Design for manufacture(DFM)

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	Design For Manufacture

	Inner Layer

	Laminating

	Drill

	Etching

	Outer Layer

	Solder Mask

	Silkscreen

	Carbon Ink

	Peelable Mask

	Surface Finish

	Contour

	Special Tolerance

Serial NO.	Procedure	Item	Manufacturing capability
			Large volume （S<100 m2）	Middle volume （S<10 m2）	Prototype（S<1m2）

80	Special tolerance	Board thickness of flying probe test	0.6-4.0mm
81		Panel size of flying probe test	Size≤900X600mm, Small size can be compensated through manufacturing procedure
82		Panel size of fixture test method	Size≤460X380mm, Small size can be compensated through manufacturing procedure
83		Board thickness of fixture test method	0.4-6.0mm
84		Tolerance of press-fit hole	±2mil
85		Tolerance of NPTH	±2mil
86		Tolerance of PCB thickness	1.0mm≥PCB thickness, Tolerance ±0.1mm；1.0mm≤PCB thickness, Tolerance ±10%
87		Tolerance of depth of countersunk hole	±0.2mm
88		Depth tolerance of blind slot	±0.2mm
89		Maximum shipment size	Size≤1200X600mm（Double side, no test required）
90			Size≤1000X600mm（ Multilayer, no test required）
91		Minimum shipment size	10X10mm
92		PCB thickness of HASL	0.8-3.0mm(Hole less 0.5mm should be use via-plug or mask-tent )
93		HASL PCB Size	Size≤600X460mm
94		PCB thickness	0.15-7.0mm
95		Depth of V groove	0.8-3.2mm
96		Distance of non-continuous v-groove	≥7mm
97		Max. drill diameter	Size≤6.5mm (Counterbore or router will be used for holes more than 6.5mm, Min.tolerance ±0.1mm ）
98		Max. countersink diameter	Size≤6.5mm Countersink can be used counterbore drill or router）
99		Distance of Bevel	Size≥11mm	Size≥5mm	Size≥5mm
100		Thickness of peelable mask	0.2-1.5mm ±0.15mm

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