WL-CT High Frequency PCB Supplier

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WL-CT High Frequency PCB

Introduction

The WL-CT series of organic polymer ceramic fiberglass cloth-covered copper boards is a thermosetting resin-based high-frequency material. The composition of the dielectric layer includes hydrocarbon resin, ceramics, and fiberglass cloth. It exhibits low loss performance, meeting the requirements for high-frequency designs. PCB processing can be carried out using techniques similar to FR4 materials, making it simpler compared to PTFE materials and ensuring better stability and consistency in circuitry. It can be used as a substitute for similar foreign products.

The combination of hydrocarbon resin and composite ceramics provides excellent low loss, high-temperature resistance, and temperature stability characteristics. The series of materials have a stable temperature coefficient of dielectric constant and loss, low thermal expansion coefficient, and a high TG value of above 280°C.

The series offers a selection of dielectric constants: 3.00, 3.30, 3.38, 3.48, 4.10, and 6.15.

These materials can be paired with standard ED copper foil or reverse-treated RTF copper foil. RTF copper foil offers excellent PIM (Passive Intermodulation) performance, reducing conductor loss and insertion loss. The back-treated RTF copper foil has an increased material thickness of 0.018mm (0.7mil), providing good adhesion.

The series can also be paired with aluminum-based substrates to create aluminum-based high-frequency materials.

The circuit boards can be processed using standard FR4 board fabrication techniques. The excellent mechanical and physical properties of the material allow for multiple lamination cycles, making it suitable for multi-layer, high-layer-count, and backplane processing. It exhibits excellent processability in dense hole and fine line routing.

Product Features:

The combination of hydrocarbon resin and composite ceramics provides excellent low loss, high-temperature resistance, and temperature stability characteristics. The series of materials have a stable temperature coefficient of dielectric constant and loss, low thermal expansion coefficient, and a high TG value of above 280°C.
The series offers a selection of dielectric constants: 3.00, 3.30, 3.38, 3.48, 4.10, and 6.15.
These materials can be paired with standard ED copper foil or reverse-treated RTF copper foil. RTF copper foil offers excellent PIM (Passive Intermodulation) performance, reducing conductor loss and insertion loss. The back-treated RTF copper foil has an increased material thickness of 0.018mm (0.7mil), providing good adhesion.
The series can also be paired with aluminum-based substrates to create aluminum-based high-frequency materials.
The circuit boards can be processed using standard FR4 board fabrication techniques. The excellent mechanical and physical properties of the material allow for multiple lamination cycles, making it suitable for multi-layer, high-layer-count, and backplane processing. It exhibits excellent processability in dense hole and fine line routing.

Product Models & Data Sheet

Let’s explore the data sheet one by one:

Product Models
WL-CT300
WL-CT330
WL-CT330Z
WL-CT338
WL-CT350
WL-CT440
WL-CT61

Dielectric Constant (Typical):
Test Conditions: 10GHz
WL-CT300: 3.00
WL-CT330: 3.30
WL-CT330Z: 3.30
WL-CT338: 3.38
WL-CT350: 3.48
WL-CT440: 4.10
WL-CT615: 6.1

Dielectric Constant (Design):
Test Conditions: 10GHz
WL-CT300: 2.98
WL-CT330: 3.45
WL-CT330Z: 3.45
WL-CT338: 3.55
WL-CT350: 3.66
WL-CT440: 4.38
WL-CT615: 6.4

Dielectric Constant Tolerance:

WL-CT300: ±0.05
WL-CT330: ±0.06
WL-CT330Z: ±0.06
WL-CT338: ±0.05
WL-CT350: ±0.05
WL-CT440: ±0.08
WL-CT615: ±0.15

Loss Tangent (Typical):
Test Conditions:
2GHz
10GHz
20GHz
WL-CT300: 0.0025 / 0.0030 / 0.0036
WL-CT330: 0.0021 / 0.0026 / 0.0033
WL-CT330Z: 0.0025 / 0.0030 / 0.0035
WL-CT338: 0.0023 / 0.0029 / 0.0038
WL-CT350: 0.0030 / 0.0039 / 0.0048
WL-CT440: 0.0040 / 0.0050 / /
WL-CT615: 0.0032 / 0.0040 / /

Dielectric Constant Temperature Coefficient:
Test Conditions: -55 ºC to 150ºC
Unit: PPM/℃
WL-CT300: 27
WL-CT330: 43
WL-CT330Z: 43
WL-CT338: 45
WL-CT350: 52
WL-CT440: -21
WL-CT615: -122

Peel Strength:
Test Conditions: 1 OZ RTF copper
Unit: N/mm
WL-CT300: 0.85
WL-CT330: 1.0
WL-CT330Z: 0.85
WL-CT338: 1.0
WL-CT350: 0.85
WL-CT440: 1.0
WL-CT615: 0.9

