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WL-CT330 PCB 2-layer 20mil

Shipped: 30th-September-2024

1. Introduction of WL-CT330
Wangling's WL-CT330 organic polymer ceramic fiberglass cloth-covered copper clad laminates are a thermosetting resin-based high-frequency materials. The composition of the dielectric layer includes hydrocarbon resin, ceramics, and fiberglass cloth. It exhibits low loss performance, meeting the requirements for high-frequency designs. PCB processing can be carried out using techniques similar to FR4 materials, making it simpler compared to PTFE materials and ensuring better stability and consistency in circuitry. It can be used as a substitute for similar foreign products.

The combination of hydrocarbon resin and composite ceramics provides excellent low loss, high-temperature resistance, and temperature stability characteristics. The series of materials have a stable temperature coefficient of dielectric constant and loss, low thermal expansion coefficient, and a high TG value of above 280°C.

TSM-DS3 was developed for high power applications (TC = 0.65 W/m*K) where it is necessary for the dielectric material to conductheat away from other heat sources in a PWB design. TSM-DS3 was also developed to have very low coefficients of thermal expansionfor demanding thermal cycling.

2. Features
- Dielectric constant of 3.3 at 10 GHz/23°C
- Dissipation factor of 0.0026 at 10GHz
- Excellent TCDK of 43 ppm/°C
- High Thermal conductivity of 0.59 W/MK
- Low Moisture Absorption 0.02%
- Matched to copper CTE in X-axis of 15 ppm/°C, Y-axis of 13 ppm/°C and Z-axix of 39 ppm/°C

3. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
WL-CT330 - 0.508 mm (20mil)
Copper_layer_2 - 35 μm

4. PCB Construction details:
- Board dimensions: 79.95mm x 40.84 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 5/5 mils
- Minimum Hole Size: 0.3mm
- No Blind vias.
- Finished board thickness: 0.6mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion gold
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment

5. PCB Statistics:
Components: 17
Total Pads: 57
Thru Hole Pads: 36
Top SMT Pads: 21
Bottom SMT Pads: 0
Vias: 43
Nets: 2

6. Type of artwork supplied: Gerber RS-274-X

7. Accepted standard: IPC-Class-2

8. Availability: worldwide

9. Some Typical Applications:
- Base station antennas and satellite antennas.
- Automotive radar, sensors, and navigation systems.
- Power amplifiers.
- Satellite high-frequency heads.
- RF devices and filters.
- WIMAX antennas and distributed antennas.

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