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TSM-DS3 High Frequency PCB
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Material Introduction |
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TSM-DS3 is an exceptional thermally stable material that boasts industry-leading low loss properties with a dissipation factor (DF) of 0.0011 at 10 GHz. It offers the predictability and consistency comparable to the best fiberglass reinforced epoxies available in the market. |
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TSM-DS3 stands out as a ceramic-filled reinforced material with a remarkably low fiberglass content of approximately 5%. This unique composition allows it to rival epoxies in fabricating large format complex multilayers, making it an ideal choice for demanding applications. |
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One of the key highlights of TSM-DS3 is its suitability for high power applications. With a high thermal conductivity (TC) of 0.65 W/m*K, this material efficiently conducts heat away from other heat sources in a printed wiring board (PWB) design. This capability ensures effective heat dissipation and helps maintain optimal performance in high-power scenarios. |
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Moreover, TSM-DS3 has been developed to exhibit very low coefficients of thermal expansion, making it highly suitable for applications that undergo demanding thermal cycling. This exceptional feature enhances the material's performance and reliability, providing stability even in environments with significant temperature variations. |
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Data Sheet |
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Let’s explore the detailed properties and test results of the TSM-DS3 laminates. |
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The Dk value of the TSM-DS3 laminates, tested according to IPC-650 2.5.5.3, is 3.00. |
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The Thermal Coefficient of Dielectric Constant value of the TSM-DS3, measured from -30 to 120 °C using a modified IPC-650 2.5.5.5.1 test, is 5.4 ppm. |
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The Dissipation Factor value of the TSM-DS3 material, determined through a modified IPC-650 2.5.5.5.1 test, is 0.0011. |
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The TSM-DS3 exhibits a dielectric breakdown voltage of 47.5 kV, tested according to IPC-650 2.5.6 (ASTM D 149). |
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The through-plane dielectric strength of the TSM-DS3 PCB, measured by ASTM D 149, is 548 V/mil. |
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The TSM-DS3 material demonstrates an arc resistance of 226 seconds, determined by IPC-650 2.5.1 testing. |
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The TSM-DS3 has a moisture absorption rate of 0.07%, tested according to IPC-650 2.6.2.1. |
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The TSM-DS3 exhibits flexural strength of 11,811 psi (MD) and 7,512 psi (CD), measured by ASTM D 790 or IPC-650 2.4.4. |
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The TSM-DS3 has a tensile strength of 7,030 psi (MD) and 3,830 psi (CD), determined by ASTM D 3039 or IPC-650 2.4.19 testing. |
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The TSM-DS3 demonstrates elongation at break values of 1.6% (MD) and 1.5% (CD), measured by ASTM D 3039 or IPC-650 2.4.19. |
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The TSM-DS3 has Young's modulus values of 973,000 psi (MD) and 984,000 psi (CD), determined by ASTM D 3039 or IPC-650 2.4.19. |
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The Poisson's ratio values of the TSM-DS3 are 0.24 (MD) and 0.20 (CD), measured by ASTM D 3039 or IPC-650 2.4.19. |
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The TSM-DS3 exhibits a compressive modulus of 310,000 psi, tested according to ASTM D 695 (23°C). |
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The peel strength of the TSM-DS3 is 8 lbs/in (CV1), determined by IPC-650 2.4.8 Sec 5.2.2 (TS) testing. |