Volume Resistivity

Test Conditions: Standard Condition
Unit: MΩ.cm
WL-CT300: 3×10^8
WL-CT330: 5×10^9
WL-CT330Z: 5×10^9
WL-CT338: 6×10^9
WL-CT350: 1×10^9
WL-CT440: 1×10^9
WL-CT615: 2×10^

Surface Resistivity:
Test Conditions: Standard Condition
Unit: MΩ
WL-CT300: 2×10^8
WL-CT330: 5×10^9
WL-CT330Z: 5×10^9
WL-CT338: 7×10^8
WL-CT350: 4×10^9
WL-CT440: 5×10^7
WL-CT615: 5×10^6

Electrical Strength (Z direction):
Test Conditions: 5KW, 500V/s
Unit: KV/mm
WL-CT300: 28
WL-CT330: 22
WL-CT330Z: 22
WL-CT338: 31
WL-CT350: 31
WL-CT440: 27
WL-CT615: 30

Breakdown Voltage (XY direction):
Test Conditions: 5KW, 500V/s
Unit: KV
WL-CT300: 35
WL-CT330: 22
WL-CT330Z: 22
WL-CT338: 30
WL-CT350: 30
WL-CT440: 25
WL-CT615: 25

Coefficient of Thermal Expansion (X, Y direction):
Test Conditions: -55 ºC to 288ºC
Unit: ppm/ºC
WL-CT300: 15, 14
WL-CT330: 15, 13
WL-CT330Z: 15, 13
WL-CT338: 14, 16
WL-CT350: 11, 14
WL-CT440: 14, 18
WL-CT615: 15, 17

Coefficient of Thermal Expansion (Z direction):
Test Conditions: -55 ºC to 288ºC
Unit: ppm/ºC
WL-CT300: 31
WL-CT330: 39
WL-CT330Z: 39
WL-CT338: 50
WL-CT350: 34
WL-CT440: 35
WL-CT615: 33

Thermal Stress:
Test Conditions: 288℃, 10s, 3 times
Result: No Delamination

Water Absorption:
Test Conditions: 20±2℃, 24 hours
Unit: %
WL-CT300: 0.15
WL-CT330: 0.02
WL-CT330Z: 0.05
WL-CT338: 0.04
WL-CT350: 0.05
WL-CT440: 0.12
WL-CT615: 0.08

Density:
Test Conditions: Room Temperature
Unit: g/cm3
WL-CT300: 1.57
WL-CT330: 1.82
WL-CT330Z: 1.78
WL-CT338: 1.78
WL-CT350: 1.90
WL-CT440: 2.00
WL-CT615: 2.18

Long-Term Operating Temperature:
Test Conditions: High-Low Temperature Chamber
Unit: ℃
WL-CT300: -55 to +260
WL-CT330: -55 to +260
WL-CT330Z: -55 to +260
WL-CT338: -55 to +260
WL-CT350: -55 to +260
WL-CT440: -55 to +260
WL-CT615: -55 to +260

Flammability:
Test Conditions: UL 94
WL-CT300: V-0
WL-CT330: V-0
WL-CT330Z: V-0
WL-CT338: V-0
WL-CT350: V-0
WL-CT440: V-0
WL-CT615: V-

Product Technical Parameters			Product Models & Data Sheet
Product Features	Test Conditions	Unit	WL-CT300	WL-CT330	WL-CT330Z	WL-CT338	WL-CT350	WL-CT440	WL-CT615
Dielectric Constant (Typical)	10GHz	/	3.00	3.30	3.30	3.38	3.48	4.10	6.15
Dielectric Constant (Design)	10GHz	/	2.98	3.45	3.45	3.55	3.66	4.38	6.4
Dielectric Constant Tolerance	/	/	±0.05	±0.06	±0.06	±0.05	±0.05	±0.08	±0.15
Loss Tangent (Typical)	2GHz	/	0.0025	0.0021	0.0025	0.0023	0.0030	0.0040	0.0032
	10GHz	/	0.0030	0.0026	0.0030	0.0029	0.0039	0.0050	0.0040
	20GHz	/	0.0036	0.0033	0.0035	0.0038	0.0048	/	/
Dielectric Constant Temperature Coefficient	-55 º~150ºC	PPM/℃	27	43	43	45	52	-21	-122
Peel Strength	1 OZ RTF copper	N/mm	0.85	1.0	0.85	1.0	0.85	1.0	0.9
Peel Strength	1 OZ RTFcopper	N/mm	0.72	0.72	0.72	0.72	0.72	Not compatible	Not compatible
Volume Resistivity	Standard Condition	MΩ.cm	3×10^8	5×10^9	5×10^9	6×10^9	1×10^9	1×10^9	2×10^7
Surface Resistivity	Standard Condition	MΩ	2×10^8	5×10^9	5×10^9	7×10^8	4×10^9	5×10^7	5×10^6
Electrical Strength (Z direction)	5KW，500V/s	KV/mm	28	22	22	31	31	27	30
Breakdown Voltage (XY direction)	5KW，500V/s	KV	35	22	22	30	30	25	25
Coefficientof Thermal Expansion (X, Y direction)	-55 º~288ºC	ppm/ºC	15, 14	15, 13	15, 13	14, 16	11, 14	14, 18	15, 17
Coefficientof Thermal Expansion (Z direction)	-55 º~288ºC	ppm/ºC	31	39	39	50	34	35	33
Thermal Stress	288℃, 10s，3 times	/	No Delamination	No Delamination	No Delamination	No Delamination	No Delamination	No Delamination	No Delamination
Water Absorption	20±2℃, 24 hours	%	0.15	0.02	0.05	0.04	0.05	0.12	0.08
Density	Room Temperature	g/cm3	1.57	1.82	1.78	1.78	1.90	2.00	2.18

