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TLX-8 Double Sided Taconic Fiberglass PTFE PCB Built on 60mil 1.524mm Substrates with HASL Surface Finish

Shipped: 17th-July-2023

Bicheng Technologies has recently released a new RF PCB that is offered to meet the high demands of modern electronics. This RF PCB is made with TLX-8 PTFE Glass material that is lead-free, and it can operate in a temperature range of -40℃ to +85℃. This essay will provide an overview of the features and specifications of this newly shipped RF PCB.

The TLX-8 PTFE Glass material used in this RF PCB is known for its high frequency and low loss properties. It is also environmentally friendly due to its lead-free manufacturing process. This material ensures that the RF PCB can operate in a wide temperature range of -40℃ to +85℃, making it suitable for a variety of applications.

The 2-layer rigid PCB has a finished copper weight of 35um with a TLX-8 dielectric thickness of 60 mil (1.524mm) and another layer of finished copper weight of 35 um. This stackup design ensures that the RF PCB has high signal integrity and is able to meet the stringent requirements of modern electronics.

The board dimensions of the RF PCB are 137mm x 70 mm=1PCS, +/- 0.15mm, making it compact and easy to integrate into various electronic devices. The minimum trace/space is 8/7 mils, and the minimum hole size is 0.4mm. The RF PCB has no blind or buried vias, and the finished board thickness is 1.6mm. The RF PCB has a finished Cu weight of 1 oz (1.4 mils) all layers, and the via plating thickness is 1 mil. The surface finish of the RF PCB is Hot Air Soldering Level (HASL), and there is no silkscreen on the top or bottom of the board or on the solder pads. The RF PCB has undergone a 100% electrical test to ensure its reliability.

The RF PCB boasts an impressive component count of 77, with 123 total pads, 92 Thru Hole Pads, 31 Top SMT Pads, and no Bottom SMT Pads. Additionally, the RF PCB has 112 Vias and 12 Nets, and it meets the IPC-Class-2 standard.

Bicheng Technologies provides worldwide service, and if there are any technical questions, customers can contact the sales team at sales@bicheng-enterprise.com

Specifications	Value
Material	TLX-8 PTFE Glass
Lead-free process	Yes
Operating temperature range	-40℃ to +85℃
Layer count	2
Finished copper weight L1	35um
Dielectric thickness	60 mil (1.524mm) TLX-9
Finished copper weight L2	35um
Board dimensions	137mm x 70 mm=1PCS, +/- 0.15mm
Minimum Trace/Space	8/7 mils
Minimum Hole Size	0.4mm
Blind/buried vias	None
Finished board thickness	1.6mm
Finished Cu weight	1 oz (1.4 mils) all layers
Via plating thickness	1 mil
Surface finish	Hot Air Soldering Level (HASL)
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	No
Bottom Solder Mask	No
Silkscreen on solder pads	No
Electrical test	100%
Components	77
Total Pads	123
Thru Hole Pads	92
Top SMT Pads	31
Bottom SMT Pads	0
Vias	112
Nets	12
Type of Artwork Supplied	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Service Area	Worldwide

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