8		Min.width of annular ring on inner layer	4 Layer 10mil（35um），≥6 Layer 14mil（35um）	4 Layer 8mil(35um)，≥6 layer 12mil（35um）	4 Layer 6mil（35um），≥6 Layer 10mil（35um）
9		Inner layer isolation ring width(Min)	10mil （35um）	8mil （35um）	6mil （35um）
10		Min.via pad diameter	20mil （35um）	16mil （35um）	16mil （35um）
11		Min. distance from board edge to conductor(no copper exposured)(inner layer)	14 mil（35um）	12 mil（35um））	8 mil（35um）
12		Maximum copper weight(Inner layer and outer layer)	3 OZ( 105 um )	4 OZ ( 140 um )	6 OZ( 210 um )
13		Core with different copper foil on both sides	/	18/35,35/70 um	18/35,35/70 um

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