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RO4534 Dual Layer Rogers High Frequency PCB Built on 60mil 1.524mm Hydrocarbon / Ceramic / Woven Glass Substrates With Immersion Gold

Shipped: 25th-July-2023

We are thrilled to announce the arrival of our newly shipped high-frequency PCB, offered to take your projects to the next level! The PCB is made from RO4534 Hydrocarbon / Ceramic / Woven Glass DK 3.4, a high-quality material that delivers exceptional performance, reliability, and functionality. We are confident that you will be pleased with our product, no matter the size of your project.

The PCB is manufactured through a lead-free process, making it an eco-friendly option. It can operate in extreme temperatures ranging from -40℃ to +85℃, making it suitable for a wide range of applications.

The 2-layer high frequency PCB boasts a finished copper weight of 35um and an RO4534 dielectric thickness of 60 mil (1.524mm) with finished copper weight of 35 um. This high-quality PCB is crafted to handle even the most demanding situations with ease.

The construction details are designed to optimize performance. The board dimensions are 170.66mm x 70.33mm, coming in a single piece with a tolerance of +/- 0.15mm. The minimum trace/space is 4/4 mils, and the minimum hole size is 0.4mm, making it easy to work with. The PCB has no blind or buried vias, ensuring optimal performance. The finished board thickness is 1.6mm, with a finished Cu weight of 1 oz (1.4 mils) all layers. The via plating thickness is 1 mil, and the surface finish is immersion gold. The top and bottom solder masks are green, and there is no silkscreen on the solder pads, ensuring unobstructed performance.

The PCB has been 100% electrically tested and features vias that are 0.4mm, filled by resin, and capped per IPC-4761 Type VII. The PCB statistics are impressive, with 173 components and 200 total pads, including 121 thru-hole pads and 79 top SMT pads. With 161 vias and 23 nets, this high-quality PCB can handle a wide range of applications.

We offer our services worldwide, and our team is always available to answer any technical questions you may have. Please feel free to contact us at sales@bicheng-enterprise.com

Specifications	Value
Material	RO4534 Hydrocarbon / Ceramic / Woven Glass DK 3.4
Lead-Free Process	Yes
Operating Temperature	-40℃ to +85℃
Layer Count	2-layer, Double Sided
Finished Copper Weight	35um
Dielectric Thickness	60 mil (1.524mm)
Finished Copper Weight	35um
Board Dimensions	170.66mm x 70.33mm = 1 PCS +/- 0.15mm
Minimum Trace/Space	4/4 mils
Minimum Hole Size	0.4mm
Blind/Buried Vias	No
Finished Board Thickness	1.6mm
Finished Cu Weight	1 oz (1.4 mils) all layers
Via Plating Thickness	1 mil
Surface Finish	Immersion Gold
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	Green
Silkscreen on Solder Pads	No
Electrical Test Used	100%
Via Filled by Resin	Yes
Via Capped per IPC-4761 Type VII	Yes
Components	173
Total Pads	200
Thru-Hole Pads	121
Top SMT Pads	79
Bottom SMT Pads	0
Vias	161
Nets	23
Type of Artwork Supplied	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Service Area	Worldwide

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