Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
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LATEST SHIPMENT
 
B RO4003C PCB
   
B Fast Prototype PCB
   
B CSP Via in Pad PCB
   
B RO4350B PCB
   
B Hybrid PCB / Mixed PCB
   
 
B Heavy Copper MCPCB (8oz)
 
B RT/duroid 5880 PCB
 
B RT/duroid 6010 PCB
 
B Rogers TC350 PCB
 
B Multilayer PCB
 
 
B Flexible PCB Board
 
B Impedance Controlled PCB
 
B Double Layer MCPCB
 
B Rigid-Flex PCB
 
B Taconic RF-35TC PCB
 
 

 

 

 
 
Taconic RF-35TC High Frequency PCB Built on 30mil Substrate
 
  1.1 General description
  This is a type of double sided PCB built on 30mil RF-35TC substrate for the application of power amplifiers. It's 0.8 mm finished thick with black solder mask and immersion gold on pads. Mininum tracks and gaps are 5mil and 6mil. All vias are designed to be tented. It's supplied by individual PCB at 100mm x 100mm. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 50 boards are packed for shipment.
 
  1.2 Features and benifits
 

1. "Best in Class" Loss Tangent
2. Dk Stability Across a Broad Temperature Range
3. Enhanced Antenna Gains/ Efficiencies
4. Excellent Adhesion to Very Low Profile copper
5. Exceptional Thermal Management
6. PCB Engineering Design Prevents Problems from Occurring in Pre-production
7. Meeting Your PCB Needs from Prototype to Mass Production
8. Experienced Sales Persons Provide Skilled Customer Services
9. Delivery on time: >98%

 
  1.3 Applications
 

1. Antennas
2. Filters, Couplers & Power Amplifiers
3. Satellites
   
  1.4 Parameter and data sheet
 
Base Material: Taconic RF-35TC 30 mil (0.762 mm)
Copper Weight: 2 oz each layer
Board Thickness: 0.8 mm ±10%
Layer Count: 2 layers
Board Size: 100mm x100mm=1design = 1PCS
Solder Mask: Black solder mask | White silkscreen
Surface Finish: Immersion Gold
Via: via tented
Warpage: ＜0.75%
Net Weight: 0.015 kg / PCS
Acceptable Standard: IPC-Class-2
Lead time for prototype: 10 working days
Shelflife: 6 months
   
 
 

 

 

 
　

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