TMM10 High Frequency PCB Supplier

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TMM10 High Frequency PCB

Introduction
Hello and welcome back to our channel. My name is Jane, and I work for Bicheng PCB as the regional sales manager. Today, I am going to discuss about a type of thermoset microwave material ----TMM10 PCB.

Rogers TMM 10 PCB is a ceramic thermoset polymer composite designed for high PTH hole reliability on strip-line and micro-strip applications. It offers the benefits of both PTFE and ceramic based substrates, but is not limited by the same mechanical properties and production techniques.

Let's start by reviewing the TMM10 data sheet.

TMM10 Typical Properties
We can see that TMM10 is high dielectric constant material, process Dk valuing 9.2. High DK material is helpful for these devices which need small volume in size such as filters and couplers etc.

Dissipation factor is as low as 0.0022 at 10 GHz.

Thermal coefficient of dielectric constant, also known as the temperature coefficient of dielectric constant (TCDk) comes next.

TCDk less than |50| ppm/°C is considered desirable for all materials as DK changes with temperature.

TMM10 has a TCDk of 38 absolute value here, indicating that it has a good TCDk value and is ideal for application in areas such as automotive electronics or 5G base station etc. where boards have to be mounted in highly variable temperature environments.

Volume resistivity and surface resistivity are good.

The decomposition temperature(Td) can bear 425℃(Thermogravimetric Analysis - TGA). This is a safe temperature during PCB assembly.

Coefficient of thermal expansion in X Y Z is similar to that of copper, this ensure its mechanical properties resist creep and cold flow.

TMM10 is a sort of thermal management board with a thermal conductivity of 0.76 W/m/K.

Then next, the copper peel strength after thermal stress is 5.0 lbs/inch (0.9 N/mm).

The flexural strength in machine direction and cross direction is 13.62 Kpsi, and flexural modulus is 1.79 Mpsi.

Moisture absorption for 1.27mm material is 0.09% and 0.2% for 3.18mm thickness.

The specific gravity is 2.77 and the specific heat capacity is 0.74 J/g/K.

TMM10 is lead free process compatible.

TMM10 Typical Value
Property		TMM10	Direction	Units	Condition	Test Method
Dielectric Constant, ?εProcess		9.20±0.23	Z		10 GHz	IPC-TM-650 2.5.5.5
Dielectric Constant, ??εDesign		9.8	-	-	8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor (process)		0.0022	Z	-	10 GHz	IPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant		-38	-	ppm/℃	-55℃-125℃	IPC-TM-650 2.5.5.5
Volume Resistivity		2 x 108	-	Mohm.cm	-	ASTM D257
Surface Resistivity		4 x 107	-	Mohm	-	ASTM D257
Decomposition Temperature(Td)		425	425	℃TGA	-	ASTM D3850
Coefficient of Thermal Expansion - X Y Z		21,21,20	X,Y,Z	ppm/℃	0 to 140 ℃	ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity		0.76	Z	W/m/K	80 ℃	ASTM C518
Copper Peel Strength after Thermal Stress		5.0 (0.9)	X,Y	lbs/inch (N/mm)	after solder float 1 oz. EDC	IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)		13.62	X,Y	kpsi	A	ASTM D790
Flexural Modulus (MD/CMD)		1.79	X,Y	Mpsi	A	ASTM D790
Moisture Absorption	1.27mm (0.050")	0.09	-	%	D/24/23	ASTM D570
	3.18mm (0.125")	0.2
Specific Gravity		2.77	-	-	A	ASTM D792
Specific Heat Capacity		0.74	-	J/g/K	A	Calculated
Lead-Free Process Compatible		YES	-	-	-	-

PCB Capability (TMM10)
The table on the screen shows our PCB capability on TMM10 material.

We have single layer board, double layer board, multi-layer board and hybrid designs available. Finished copper on tracks can be 1oz and 2oz.

TMM10 PCBs are available in a variety of thicknesses, including the commonly used 20 mils, 30 mils, 50 mils, and 60 mils. There are also high thicknesses such as 200 mils, 300 mils, and 500 mils, among others.

Our maximum PCB size on high frequency materials is 400mm by 500mm, which can be a single board in the sheet or multiple designs in this panel.

Solder masks in green, black, blue,red and yellow etc are available in house.

Immersion gold, HASL, immersion silver, and immersion tin, as well as OSP, ENEPIG, and pure gold are available to protect the SMD pads.

PCB material:	Ceramic, Hydrocarbon, Thermoset Polymer Composites
Designation:	TMM10
Dielectric constant:	9.20 ±0.23
Layer count:	Double layer, Multi-layer, Hybrid PCB
Copper weight:	1oz (35µm), 2oz (70µm)
PCB thickness:	15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil(0.762mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.62mm), 500mil (12.70mm)

PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Red, Yellow etc.
Surface finish:	Immersion gold, HASL, Immersion silver, Immersion tin, Bare copper, OSP, ENEPIG, Pure gold etc..

A Piece of TMM10 PCB
On the screen now is a type of 150 mils TMM10 PCB with immersion gold. It is a simple board with exquisite workmanship.

We can find their applications in power amplifiers and combiners, filters and couplers, satellite communication systems, global positioning systems antennas and patch antennas etc.

Conclusion
TMM10 materials are resistant to process chemicals, and damage is reduced during the whole circuit fabrication. It does not require a sodium napthanate treatment prior to electroless plating and it allows for reliable wire-bonding due to its thermoset resin.

OK. Thanks for your reading. I’ll see you next time.