Rogers TC600 High Frequency PCB Supplier

WELCOME TO BICHENG

Home
Company
Quality
Manufacture
Career
PCB Boards
- Newly Shipped RF PCB
- High Frequency PCB
Contact Us

Rogers TC600 High Frequency PCB Built on 60mil 1.524mm Substrates

Shipped: 30th-Oct-2023

It’s happy to share with you our last shipped RF PCB built on 60mil TC600 substrate. TC600 from Rogers is a true game-changer. This woven fiberglass reinforced, ceramic-filled, PTFE-based composite offers a range of exceptional features and specifications that make it a top choice for electronic designers and engineers. Let's delve into the key aspects of this TC600 PCBs and explore its potential applications.

Substrates Introduction

TC600 substrate boasts impressive characteristics that set it apart from conventional options. With a DK of 6.15 at 1.8MHz and 10 GHz/23°C, it ensures reliable signal transmission. Additionally, its dissipation factor of 0.0017 and 0.0020 at 1.8 and 10 GHz/23°C respectively ensures low loss tangent, leading to higher amplifier or antenna efficiency. The TcDK of -75 ppm/°C ranging from -40~150°C ensures exceptional dielectric constant stability across a wide temperature range. With a moisture absorption rate of just 0.03% and a CTE that ranges from 9 ppm/°C in the X and Y axes to 35 ppm/°C in the Z-axis, the TC600 substrate offers excellent reliability and durability.

Substrates Features

TC600 substrate is packed with features that make it a preferred choice for various applications. It boasts "Best in Class" thermal conductivity of 1.1 W/m·K, ensuring effective heat dissipation and improved performance. The substrate's low loss tangent provides higher amplifier or antenna efficiency, making it ideal for applications where signal integrity is critical. Moreover, its mechanical robustness makes it a reliable alternative to brittle laminates, as it can withstand processing, impact, and high G forces. Additionally, the TC600 substrate is priced affordably for commercial applications, making it accessible to a wide range of projects. Its high peel strength further ensures the reliability of narrow lines.

PCB Stackup

This TC600 PCB is used in 2-layer rigid PCBs. The stackup consists of a 35 μm copper layer, a 1.524 mm (60mil) TC600 core, and another 35 μm copper layer. This configuration provides a sturdy foundation for various electronic designs.

PCB Construction Details

When it comes to construction, this TC600 PCB offers reliable performance and ease of manufacturing. The boards are customized to specific dimensions, with a typical example being 141.5mm x 163mm. The minimum trace/space is 6/4 mils, allowing for intricate designs. The finished board thickness is 1.6mm, and a 1oz (1.4 mils) outer layer copper weight ensures sufficient conductivity. The surface finish is achieved with immersion gold, providing a protective and reliable coating. The boards are subjected to a thorough electrical test before shipment, ensuring their quality and functionality.

PCB Statistics

This TC600 circuit board facilitates the creation of intricate PCB designs, as demonstrated by its impressive statistics. With 35 components and a total of 153 pads, including 67 thru-hole pads and 86 top SMT pads, it offers flexibility for various assembly requirements. The presence of 124 vias and 7 nets further highlights its versatility.

Artwork and Standards

Our TC600 PCB is compatible with Gerber RS-274-X artwork, a widely accepted industry standard. It adheres to IPC-Class-2 standards, ensuring reliability and compliance with quality benchmarks.

Availability and Applications

Our TC600 PCBs are readily available to worldwide, making it accessible to designers and engineers across the globe. Its exceptional characteristics make it suitable for numerous applications, including power amplifiers, filters, and couplers. In avionics applications, it finds its place in microwave combiner and power divider boards. TC600 PCB is also ideal for small footprint antennas, digital audio broadcasting (DAB) antennas, and GPS & handheld RFID reader antennas.

Parameter	Value
PCB Substrates
Material	Rogers TC600 woven fiberglass reinforced, ceramic filled, PTFE-based composite
DK at 1.8MHz	6.15
DK at 10 GHz/23°C	6.15
Dissipation factor at 1.8 GHz/23°C	0.0017
Dissipation factor at 10 GHz/23°C	0.002
TcDK	-75 ppm/°C ranging -40~150°C
Moisture Absorption	0.03%
CTE X-axis	9 ppm/°C
CTE Y-axis	9 ppm/°C
CTE Z-axis	35 ppm/°C
Features
Thermal Conductivity	1.1 W/m.K
Dielectric Constant Stability	-75 ppm/oC
Loss Tangent	Very Low
Mechanical Robustness	Yes
Affordability	Priced Affordably for Commercial Applications
Peel Strength	High
Stackup
Layer 1 Copper	35 μm
TC600 Thickness	1.524 mm (60mil)
Layer 2 Copper	35 μm
Construction Details
Board Dimensions	141.5mm x 163mm (+/- 0.15mm)
Minimum Trace/Space	6/4 mils
Minimum Hole Size	0.5mm
Blind Vias	No
Finished Board Thickness	1.6mm
Finished Cu Weight	1oz (1.4 mils) outer layers
Via Plating Thickness	20 μm
Surface Finish	Immersion Gold
Top Silkscreen	No
Bottom Silkscreen	No
Top Solder Mask	Green
Bottom Solder Mask	No
Filled and Capped Via	0.5mm
Electrical Test	100% Electrical Test used prior to shipment
PCB Statistics
Components	35
Total Pads	153
Thru Hole Pads	67
Top SMT Pads	86
Bottom SMT Pads	0
Vias	124
Nets	7
Artwork Supplied	Gerber RS-274-X
Accepted Standard	IPC-Class-2
Availability	Worldwide
Typical Applications
Applications	Power Amplifiers
	Filters and Couplers
	Microwave Combiner and Power Divider Boards in Avionics Applications
	Small Footprint Antennas
	Digital Audio Broadcasting (DAB) Antennas (Satellite Radio)
	GPS & Hand-held RFID Reader Antennas

BACK TO OCTOBER