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RO3003 Double Layer Rogers ceramic-filled PTFE PCB Built on 20mil 0.508mm Substrates with Immersion Tin

Shipped: 17th-July-2023

We’re glad to introduce the newly shipped RF PCB from Bicheng Technologies, a high-quality and reliable printed circuit board that meets the demanding requirements of modern electronics. This RF PCB is made of RO3003 ceramic-filled PTFE composites, ensuring high-frequency and low-loss characteristics. The manufacturing process is lead-free, making it environmentally friendly and safe for use in various applications. With a temperature range of -40℃ to +85℃, this RF PCB can operate in extreme conditions without compromising performance.

The 2-layer rigid PCB has a finished copper weight of 35um, with a RO3003 dielectric thickness of 20 mil (0.508mm) and another layer of finished copper weight of 35 um. This stackup design ensures high signal integrity and reliability.

The construction details of this RF PCB include a board dimension of 117mm x 50 mm=1PCS, +/- 0.15mm, a minimum trace/space of 8/8 mils, and a minimum hole size of 0.4mm. The PCB has no blind or buried vias, a finished board thickness of 1.6mm, and a surface finish of immersion tin. This RF PCB has no top or bottom silkscreen or solder mask and no silkscreen on solder pads. It has undergone a 100% electrical test to ensure its reliability and performance.

The RF PCB has 77 components and a total of 123 pads, with 71 thru-hole pads and 52 top SMT pads. The PCB has 100 vias and 8 nets.

The type of artwork supplied with this RF PCB is Gerber RS-274-X, and it meets the IPC-Class-2 standard, ensuring compliance with industry standards. Bicheng provides worldwide service, and technical questions can be directed to sales@bicheng-enterprise.com

Specifications	Value
Material	RO3003 ceramic-filled PTFE composites
Lead-free process	Yes
Operating temperature range	-40℃ to +85℃
Layer count	2
Finished copper weight	35um
Dielectric thickness	20 mil (0.508mm) RO3003
Finished copper weight	35um
Board dimensions	117mm x 50 mm=1PCS, +/- 0.15mm
Minimum Trace/Space	8/8 mils
Minimum Hole Size	0.4mm
Blind/buried vias	None
Finished board thickness	1.6mm
Finished Cu weight	1 oz (1.4 mils) all layers
Via plating thickness	1 mil
Surface finish	Immersion tin
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	No
Bottom Solder Mask	No
Silkscreen on solder pads	No
Electrical test	100%
Components	77
Total Pads	123
Thru Hole Pads	71
Top SMT Pads	52
Bottom SMT Pads	0
Vias	100
Nets	8
Type of Artwork Supplied	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Service Area	Worldwide

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