Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
+86-755-27374946
info@bicheng-enterprise.com
WELCOME TO BICHENG

 

 

 

 

5mil TSM-DS3 2-layer RF PCB

Shipped: 25th-April-2024  

1. Introduction of TSM-DS3
TSM-DS3 is a ceramic-filled reinforced material with very lowfiberglass content (~ 5%) that rivals epoxies in fabricating large format complex multilayers.

TSM-DS3 is a thermally stable, industry leading low loss core (Df = 0.0011 at 10 GHz) that can be manufactured with thepredictability and consistency of the best fiberglass reinforced epoxies.
TSM-DS3 was developed for high power applications (TC = 0.65 W/m*K) where it is necessary for the dielectric material to conductheat away from other heat sources in a PWB design. TSM-DS3 was also developed to have very low coefficients of thermal expansionfor demanding thermal cycling.
2. Features
- Dielectric constant of 3.0 with tight tolerance 0.05 at 10 GHz/23°C
- Dissipation factor of 0.0014 at 10GHz
- High Thermal conductivity (unclad) of 0.65 W/MK
- Low Moisture Absorption 0.07%
- Matched to copper CTE in X-axis of 10 ppm/°C, Y-axis of 16 ppm/°C and Z-axix of 23 ppm/°C
3. Benifits
- Low (~5%) Fiberglass Content
- Dimensional Stability Rivals Epoxy
- Enables Large Format High Layer Count PCBs
- Builds Complex PCBs in Yield w/ Consistency and Predictability
- Temperature Stable Dk ± 0.25% (-30 to 120°C)
- Compatible With Resistive Foils
4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
TSM-DS3 - 0.127 mm (5mil)
Copper_layer_2 - 35 μm
5. PCB Construction details:
- Board dimensions: 82mm x 82 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/7 mils
- Minimum Hole Size: 0.4mm
- No Blind vias.
- Finished board thickness: 0.2mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Silver
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: No
- Bottom Solder Mask: No
- 100% Electrical test used prior to shipment
6. PCB Statistics:
Components: 36
Total Pads: 163
Thru Hole Pads: 132
Top SMT Pads: 31
Bottom SMT Pads: 0
Vias: 151
Nets: 2
7. Type of artwork supplied: Gerber RS-274-X
8. Accepted standard: IPC-Class-2
9. Availability: worldwide
10. Some Typical Applications:
- Couplers
- Phased Array Antennas
- Radar Manifolds
- mmWave Antenna/Automotive
- Oil Drilling
- Semiconductor/ATE Testing
 
 
 
 
  PCBBACK TO APRIL
　

Copyright  © Shenzhen Bicheng Electronics Technology Co., Ltd. All rights reserved

Tags Printed Circuit Board, High Frequency PCB, RF PCB, Microwave PCB, Rogers PCB, Rogers RO3003, RO3003G2, RO3010, RO3006, RO3035, RO3203, RO3206, RO3210, Rogers RO4003C, RO4350B, RO4360G2, RO4725JXR, RO4730G3, RO4533, RO4534, RO4535, RO4830, RO4835, RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010, RT/duroid 6035HTC, Rogers TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Rogers Kappa438, CLTE-XT, AD250C, AD255C, AD300D, AD350A, AD450, AD600, AD1000, TC350, TC600, DiClad 880, DiClad 870, DiClad 527, IsoClad 917; Taconic PCB, TLF-35, RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-35, RF-45, RF-10, TRF-45, TLX-0, TLX-9, TLX-8, TLX-7, TLX-6, TLY-3, TLY-5, TLY-5Z, TSM-DS3, PTFE PCB, Wangling RF PCB, F4BM220, F4BME220, F4BTM220, F4BTME220, F4BTMS220