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The thermal conductivity (unclad) of the TSM-DS3 is 0.65 W/M·K, measured by ASTM F 433 or ASTM 1530-06. |
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The TSM-DS3 demonstrates dimensional stability values of 0.21 mils/in (MD) and 0.20 mils/in (CD) after bake, as well as 0.15 mils/in (MD) and 0.10 mils/in (CD) for thermal stress, tested according to IPC-650 2.4.39. |
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The TSM-DS3 has surface resistivity values of 2.3 x 10^6 Mohms (ET) and 2.1 x 10^7 Mohms (HC), determined by IPC-650 2.5.17.1 Sec. 5.2.1 testing. |
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The volume resistivity values of the TSM-DS3 are 1.1 x 10^7 Mohms/cm (ET) and 1.8 x 10^8 Mohms/cm (HC), measured by IPC-650 2.5.17.1 Sec. 5.2.1. |
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The TSM-DS3 exhibits CTE values of 10 ppm/oC (x-axis), 16 ppm/oC (y-axis), and 23 ppm/oC (z-axis) from room temperature to 125oC, tested according to IPC-650 2.4.41/TMA. |
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The TSM-DS3 has a density of 2.11 g/cm3, determined by ASTM D 792. |
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The hardness of the TSM-DS3, measured using ASTM D 2240 (Shore D), is 79. |
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The TSM-DS3 has a Td of 526oC (2% Weight Loss) and 551oC (5% Weight Loss), determined by IPC-650 2.4.24.6 (TGA) testing. |
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Property |
Test Method |
Unit |
TSM-DS3 |
Unit |
TSM-DS3 |
Dk |
IPC-650 2.5.5.3 |
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3.00 |
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3.00 |
TcK (-30 to 120 °C) |
IPC-650 2.5.5.5.1 (Modified) |
ppm |
5.4 |
ppm |
5.4 |
Df |
IPC-650 2.5.5.5.1 (Modified) |
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0.0011 |
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0.0011 |
Dielectric Breakdown |
IPC-650 2.5.6 (ASTM D 149) |
kV |
47.5 |
kV |
47.5 |
Dielectric Strength |
ASTM D 149 (Through Plane) |
V/mil |
548 |
V/mm |
21,575 |
Arc Resistance |
IPC-650 2.5.1 |
Seconds |
226 |
Seconds |
226 |
Moisture Absorption |
IPC-650 2.6.2.1 |
% |
0.07 |
% |
0.07 |
Flexural Strength (MD) |
ASTM D 790/ IPC-650 2.4.4 |
psi |
11,811 |
N/mm2 |
81 |
Flexural Strength (CD) |
ASTM D 790/ IPC-650 2.4.4 |
psi |
7,512 |
N/mm2 |
51 |
Tensile Strength (MD) |
ASTM D 3039/IPC-650 2.4.19 |
psi |
7,030 |
N/mm2 |
48 |
Tensile Strength (CD) |
ASTM D 3039/IPC-650 2.4.19 |
psi |
3,830 |
N/mm2 |
26 |
Elongation at Break (MD) |
ASTM D 3039/IPC-650 2.4.19 |
% |
1.6 |
% |
1.6 |
Elongation at Break (CD) |
ASTM D 3039/IPC-650 2.4.19 |
% |
1.5 |
% |
1.5 |
Young’s Modulus (MD) |
ASTM D 3039/IPC-650 2.4.19 |
psi |
973,000 |
N/mm2 |
6,708 |
Young’s Modulus (CD) |
ASTM D 3039/IPC-650 2.4.19 |
psi |
984,000 |
N/mm2 |
6,784 |
Poisson’s Ratio (MD) |
ASTM D 3039/IPC-650 2.4.19 |
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0.24 |
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0.24 |
Poisson’s Ratio (CD) |
ASTM D 3039/IPC-650 2.4.19 |
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0.20 |
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0.20 |
Compressive Modulus |
ASTM D 695 (23℃) |
psi |
310,000 |
N/mm2 |
2,137 |
Flexural Modulus (MD) |
ASTM D 790/IPC-650 2.4.4 |
kpsi |
1,860 |
N/mm2 |
12,824 |
Flexural Modulus (CD) |
ASTM D 790/IPC-650 2.4.4 |
kpsi |
1,740 |
N/mm2 |
11,996 |
Peel Strength (CV1) |
IPC-650 2.4.8 Sec 5.2.2 (TS) |
lbs/in |
8 |
N/mm |
1.46 |
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Thermal Conductivity (unclad) |
ASTM F 433/ASTM 1530-06 |
W/M*K |
0.65 |
W/M*K |
0.65 |
Dimensional Stability (MD) |
IPC-650 2.4.39 Sec. 5.4 (After Bake) |
mils/in. |
0.21 |
mm/M |
0.21 |
Dimensional Stability (CD) |
IPC-650 2.4.39 Sec. 5.4 (After Bake) |
mils/in. |
0.20 |
mm/M |
0.20 |
Dimensional Stability (MD) |
IPC-650 2.4.39 Sec. 5.5 (TS) |
mils/in. |
0.15 |
mm/M |
0.15 |
Dimensional Stability (CD) |
IPC-650 2.4.39 Sec. 5.5 (TS) |
