TMM13i Microwave PCB

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TMM13i Microwave PCB

Introduction
Welcome back to our channel. My name is Ivy, the regional sales manager for Bicheng PCB. Today, we’re going to introduce TMM13i PCB, a type of thermoset microwave PCB from Rogers Corporation.

TMM 13i microwave material has an isotropic dielectric constant (Dk). It is a ceramic thermoset polymer composite designed for strip-line and micro-strip applications that require high plated thru-hole reliability. Like other materials in the TMM series, TMM 13i combines a number of the desirable features of ceramic and PTFE substrates, with the simplicity of soft substrate processing techniques.

Here’s the data sheet of TMM13i.

TMM13i Typical Properties
One of the standout features of TMM13i is its high dielectric constant(Dk) of 12.2, which remains consistent across a wide frequency range of 8GHz to 40 GHz, as measured by the Differential Phase Length Method.

The process Dk is 12.85±0.35 at 10 GHz, as measured by IPC-TM-650 2.5.5.5.

TMM13i possesses a low dissipation factor of 0.0019 at 10 GHz, ensuring that signals remain clear and strong.

Additionally, it has an insulation resistance of over 2000 Gohm, as measured by C/96/60/95 ASTM D257 and a high electrical strength of 213 V/mil, as measured by IPC-TM-650 method 2.5.6.2.

This high insulation resistance and electrical strength make TMM13i an excellent choice for applications where electrical isolation is critical, such as in high-voltage applications.

In terms of thermal properties, It has a thermal coefficient of dielectric constant of -70 ppm/°K over a temperature range of -55℃ to 125℃, as measured by IPC-TM-650 2.5.5.5.

TMM13i has a high decomposition temperature (Td) of 425℃, as determined by ASTM D3850, making it ideal for use in high-temperature environments.

Furthermore, It has a low coefficient of thermal expansion of 19 ppm/°K in the X and Y directions, and 20 ppm/°K in the Z direction, as measured by ASTM E 831 IPC-TM-650, 2.4.41.

The isotropic CTE is very closely matched to copper of 17 ppm/°K, allowing for production of high reliability plated through holes and low etch shrinkage values.

When it comes to mechanical properties, TMM13i has a copper peel strength of 4.0 lb/inch (0.7 N/mm) after solder float with 1 oz. ED copper, as measured by IPC-TM-650 Method 2.4.8.

Finally, TMM13i has a moisture absorption rate of 0.16% at 1.27mm (50mil) thickness and 0.13% at 3.18mm (125mil) thickness, as determined by ASTM D570.

It also has a specific gravity of 3 and is lead-free process compatible, making it a great choice for environmentally conscious applications.

Property		TMM13i	Direction	Units	Condition	Test Method
Dielectric Constant,εDesign		12.2	-	-	8GHz to 40 GHz	Differential Phase Length Method
Dielectric Constant,εProcess		12.85±0.35	Z		10 GHz	IPC-TM-650 2.5.5.5
Dissipation Factor (process)		0.0019	Z	-	10 GHz	IPC-TM-650 2.5.5.5
Insulation Resistance		>2000	-	Gohm	C/96/60/95	ASTM D257
Electrical Strength (dielectric strength)		213	Z	V/mil	-	IPC-TM-650 method 2.5.6.2
Thermal Properties
Thermal Coefficient of dielectric constant		-70	-	ppm/°K	-55℃-125℃	IPC-TM-650 2.5.5.5
Decompositioin Temperature(Td)		425	425	℃TGA	-	ASTM D3850
Coefficient of Thermal Expansion - X		19	X	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y		19	Y	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z		20	Z	ppm/K	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Mechanical Properties
Copper Peel Strength after Thermal Stress		4.0 (0.7)	X,Y	lb/inch (N/mm)	after solder float 1 oz. EDC	IPC-TM-650 Method 2.4.8
Physical Properties
Moisture Absorption	1.27mm (0.050")	0.16	-	%	D/24/23	ASTM D570
	3.18mm (0.125")	0.13
Specific Gravity		3	-	-	A	ASTM D792
Lead-Free Process Compatible		YES	-	-	-	-

PCB Capability (TMM13i)
For TMM13i PCBs, we can provide you with single-sided boards, double-sided boards, multi-layer boards and hybrid types.

TMM13i PCBs have wide thicknesses. These are the standard thicknesses such as 20 mils, 30 mils, 60 mils,100 mils, 200 mils and 300 mils etc. It’s as thin as 15 mils and as thick as 500 mils for our designers’ option.

Finished copper on tracks can be 1oz and 2oz.

The maximum PCB size on TMM13i is 400mm by 500mm, it can be a single board in the sheet and also can be different designs in this panel.

Solder mask of green, black, blue, red and yellow etc is available in house.

There is a selection of surface finish options available for pads, which includes immersion gold, HASL, immersion silver, immersion tin, ENEPIG, bare copper, OSP, and pure gold etc.

PCB material:	Ceramic Hydrocarbon Thermoset Polymer Composites
Designation:	TMM13i
Dielectric constant:	12.85
Layer count:	Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
PCB thickness:	15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), ?150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.7mm)
Copper weight:	1oz (35µm), 2oz (70µm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Red, Yellow etc.
Surface finish:	Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, Bare copper, OSP, Pure gold plated etc..

A piece of TMM13i PCB
Now on the screen is a type of 125mil TMM13i PCB with immersion gold for global positioning systems antennas.

We can also find its applications in RF and microwave circuitry, power amplifiers and combiners, filters and couplers, patch antennas, dielectric polarizers and lenses etc.

Conclusion
TMM13i laminates can be successfully routed using conventional carbide tools. With appropriate routing conditions and tool selection, useful tool life can exceed 250 linear inches when machining TMM13i circuit boards.

TMM13i consists of a hydrocarbon matrix highly filled with ceramic particles. Some safety measures must be taken when drilling TMM13i materials because of the abrasive nature of the ceramic filler. Whenever possible, we should avoid using tools with high tool surface speeds (>500 SFM) and low chip loads (0.002"/rev. ) because they produce excessive heat and tool wear.

OK thank you for reading. This concludes this episode. See you next time.