Long-Term Operating Temperature	High-Low Temperature Chamber	℃	-55～+260	-55～+260	-55～+260	-55～+260	-55～+260	-55～+260	-55～+260
Thermal Conductivity	Z direction	W/(M.K)	0.41	0.59	0.59	0.70	0.70	0.66	0.72
PIM	Paired with RTF copper foil.	dBc	≤-158	≤-157	≤-157	≤-158	≤-157	N/A	N/A
Flammability	UL-94	Grade	V-0	Non-flame retardant	V-0	Non-flame retardant	V-0	V-0	V-0
TG	Standard	℃	>280℃	>280℃	>280℃	>280℃	>280℃	>280℃	>280℃
TD	Initial Value	℃	412	421	386	421	386	402	398
Halogen			Yes	No	Yes	No	Yes	Yes	No
Material Composition			Hydrocarbon + Ceramic + Fiberglass cloth

Our PCB Capability (WL-CT)

Our capabilities include the following specifications:

Layer count: We can manufacture single-sided, double-sided PCBs, as well as multilayer PCBs and hybrid PCBs.

Copper weight: We offer options for copper weight, including 1oz (35µm) and 2oz (70µm).

Dielectric thickness:
For ED Copper:
4mil (with no TRF Copper)
8mil with TRF Copper of 8.7mil
12mil (with no TRF Copper)
16mil (with no TRF Copper)
20mil with TRF Copper of 20.7mil
28mil (with no TRF Copper)
32mil with TRF Copper of 32.7mil
40mil with TRF Copper of 40.7mil
60mil with TRF Copper of 60.7mil
80mil with TRF Copper of 80.7mil

PCB size: We can accommodate PCB sizes up to 400mm X 500mm.

Solder mask: We offer a range of solder mask colors such as green, black, blue, yellow, red, and more.

Surface finish: Our surface finish options include bare copper, HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), immersion silver, immersion tin, OSP (Organic Solderability Preservative), pure gold, ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), and more.

PCB Capability (WL-CT Series)
PCB Material:	Hydrocarbon resin, ceramic, and glass fiber cloth
Designation (WL-CT Series)	Designation	DK	DF
	WL-CT300	3.0±0.05	0.0030
	WL-CT330	3.3±0.06	0.0026
	WL-CT330Z	3.3±0.06	0.0030
	WL-CT338	3.38±0.05	0.0029
	WL-CT350	3.48±0.05	0.0039
	WL-CT440	4.1±0.08	0.0050
	WL-CT615	6.15±0.15	0.0040
Layer count:	Single Sided, Double Sided PCB, Multilayer PCB, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
Dielectric thickness	ED Copper	TRF Copper
	4mil	/
	8mil	8.7mil
	12mil	/
	16mil	/
	20mil	20.7mil
	28mil	/
	32mil	32.7mil
	40mil	40.7mil
	60mil	60.7mil
	80mil	80.7mil
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold, ENEPIG etc..

A WL-CT PCB and Applications

Displayed on the screen is a double-sided 1.6mm WL-CT338 PCB with immersion gold coating specifically designed for filters. WL-CT PCBs are versatile and widely used in various applications, including:
Base station antennas and satellite antennas.
Automotive radar, sensors, and navigation systems.
Power amplifiers.
Satellite high-frequency heads.
RF devices and filters.
WIMAX antennas and distributed antennas.
Small-sized patch antennas.

Final (WL-CT series aluminum-based boards)

This series of laminates provides aluminum-based substrates, where one side of the dielectric layer is covered with copper foil, and the other side is covered with an aluminum-based layer. It serves for shielding or heat dissipation purposes. The model numbers are WL-CT***-AL. For instance, WL-CT350-AL represents WL-CT350 with an aluminum-based substrate.