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深圳市碧澄电子科技有限公司
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info@bicheng-enterprise.com
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RO4350B Dual Layer Rogers PCB Built on 20mil Substrates with Immersion Silver

Shipped: 5th-July-2023  

We are excited to announce the launch of our newly shipped 2-layer rigid PCB, designed to meet your electronic device needs with top-of-the-line materials and construction details. This PCB boasts a range of high-quality specifications, making it perfect for complex electronic designs.

The PCB is built with RO4350B hydrocarbon ceramic laminates, ensuring high performance and reliability. The lead-free process makes it eco-friendly, and it is designed for -40℃ to +85℃ operation.

The PCB has a 2-layer rigid stackup, with finished copper weight of 35um and RO4350B dielectric of 20mil, providing durability and longevity to your device.
The PCB has a board dimension of 122mm x 74mm =1PCS, +/- 0.15mm, with a minimum trace/space of 7/9 mils and a minimum hole size of 0.3mm. It has no blind or buried vias, and the finished board thickness is 0.83mm. The PCB has a finished Cu weight of 1 oz (1.4 mils) all layers and via plating thickness of 1 mil. The surface finish is immersion silver, and there is no top/bottom silkscreen or solder mask.
The PCB features 74 components, 109 total pads, 46 thru hole pads, 63 top SMT pads, 0 bottom SMT pads, and 54 vias across 9 nets.
The PCB also includes 100% electrical testing and via filled by copper paste for better heat dissipation, ensuring every aspect is thoroughly checked and examined before delivery. Choose our PCB for its quality, reliability, and durability, and take your electronic device to the next level. For any technical questions, please reach out to us at sales@bicheng-enterprise.com
 
 

Specification

Value

PCB Material

RO4350B hydrocarbon ceramic laminates with lead-free process; designed for -40℃ to +85℃ operation

Stackup

2-layer rigid PCB

finished copper weight of 35um

RO4350B dielectric of 20mil

finished copper weight of 35um

Board Dimensions

122mm x 74mm =1PCS, +/- 0.15mm

Minimum Trace/Space

7/9 mils

Minimum Hole Size

0.3mm

Via Details

No blind or buried vias

Finished Board Thickness

0.83mm

Finished Cu Weight

1 oz (1.4 mils) all layers

Via Plating Thickness

1 mil

Surface Finish

Immersion Silver

Silkscreen

No top/bottom silkscreen or solder mask; no silkscreen on solder pads

Electrical Testing

100% electrical test used

Via Filling

Via filled by copper paste for better heat dissipation

PCB Statistics

74 components; 109 total pads; 46 thru-hole pads; 63 top SMT pads; 0 bottom SMT pads; 54 vias across 9 nets

Artwork Supplied

Gerber RS-274-X

 
 
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