Rogers RT/duroid 6035HTC high frequency RF PCB

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Rogers RT/duroid 6035HTC high frequency RF PCB 10mil 0.254mm Double Side 1oz ED Cooper

Shipped: 27th-Dec-2023

1. RT/duroid 6035HTC Introduction
Rogers RT/duroid 6035HTC high frequency circuit materials are ceramic filled PTFE composites for use in high power RF and microwave applications. They are an exceptional choice for high power applications. The laminates have a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (ED and reverse treat) with excellent long term thermal stability. Additionally, Rogers advanced filler system enables excellent drill-ability, reducing drilling costs as compared to standard high thermally conductive laminates that use alumina fillers.

2. Features
- DK of 3.5 +/- 0.05 at 10 GHz/23°C
- Dissipation factor of 0.0013 at 10 GHz/23°C
- Thermal Coefficient of dielectric constant of -66 ppm/°C
- Moisture Absorption 0.06%
- Thermal Conductivity of 1.44 W/m/K at 80°C
- CTE in X-axis of 19 ppm/°C, Y-axis of 19ppm/°C and Z-axix of 39ppm/°C

3. Benefits
High Thermal conductivity
- Improved dielectric heat dissipation enables lower operating temperatures for high power applications
Low loss tangent
- Excellent high frequency performance
Thermally stable low profile and reverse treat copper foil
- Lower insertion loss and excellent thermal stability of traces
Advanced filler system
- Improved drill ability and extended tool life compared to aluminacontaining circuit materials

4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
RT/duroid 6035HTC - 0.254 mm (10mil)
Copper_layer_2 - 35 μm

5. PCB Construction details:
- Board dimensions: 62.95mm x 107.5 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.35mm
- No Blind vias.
- Finished board thickness: 0.3mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: Black
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment

6. PCB Statistics:
Components: 35
Total Pads: 98
Thru Hole Pads: 67
Top SMT Pads: 31
Bottom SMT Pads: 0
Vias: 56
Nets: 4

7. Type of artwork supplied: Gerber RS-274-X

8. Accepted standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications:
- High power RF and microwave amplifiers
- Power amplifiers, couplers, filters, combiners, power dividers

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