1. Introduction of WL-CT300
Wangling's WL-CT300 organic polymer ceramic fiberglass cloth-covered copper clad laminates are a thermosetting resin-based high-frequency materials. The composition of the dielectric layer includes hydrocarbon resin, ceramics, and fiberglass cloth. It exhibits low loss performance, meeting the requirements for high-frequency designs. PCB processing can be carried out using techniques similar to FR4 materials, making it simpler compared to PTFE materials and ensuring better stability and consistency in circuitry. It can be used as a substitute for similar foreign products.

2. Features
- Dielectric constant of 3.0 at 10 GHz/23°C
- Dissipation factor of 0.003 at 10GHz
- Excellent TCDK of 27 ppm/°C
- High Thermal conductivity of 0.41 W/MK
- Low Moisture Absorption 0.15%
- Matched to copper CTE in X-axis of 15 ppm/°C, Y-axis of 14 ppm/°C and Z-axix of 31 ppm/°C