TP2000 RF PCB 10mm | Bicheng PCB

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Wangling TP2000 High Dk PCB Built on 10mm Substrates with 1oz Copper and Immersion Gold

Shipped: 28th-Sep-2023

The TP2000 PCB combines the advantages of ceramic and polyphenylene ether resin, without glass fiber reinforcement. This unique composition results in outstanding electrical performance and mechanical strength. With a Dielectric Constant of 20 at 5GHz and a Dissipation Factor of 0.002 at 5GHz, TP2000 material ensures low signal loss and high signal integrity, making it ideal for high-frequency applications.

One of the key features of TP2000 PCB is its exceptional thermal stability. It exhibits a Thermal Coefficient of DK (TCDK) of -55 ppm/°C, ensuring consistent electrical performance over a wide temperature range. The material also demonstrates low coefficients of thermal expansion (CTE) in the x, y, and z directions, providing excellent dimensional stability and reliability.

TP2000 PCB offers a wide range of benefits for your designs. With a long-term use temperature range of -100℃ to +150℃, it excels in extreme temperature environments and exhibits excellent resistance to low temperatures. The material is also resistant to irradiation and features low exhaust, making it suitable for applications with stringent environmental requirements.

In terms of manufacturability, TP2000 PCB Material is easy to machine. It can be drilled, turned, ground, sheared, and engraved, giving you flexibility in the manufacturing process and enabling precise customization for your specific design needs. This ease of machining ensures efficient production and reduces time-to-market.

Now, let's explore the construction details of this 2-layer rigid PCB utilizing the TP2000 material. With a board dimension of 92mm x 350mm (± 0.15mm), this PCB offers ample space for your high-performance designs. The minimum Trace/Space of 8/9 mils allows for precise routing, ensuring signal integrity and minimizing crosstalk. The minimum Hole Size of 1.0mm provides versatility in component mounting.

This TP2000 PCB features a core thickness of 394mil (10mm), providing excellent structural integrity and mechanical strength. The outer layers have a finished Cu weight of 1oz (1.4 mils), ensuring optimal conductivity. The via plating thickness of 20 μm guarantees reliable interconnections between layers. The surface finish of Immersion Gold offers a solderable surface and enhances the durability of the PCB.

To maintain a streamlined design, this TP2000 PCB does not require top or bottom Silkscreen or Solder Mask. However, rest assured that each PCB undergoes a comprehensive 100% electrical test prior to shipment, ensuring optimal performance and reliability.

The PCB Statistics of this particular design include 33 components, with a total of 61 pads. Among the pads, there are 36 thru-hole pads and 25 top SMT pads. The PCB features 41 vias and 4 nets, providing the necessary connectivity for your circuitry.

Our TP2000 PCB adheres to the widely accepted Gerber RS-274-X artwork standard and meets the stringent IPC-Class-2 quality standard. This ensures reliable performance and compliance with industry requirements. Our TP2000 PCB is available worldwide, allowing customers from all regions to access its advanced features and benefits.

The TP2000 PCB finds its application in various industries. It is an ideal choice for Beidou, bullet load, fuze, and miniaturized antenna designs. With its exceptional electrical properties, mechanical strength, and resistance to extreme temperatures, TP2000 PCB provides a reliable solution for demanding applications.

For any technical inquiries or further information, please don't hesitate to contact us at sales@bicheng-enterprise.com. Our dedicated team is ready to assist you with any questions and guide you towards the perfect solution for your specific PCB design requirements.

Item	Value
TP2000 PCB Material	- Ceramic / polyphenylene ether resin (PPO), No glass fiber reinforcement
	- Dielectric Constant at 5 GHz: 20
	- Dissipation Factor at 5 GHz: 0.002
	- Thermal Coefficient of DK (TCDK): -55 ppm/°C
	- x CTE: 35 ppm/°C
	- y CTE: 35 ppm/°C
	- z CTE: 40 ppm/°C
Stackup	2-layer rigid PCB
	Copper_layer_1: 35 μm (1oz)
	TP2000 Core: 394 mil (10mm)
	Copper_layer_2: 35 μm (1oz)
Construction Details	Board Dimensions: 92 mm x 350 mm (1 PCS), +/- 0.15 mm
	Minimum Trace/Space: 8/9 mils
	Minimum Hole Size: 1.0 mm
	No Blind Vias
	Finished Board Thickness: 10 mm
	Finished Cu Weight: 1 oz (1.4 mils) outer layers
	Via Plating Thickness: 20 μm
	Surface Finish: Immersion Gold
	Top Silkscreen: No
	Bottom Silkscreen: No
	Top Solder Mask: No
	Bottom Solder Mask: No
	100% Electrical Test Used Prior to Shipment
PCB Statistics	Components: 33
	Total Pads: 61
	Thru Hole Pads: 36
	Top SMT Pads: 25
	Bottom SMT Pads: 0
	Vias: 41
	Nets: 4
Type of Artwork Supplied	Gerber RS-274-X
Quality Standard	IPC-Class-2
Availability	Worldwide
Features	- Long-term use temperature of -100°C to +150°C, excellent resistance to low temperature
	- Resistant to irradiation, low exhaust
	- Easy to be machined and can be drilled, turned, ground, sheared, engraved
Applications	- Ideal material for Beidou, bullet load, fuze, miniaturized antenna

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