TMM3 High Frequency PCB

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TMM3 High Frequency PCB Double Layer 20mil Substrates

Shipped: 30th-JAN-2024

1. TMM3 Introduction
Rogers TMM 3 thermoset microwave material is a ceramic thermoset polymer composite designed for high plated thru-hole reliability strip-line and micro-strip applications.

TMM 3 laminates combine many of the benefits of both ceramic and traditional PTFE microwave circuit laminates without requiring the specialized production techniques common to those materials. TMM 3 laminates are based on thermoset resins, making them reliable for wire-bonding without pad lifting or substrate deformation.

2. Features
- Dielectric constant (Dk) of 3.27 +/- .032 at 10GHz
- Dissipation factor of .0020 at 10GHz
- Thermal coefficient of Dk of 37 ppm/°K
- Coefficient of thermal expansion matched to copper
- Decomposition Temperature (Td) of 425 °C TGA
- Coefficient of Thermal Expansion - x y z : 15 ppm/K, 15 ppm/K,23 ppm/K
- Thermal Conductivity of 0.7W/mk
- Available in a thickness range of .0015 to .500 inches +/- .0015”

3. Benefits
- Mechanical properties resist creep and cold flow
- Resistant to process chemicals, reducing damage during fabrication
- Material does not require a sodium napthanate treatment prior to electroless plating
- Based on a thermoset resin, allowing for reliable wire-bonding

4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
Rogers TMM3 Core - 0.508 mm (20mil)
Copper_layer_2 - 35 μm

5. PCB Construction details:
- Board dimensions: 51mm x 25 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 4/7 mils
- Minimum Hole Size: 0.4mm
- No Blind vias.
- Finished board thickness: 0.6mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Immersion Gold
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: Green
- Bottom Solder Mask: Green
- 100% Electrical test used prior to shipment

6. PCB Statistics:
Components: 15
Total Pads: 26
Thru Hole Pads: 17
Top SMT Pads: 9
Bottom SMT Pads: 0
Vias: 12
Nets: 2

7. Type of artwork supplied: Gerber RS-274-X

8. Quality standard: IPC-Class-2

9. Availability: worldwide

10. Some Typical Applications:
- RF and microwave circuitry
- Power amplifiers and combiners
- Filters and coupler
- Satellite communication systems
- Global Positioning Systems Antennas
- Patch Antennas
- Dielectric polarizers and lenses
- Chip testers

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