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RO4350B Dual Layer Rogers High Frequency PCB Built on 30mil Substrates with ENEPIG

Shipped: 4th-July-2023

We're thrilled to announce the arrival of our newly offered RF PCB, perfect for meeting your high-frequency needs. This PCB is constructed with Rogers RO4350B hydrocarbon ceramic laminates and processed lead-free, enabling it to operate within a temperature range of -40℃ to +85℃, making it suitable for a wide range of applications.

The PCB has a stackup of base copper 17um, dielectric RO4350B 30mil, and base copper 17um. It measures 52.00mm x 38.00mm and has a minimum trace/space of 8/6 mils and a minimum hole size of 0.5mm. Countersunk holes are required, and the board is 0.8mm thick, with a finished Cu weight of 1 oz (1.4 mils) all layers and a via plating thickness of 1 mil.

With a surface finish of ENEPIG and top and bottom silkscreen and solder masks in matt black, this RF PCB is sure to meet your electronic needs. It also has 0.5mm via copper pasted filled and capped, and edge plating is required. Additionally, it has 100% electrical test coverage, ensuring that the board is fully functional before shipping.

Designed with 15 components, 53 total pads, 17 through-hole pads, and 35 top surface mount technology (SMT) pads, this PCB is perfect for your electronic needs. There are no bottom SMT pads, and it has a total of 45 vias and 3 nets. Impedance matching is not included.

Don't wait to upgrade your electronics. Contact us at sales@bicheng-enterprise.com if you have any technical questions or concerns. We're excited to bring you this high-quality RF PCB and help take your technology to the next level.

PCB Specification	Details
PCB Material	Rogers RO4350B hydrocarbon ceramic laminates
Process	Lead-free
Operating Temperature Range	-40℃ to +85℃
Stackup	Base copper 17um
	dielectric RO4350B 30mil
	base copper 17um
Board Dimensions	52.00mm x 38.00mm = 1 PCS, +/- 0.15mm
Minimum Trace/Space	8/6 mils
Minimum Hole Size	0.5mm
Countersunk Holes	Required
Finished Board Thickness	0.8mm
Finished Cu Weight	1 oz (1.4 mils) all layers
Via Plating Thickness	1 mil
Surface Finish	ENEPIG
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	Matt Black
Bottom Solder Mask	Matt Black
Via Copper Pasted Filled and Capped	0.5mm
Edge Plating	Required
Electrical Test	100% coverage
Impedance Matching	No
PCB Statistics	Components: 15, Total Pads: 53, Thru Hole Pads: 17, Top SMT Pads: 35, Bottom SMT Pads: 0, Vias: 45, Nets: 3

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