PCB Supplier | Hybrid PCB

WELCOME TO BICHENG

Home
Company
Quality
Manufacture
Career
PCB Boards
- Newly Shipped RF PCB
- High Frequency PCB
Contact Us

RO4003C 6-Layer Hybrid Printed Circuit Boards (PCB) Built on 12mil 0.305mm and High Tg FR-4 with 0.25mm Via Filled IPC-4761 Type VII

Shipped: 12th-July-2023

Looking for a top-of-the-line PCB that delivers unbeatable performance and durability? Look no further than our newest offering, now available for purchase. The PCB is offered with the latest RO4003C hydrocarbon ceramic laminates and FR-4 Epoxy Glass, with a lead-free process and -40℃ to +85℃ operation to ensure maximum durability and reliability.

The 6-layer hybrid PCB features a finished copper weight of 35um, RO4003C dielectric thickness of 12mil, and internal copper layers of 35um with prepreg thickness of 0.11mm. With a bottom layer copper weight of 35um, the PCB is built to withstand even the toughest conditions.

The construction details are equally impressive, with board dimensions of 76mm x 76mm=1PCS, +/- 0.15mm, and a minimum trace/space of 4/4 mils, and a minimum hole size of 0.2mm. The board has no blind or buried vias, but the finished board thickness of 1.1mm and finished copper weight of 1.0 oz (1.4 mils) all layers, combine to ensure the utmost in durability and reliability. Via plating thickness of 1 mil and surface finish of Electroless Nickle Immersion Gold (ENIG) provide unparalleled corrosion resistance and longevity.

Our PCB is offered to meet your needs. White top silkscreen, a matt blue top and bottom solder mask, and no silkscreen onto solder pads are must. The PCB is impedance controlled at 50 ohms on the top layer with a 20mil single end, reference layer 2. Via 0.2mm and 0.25mm are filled with resin and capped as per IPC-4761 Type VII.

The PCB features an impressive 73 components, 94 total pads, 43 thru-hole pads, 39 top SMT pads, and 12 bottom SMT pads. 62 vias and 32 nets are utilized to ensure optimal connectivity. The PCB meets IPC-Class-2 standards.

Our service area is worldwide, and our team is always available to answer any technical questions or inquiries at sales@bicheng-enterprise.com

Specifications	Value
PCB Material	RO4003C hydrocarbon ceramic laminates + FR-4 Epoxy Glass
	Lead-free process
	-40℃ to +85℃ operation
Stackup	6-layer hybrid PCB
	Finished copper 35um
	RO4003C dielectric 12mil
	Internal-1 GND layer copper 35um
	Prepreg 0.11mm
	Internal-2 layer copper 35um
	Prepreg 0.11mm
	Internal-3 layer copper 35um
	Prepreg 0.11mm
	Internal-4 layer copper 35um
	RO4003C dielectric 12mil
	Bottom layer copper 35um
Construction details	Board dimensions: 76mm x 76mm=1PCS, +/- 0.15mm
	Minimum Trace/Space: 4/4 mils
	Minimum Hole Size: 0.2mm
	No blind or buried vias
	Finished board thickness: 1.1mm
	Finished Cu weight: 1.0 oz (1.4 mils) all layers
	Via plating thickness: 1 mil
	Surface finish: Electroless Nickle Immersion Gold (ENIG)
	Top Silkscreen: White
	Bottom Silkscreen: No
	Top Solder Mask: Matt blue
	Bottom Solder Mask: Matt blue
	No silkscreen on solder pads
	100% Electrical test used
	0.2mm and 0.25mm via filled by resin and capped as per IPC-4761 Type VII
Impedance controlled	50 ohm Top layer 20mil single end, reference layer 2
PCB Statistics	Components: 73
	Total Pads: 94
	Thru Hole Pads: 43
	Top SMT Pads: 39
	Bottom SMT Pads: 12
	Vias: 62
	Nets: 32
Type of artwork supplied	Gerber RS-274-X
Accepted standard	IPC-Class-2
Service area	Worldwide

BACK TO CONTENT OF JULY