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Taconic TLY-5Z High Frequency PCB Built on 30mil 0.762mm Substrates

Shipped: 4th-Oct-2023

We are thrilled to announce our latest shipment, Taconic TLY-5Z PCB. This cutting-edge PCB is engineered with Taconic's expertise in ceramic, PTFE, and woven fiberglass reinforcement, offering unmatched performance and reliability for your electronic circuits.

Let's dive into the remarkable features that make the TLY-5Z a game-changer in the world of PCB boards.

Laminate Introduction

Taconic TLY-5Z substrate is a composite material composed of ceramic, PTFE, and woven fiberglass reinforcement. This combination of materials provides superior performance and reliability. With a DK of 2.2 +/- 0.04 at 1.9 GHz/23°C, the TLY-5Z substrate ensures reliable signal transmission. Its dissipation factor of 0.0015 at 10 GHz/23°C indicates low loss tangent, leading to improved signal integrity. The TcDK of -72 ppm/°C ranging from -55 to 150°C guarantees exceptional dielectric constant stability across a wide temperature range. Furthermore, the substrate has a moisture absorption rate of just 0.03%, ensuring its durability.

Laminate Features

Taconic TLY-5Z substrate boasts several notable features that make it an excellent choice for advanced applications. Its low Z-axis coefficient of thermal expansion (CTE) ensures stability and reliability, even in challenging environments. The substrate also offers plated through hole stability, making it suitable for applications requiring reliable connections. With a low density of 1.92 g/cm3, the TLY-5Z substrate provides lightweight solutions without compromising performance. Moreover, it offers an attractive price/performance ratio, making it accessible for various projects. The substrate demonstrates excellent peel strength and is compatible with flat copper, allowing for efficient manufacturing and assembly processes.

PCB Stackup

This TLY-5Z PCB is used in 2-layer rigid PCBs. The stackup configuration consists of a 35 μm copper layer, a 0.762 mm (30mil) TLY-5Z core, and another 35 μm copper layer. This arrangement provides a solid foundation for various electronic designs.

PCB Construction Details

When it comes to construction, TLY-5Z PCB offers reliable performance and ease of manufacturing. The boards are customized to specific dimensions, with a typical example being 145mm x 90mm (+/- 0.15mm). The minimum trace/space is 6/8 mils, allowing for intricate designs. The minimum hole size is 0.3mm, and there are no blind vias in this configuration. The finished board thickness is 0.8mm, and a 1oz (1.4 mils) outer layer copper weight ensures sufficient conductivity. The surface finish is achieved with immersion gold, providing a protective and reliable coating. The top silkscreen is white, while the bottom silkscreen is not present. The top solder mask is blue, while the bottom solder mask is not applied. The boards undergo a thorough electrical test before shipment to ensure quality and functionality.

PCB Statistics

TLY-5Z PCB?allows for the creation of intricate PCB designs, as demonstrated by its statistics. The board consists of 17 components and a total of 83 pads, including 36 thru-hole pads and 47 top surface mount technology (SMT) pads. There are no bottom SMT pads in this configuration. The presence of 66 vias and 5 nets further highlights the versatility of this substrate.

Artwork and Standards

Our Taconic TLY-5Z PCB?is compatible with Gerber RS-274-X artwork, which is widely accepted as an industry standard. It adheres to the IPC-Class-2 standards, ensuring reliability and compliance with quality benchmarks.

Availability and Applications

Our Taconic TLY-5Z PCB is readily available worldwide, making it accessible to designers and engineers across the globe. Its exceptional characteristics make it suitable for numerous applications. In aerospace components, the TLY-5Z PCB finds its place in lightweight antennas for aircraft and RF passive components. Its reliability, stability, and performance make it an ideal choice for demanding electronic designs.

Parameter	Value
PCB Substrates
Material	Taconic TLY-5Z ceramic, PTFE, and woven fiberglass reinforcement
DK at 1.9 GHz/23°C	2.2 +/- 0.04
Dissipation factor at 10 GHz/23°C	0.0015
TcDK	-72 ppm/°C ranging -55~150°C
Moisture Absorption	0.03%
CTE X-axis	30 ppm/°C
CTE Y-axis	40 ppm/°C
CTE Z-axis	130 ppm/°C
Features
Low Z Axis CTE	Yes
Plated Through Hole Stability	Yes
Low Density	1.92 g/cm3
Price/Performance Ratio	Attractive
Peel Strength	Excellent
Compatible with Flat Copper	Yes
Stackup
Layer 1 Copper	35 μm
TLY-5Z Thickness	0.762 mm (30mil)
Layer 2 Copper	35 μm
Construction Details
Board Dimensions	145mm x 90mm (+/- 0.15mm)
Minimum Trace/Space	6/8 mils
Minimum Hole Size	0.3mm
Blind Vias	No
Finished Board Thickness	0.8mm
Finished Cu Weight	1oz (1.4 mils) outer layers
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Top Silkscreen	White
Bottom Silkscreen	No
Top Solder Mask	Blue
Bottom Solder Mask	No
Electrical Test	100% Electrical Test used prior to shipment
PCB Statistics
Components	17
Total Pads	83
Thru Hole Pads	36
Top SMT Pads	47
Bottom SMT Pads	0
Vias	66
Nets	5
Artwork Supplied	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Availability	Worldwide
Typical Applications
Application	Aerospace Components
	Low Weight Antennas for Aircraft
	RF Passive Components

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