mils/in. |
0.10 |
mm/M |
0.10 |
Surface Resistivity |
IPC-650 2.5.17.1 Sec. 5.2.1 (ET) |
Mohms |
2.3 x 10^6 |
Mohms |
2.3 x 10^6 |
Surface Resistivity |
IPC-650 2.5.17.1 Sec. 5.2.1 (HC) |
Mohms |
2.1 x 10^7 |
Mohms |
2.1 x 10^7 |
Volume Resistivity |
IPC-650 2.5.17.1 Sec. 5.2.1 (ET) |
Mohms/cm |
1.1 x 10^7 |
Mohms/cm |
1.1 x 10^7 |
Volume Resistivity |
IPC-650 2.5.17.1 Sec. 5.2.1 (HC) |
Mohms/cm |
1.8 x 10^8 |
Mohms/cm |
1.8 x 10^8 |
CTE (x axis) (RT to 125ºC) |
IPC-650 2.4.41/TMA |
ppm/ºC |
10 |
ppm/ºC |
10 |
CTE (y axis) (RT to 125ºC) |
IPC-650 2.4.41/TMA |
ppm/ºC |
16 |
ppm/ºC |
16 |
CTE (z axis) (RT to 125ºC) |
IPC-650 2.4.41/TMA |
ppm/ºC |
23 |
ppm/ºC |
23 |
Density (Specific Gravity) |
ASTM D 792 |
g/cm3 |
2.11 |
g/cm3 |
2.11 |
Hardness |
ASTM D 2240 (Shore D) |
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79 |
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79 |
Td (2% Weight Loss) |
IPC-650 2.4.24.6 (TGA) |
ºC |
526 |
ºC |
526 |
Td (5% Weight Loss) |
IPC-650 2.4.24.6 (TGA) |
ºC |
551 |
ºC |
551 |
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Our PCB Capability (TSM-DS3) |
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At our PCB manufacturing facility, we take immense pride in our comprehensive capabilities and expertise in producing high-quality printed circuit boards. With years of experience in the industry, we have honed our skills to deliver exceptional results that meet and exceed the expectations of our clients. |
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We offer various options for layer count, including single-sided, double-sided, multi-layer PCBs, and hybrid PCBs. This allows flexibility in accommodating different circuit complexities and functionality requirements. |
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We provide options for copper weight, including 1oz (35μm) and 2oz (70μm). The choice of copper weight depends on the desired conductivity and power requirements of the circuit. |
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We offer a range of dielectric thickness options to meet specific design and performance needs. You can select from 5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm), and 90mil (2.286mm) thicknesses. |
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Our manufacturing capability accommodates PCB sizes up to 400mm X 500mm. This allows flexibility in designing and producing PCBs for a wide range of applications. |
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We offer a variety of solder mask colors, including green, black, blue, yellow, red, and more. The choice of solder mask color is mainly based on personal preference or specific branding requirements. |
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We provide multiple surface finish options to ensure optimal functionality and durability of the PCBs. Some of the available surface finish options include immersion gold, HASL (Hot Air Solder Leveling), immersion silver, immersion tin, ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), OSP (Organic Solderability Preservative), bare copper, and pure gold etc. |
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PCB Capability (TSM-DS3) |
PCB Material: |
Ceramic-filled Woven Fiberglass PTFE Laminates |
Designation: |
TSM-DS3 |
Dielectric constant: |
3 +/-0.05 |
Dissipation factor |
0.0011 |
Layer count: |
Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
Dielectric thickness |
5mil (0.127mm), 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm), 90mil (2.286mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc.. |
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A PCB and Applications |
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On the screen, you can see a 30mil TSM-DS3 PCB with immersion gold on the pads. The TSM-DS3 PCB is utilized in a wide range of fields, which include: 1.Couplers 2. Phased Array Antennas 3. Radar Manifolds 4. mmWave Antennas 5. Oil Drilling 6. Semiconductor/Automatic Test Equipment (ATE) Testing |
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