The TMM 3 PCB material is a cutting-edge solution engineered with a combination of ceramic, hydrocarbon, and thermoset polymer composites. This innovative material offers exceptional performance and reliability for a wide range of applications. With impressive properties and features, the TMM3 PCB material is designed to meet the most demanding requirements of modern electronic designs.

The TMM 3 PCB material exhibits a process dielectric constant (Dk) of 3.27 +/- .032 at 10 GHz/23°C, ensuring excellent signal integrity and minimal power loss. It boasts a dissipation factor of 0.002 at 10 GHz/23°C, enabling efficient transmission of high-frequency signals. The thermal coefficient of Dk of 37 ppm/°C during the temperature range of -55°C to 125°C ensures dimensional stability and reliable performance across extreme operating conditions. The material is designed to withstand temperatures from -40℃ to +85℃, making it suitable for various environments.

Key Features and Benefits:

• Coefficient of thermal expansion matched to copper, ensuring reliable and stable connections.

• Available in a thickness range of .0015 to .500 inches (+/- .0015”), providing flexibility for diverse design requirements.

• Mechanical properties resist creep and cold flow, enhancing the durability and longevity of the PCB.

• Resistant to process chemicals, reducing the risk of damage during fabrication and ensuring consistent performance.

• Material does not require a sodium napthanate treatment prior to electroless plating, simplifying the manufacturing process.

• Based on a thermoset resin, allowing for reliable wire-bonding and ensuring secure interconnections.

Construction Details:

Board dimensions: 155.1mm x 168.12mm (± 0.15mm)
Minimum Trace/Space: 7/7 mils, allowing for precise and intricate circuit layouts.
Minimum Hole Size: 0.45mm, facilitating versatile component mounting.
No blind vias, providing simplicity in design and manufacturing.
Finished board thickness: 1.6mm, ensuring robustness and durability.
Finished Cu weight: 1 oz (1.4 mils) outer layers, promoting reliable conductivity.
Via plating thickness: 20 μm, ensuring excellent electrical connections.
Surface finish: Hot Air Soldering Level (HASL), providing a reliable soldering surface.
Top Silkscreen: White, enhancing visibility and readability.
Bottom Silkscreen: No, for a clean and minimalist appearance.
Top Solder Mask: Green, offering protection for your valuable circuitry.
Bottom Solder Mask: No, maintaining a sleek and professional look.
Each PCB undergoes a comprehensive 100% electrical test prior to shipment, ensuring optimal performance and reliability.

PCB Statistics:

Components: 39
Total Pads: 117
Thru Hole Pads: 92
Top SMT Pads: 25
Bottom SMT Pads: 0
Vias: 129
Nets: 5

Some Typical Applications:

RF and microwave circuitry, ensuring efficient signal transmission and reception.
Power amplifiers and combiners, delivering high-performance power management.
Filters and couplers, enabling precise frequency control and signal manipulation.
Satellite communication systems, providing reliable connectivity in space-based applications.
Global Positioning Systems Antennas, supporting accurate positioning and navigation.
Patch Antennas, facilitating wireless communication in various devices.
Dielectric polarizers and lenses, enabling efficient light manipulation in optical systems.
Chip testers, ensuring reliable testing and evaluation of integrated circuits.