TMM10 PCB 25mil | Bicheng PCB

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Rogers TMM 10 PCB Built on 25mil 0.635mm Substrate with Double Sided Copper Layer

Shipped: 10th-Sep-2023

Crafted using advanced ceramic, hydrocarbon, and thermoset polymer composites, this printed circuit board sets a new standard for performance and reliability.

The TMM10 PCB boasts remarkable properties that elevate your designs to new heights. With a process dielectric constant (Dk) of 9.20 +/- .23 at 10 GHz/23°C and a dissipation factor of 0.0022 at the same frequency, this PCB ensures exceptional signal integrity and minimal power loss. Operating seamlessly within a temperature range of -40°C to +85°C, it guarantees reliability and stability across diverse environments. Its thermal coefficient of Dk of -38 ppm/°C during -55°C to 125°C ensures consistent performance even under extreme temperature conditions.

Its coefficient of thermal expansion perfectly matches that of copper, ensuring reliable and consistent performance even under varying thermal conditions. Available in a thickness range of .0015 to .500 inches (+/- .0015”), this PCB caters to a wide range of design requirements. The mechanical properties of the TMM10 PCB resist creep and cold flow, ensuring long-lasting performance. It is highly resistant to process chemicals, minimizing damage during fabrication. Notably, this material does not require a sodium napthanate treatment prior to electroless plating, streamlining the manufacturing process. Based on a thermoset resin, the TMM10 PCB allows for reliable wire-bonding, ensuring robust connections and optimal electrical performance.

This TMM10 PCB features a 2-layer rigid stackup configuration, consisting of copper layer 1 with a thickness of 35 μm, a TMM10 core with a thickness of 0.635 mm (25mil), and copper layer 2 with a thickness of 35 μm. These specifications guarantee superior performance and reliability for your designs.

When it comes to construction details, this TMM10 PCB leaves no room for compromise. With board dimensions of 210mm x 210mm (± 0.15mm), you have ample space to unleash your creativity. It supports a minimum trace/space of 6/6 mils and a minimum hole size of 0.35mm, enabling intricate and compact circuit layouts. With no blind vias, the TMM10 PCB ensures seamless connectivity. The finished board thickness is 0.7mm, and the finished Cu weight is 1 oz (1.4 mils) on outer layers. The via plating thickness is 20 μm, ensuring robust electrical connections. The surface finish is bare copper, providing exceptional conductivity. The PCB does not feature any silkscreen or solder mask layers. Each PCB undergoes a comprehensive 100% electrical test prior to shipment, guaranteeing optimal performance and reliability.

It supports up to 64 components and offers a total of 213 pads, including 162 thru-hole pads, 36 top SMT pads, and 15 bottom SMT pads. With 356 vias and 7 nets, this PCB provides excellent connectivity and signal routing capabilities.

The TMM10 PCB adheres to the IPC-Class-2 quality standard, guaranteeing top-notch performance and reliability. With worldwide availability, this PCB solution is accessible to customers around the globe.

Unleash the power of the TMM10 PCB in a wide range of applications, including RF and microwave circuitry, power amplifiers and combiners, filters and couplers, satellite communication systems, Global Positioning Systems (GPS) antennas, patch antennas, dielectric polarizers and lenses, and chip testers. Its versatility and exceptional performance make it an ideal choice for demanding electronic designs.

For any technical questions or inquiries, please contact us at sales@bicheng-enterprise.com. Harness the power of innovation with the TMM10 PCB and revolutionize your electronic designs.

Item	Value
TMM10 PCB Material	Ceramic, Hydrocarbon, Thermoset Polymer Composites
	Process Dielectric Constant (Dk): 9.20 +/- 0.23 at 10 GHz/23°C
	Dissipation factor: 0.0022 at 10 GHz/23°C
	Thermal coefficient of Dk: -38 ppm/°C during -55°C to 125°C
	-40℃?to +85℃?operation
Features/Benefits	- Coefficient of thermal expansion matched to copper
	- Available in a thickness range of .0015 to .500 inches (+/- .0015”)
	- Mechanical properties resist creep and cold flow
	- Resistant to process chemicals, reducing damage during fabrication
	- Material does not require a sodium napthanate treatment prior to electroless plating
	- Based on a thermoset resin, allowing for reliable wire-bonding
Stackup	2-layer rigid PCB
	Copper Layer 1: 35 μm
	Rogers Core TMM10: 0.635 mm (25 mil)
	Copper Layer 2: 35 μm
Construction Details	Board dimensions: 210 mm x 210 mm (1 PC), +/- 0.15 mm
	Minimum Trace/Space: 6/6 mils
	Minimum Hole Size: 0.35 mm
	No blind vias
	Finished board thickness: 0.7 mm
	Finished Cu weight: 1 oz (1.4 mils) outer layers
	Via plating thickness: 20 μm
	Surface finish: Bare copper
	Top Silkscreen: No
	Bottom Silkscreen: No
	Top Solder Mask: No
	Bottom Solder Mask: No
	100% Electrical test used prior to shipment
PCB Statistics	Components: 64
	Total Pads: 213
	Thru Hole Pads: 162
	Top SMT Pads: 36
	Bottom SMT Pads: 15
	Vias: 356
	Nets: 7
Type of artwork supplied	Gerber RS-274-X
Accepted standard	IPC-Class-2
Availability	Worldwide
Some Typical Applications	- RF and microwave circuitry
	- Power amplifiers and combiners
	- Filters and couplers
	- Satellite communication systems
	- Global Positioning Systems Antennas
	- Patch Antennas
	- Dielectric polarizers and lenses
	- Chip testers

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