TMM 10i PCB 50mi | Bicheng PCB

WELCOME TO BICHENG

Home
Company
Quality
Manufacture
Career
PCB Boards
- Newly Shipped RF PCB
- High Frequency PCB
Contact Us

Rogers TMM10i High Frequency PCB Built on 50mil 1.27mm Substrates with Double Sided Copper and Immersion Tin

Shipped: 23th-Sep-2023

Introducing our advanced TMM10i PCB board, a ceramic-based hydrocarbon composite that offers exceptional performance and reliability for a wide range of applications. Engineered with precision and durability in mind, TMM10i is the perfect choice for RF and microwave circuitry, power amplifiers, filters, antennas, and more.

The TMM10i PCB Material exhibits outstanding electrical properties, making it an ideal solution for high-frequency applications. With a Process Dielectric Constant (Dk) of 9.80 +/- .23 at 10 GHz/23°C and a Dissipation Factor of 0.0020 at 10 GHz/23°C, it ensures excellent signal integrity and low loss, allowing for reliable and efficient performance. The thermal coefficient of Dk, with a range of -43 ppm/°C during -55°C to 125°C, guarantees stability and consistency in varying temperature environments.

One of the key features of TMM10i is its coefficient of thermal expansion, which is carefully matched to copper. This ensures that the material maintains dimensional stability and minimizes the risk of stress-induced failures, even under temperature variations. Additionally, TMM10i is available in a thickness range of .0015 to .500 inches (+/- .0015”), providing flexibility to meet various design requirements.

The mechanical properties of TMM10i are specifically engineered to resist creep and cold flow, ensuring long-term reliability and performance. This material is also highly resistant to process chemicals, reducing the potential for damage during fabrication and enabling efficient manufacturing processes. Unlike other materials, TMM10i does not require a sodium napthanate treatment prior to electroless plating, streamlining the production workflow. Its thermoset resin composition allows for reliable wire-bonding, further enhancing its suitability for advanced applications.

This 2-layer rigid PCB utilizing TMM10i material features a stackup with copper_layer_1 (35 μm), Rogers Core TMM10i with a thickness of 1.27 mm (50mil), and copper_layer_2 (35 μm). This construction ensures optimal signal integrity, excellent thermal management, and mechanical stability for your designs.

With a generous board dimension of 155.1mm x 168.12mm (± 0.15mm), you have ample space to accommodate your circuitry. Achieve precise and intricate designs with a minimum Trace/Space of 5/5 mils. The minimum Hole Size of 0.30mm provides versatility for component mounting. The absence of Blind vias simplifies the manufacturing process. With a finished board thickness of 1.4mm, our TMM10i PCB strikes a balance between durability and space efficiency. The outer layers feature a finished Cu weight of 1 oz (1.4 mils), ensuring excellent conductivity. Reliable electrical connections are guaranteed with via plating thickness of 20 μm. The surface finish of Immersion Tin provides a reliable solderable surface. The absence of Top and Bottom Silkscreen and Solder Masks contributes to a clean and sleek appearance. Each TMM10i PCB undergoes a comprehensive 100% electrical test prior to shipment, ensuring optimal performance and reliability.

Rest assured that our TMM10i PCB adheres to the widely accepted Gerber RS-274-X artwork standard. It also meets the stringent IPC-Class-2 quality standard, ensuring reliable performance and compliance with industry requirements. With worldwide availability, you can access the advanced features and benefits of the TMM10i PCB board no matter where you are located.

The TMM10i PCB Material finds its applications in a variety of industries. It is particularly well-suited for RF and microwave circuitry, power amplifiers, combiners, satellite communication systems, global positioning systems antennas, patch antennas, dielectric polarizers, lenses, and chip testers. Its exceptional electrical performance, thermal stability, and mechanical reliability make it the perfect choice for demanding applications in these domains.

For any technical inquiries or further information, please don't hesitate to contact us at sales@bicheng-enterprise.com. Our dedicated team is ready to assist you with any questions and guide you towards the perfect solution for your specific PCB design requirements.

Item	Value
PCB Material	TMM10i PCB Material
	- Ceramic, Hydrocarbon, Thermoset Polymer Composites
	- Process Dielectric Constant (Dk) at 10 GHz/23°C: 9.80 +/- .23
	- Dissipation Factor at 10 GHz/23°C: 0.0020
	- Thermal Coefficient of Dk: -43 ppm/°C during -55°C to 125°C
	- -40°C to +85°C operation
Features/Benefits	- Coefficient of thermal expansion matched to copper
	- Available in a thickness range of .0015 to .500 inches (+/- .0015”)
	- Mechanical properties resist creep and cold flow
	- Resistant to process chemicals, reducing damage during fabrication
	- Material does not require a sodium napthanate treatment prior to electroless plating
	- Based on a thermoset resin, allowing for reliable wire-bonding
Stackup	2-layer rigid PCB
	Copper_layer_1: 35 μm
	Rogers Core TMM10i: 1.27 mm (50 mil)
	Copper_layer_2: 35 μm
Construction Details	Board Dimensions: 155.1 mm x 168.12 mm (12 PCS), +/- 0.15 mm
	Minimum Trace/Space: 5/5 mils
	Minimum Hole Size: 0.30 mm
	No Blind Vias
	Finished Board Thickness: 1.4 mm
	Finished Cu Weight: 1 oz (1.4 mils) outer layers
	Via Plating Thickness: 20 μm
	Surface Finish: Immersion Tin
	Top Silkscreen: No
	Bottom Silkscreen: No
	Top Solder Mask: No
	Bottom Solder Mask: No
	100% Electrical Test Used Prior to Shipment
PCB Statistics	Components: 59
	Total Pads: 197
	Thru Hole Pads: 141
	Top SMT Pads: 47
	Bottom SMT Pads: 9
	Vias: 162
	Nets: 8
Type of Artwork Supplied	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Availability	Worldwide
Some Typical Applications	- RF and microwave circuitry
	- Power amplifiers and combiners
	- Filters and couplers
	- Satellite communication systems
	- Global Positioning Systems Antennas
	- Patch Antennas
	- Dielectric polarizers and lenses
	- Chip testers

BACK TO SEPTEMBER