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TMM6 PCB 2-layer 25mil High Frequency PCB

Shipped: 27th-FEB-2024

1. TMM6 Introduction
Rogers TMM 6 thermoset microwave material is a ceramic thermoset polymer composite designed for high plated thru-hole reliability strip-line and micro-strip applications.

TMM 6 laminates offer a combination of the benefits of both ceramic and traditional PTFE microwave circuit laminates without requiring the specialized production techniques common to those materials, all at a unique dielectric constant (Dk) compared to other materials in the product family.

2. Features - Dielectric constant (Dk) of 6.0 +/- .08 at 10GHz - Dissipation factor of .0023 at 10GHz - Thermal coefficient of Dk of -11 ppm/°K - Coefficient of thermal expansion matched to copper - Decomposition Temperature (Td) of 425 °C TGA - Coefficient of Thermal Expansion - x y z : 18 ppm/K, 18 ppm/K, 26 ppm/K - Thermal Conductivity of 0.72W/mk - Available in a thickness range of .0015 to .500 inches +/- .0015”

3. Benefits - Mechanical properties resist creep and cold flow - Resistant to process chemicals, reducing damage during fabrication - Based on a thermoset resin, allowing for reliable wire-bonding - All common PCB processes can be used with TMM 6 materials

4. PCB Stackup: 2-layer rigid PCB Copper_layer_1 - 35 μm Rogers TMM6 Core - 0.635 mm (25mil) Copper_layer_2 - 35 μm

5. PCB Construction details: - Board dimensions: 56.04mm x 53.18 mm=1PCS, +/- 0.15mm - Minimum Trace/Space: 4/4 mils - Minimum Hole Size: 0.3mm - No Blind vias. - Finished board thickness: 0.7mm - Finished Cu weight: 1oz (1.4 mils) outer layers - Via plating thickness: 20 μm - Surface finish: Immersion Silver - Top Silkscreen: No - Bottom Silkscreen: No - Top Solder Mask: No - Bottom Solder Mask: No - 100% Electrical test used prior to shipment

6. PCB Statistics: Components: 16 Total Pads: 33 Thru Hole Pads: 23 Top SMT Pads: 10 Bottom SMT Pads: 0 Vias: 15 Nets: 3

7. Type of artwork supplied: Gerber RS-274-X

8. Quality standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications: - RF and microwave circuitry - Power amplifiers and combiners - Filters and coupler - Satellite communication systems - Global Positioning Systems Antennas - Patch Antennas - Dielectric polarizers and lenses - Chip testers

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