TC350 PCB 20mil | Bicheng PCB

WELCOME TO BICHENG

Home
Company
Quality
Manufacture
Career
PCB Boards
- Newly Shipped RF PCB
- High Frequency PCB
Contact Us

Rogers TC350 PCB Built on 20mil 0.508mm High Thermal Conductivity Substrates with Double Sided Copper and Immersion Tin

Shipped: 7th-Sep-2023

Introducing our new PCB material designed to meet the demands of modern electronic applications. This woven fiberglass reinforced, ceramic filled, PTFE-based composite offers exceptional performance and reliability.

Crafted with a woven fiberglass reinforced, ceramic-filled, PTFE-based composite material, this PCB offers unparalleled reliability and stability. With a dielectric constant of 3.5 at 1 MHz, 1.8 GHz, and 10 GHz, and a dissipation factor of 0.0020 at 10 GHz, your signals will remain pristine and distortion-free. The temperature coefficient of dielectric constant at -9 ppm/°C ensures consistent performance across a wide range of temperatures. Additionally, the x-y CTE of 7.7 ppm/°C and z CTE of 23 ppm/°C enhance the reliability and durability of the PCB.

This PCB boasts "Best in Class" thermal conductivity of 1.0 W/mK, enabling efficient heat dissipation and management. The dielectric constant stability of -9 ppm/°C ensures your circuit operates reliably across various temperature conditions. The very low loss tangent provides higher amplifier or antenna efficiency, resulting in superior system performance. Furthermore, this PCB is priced affordably for commercial applications, making it an economical choice without compromising on quality. Its thick and dense woven glass composition makes it easier to drill compared to traditional laminates, streamlining production processes and saving time. The high peel strength ensures reliable copper adhesion, even in thermally stressed applications.

The PCB features a 2-layer rigid stackup configuration. It consists of copper layer 1 with a thickness of 35μm (1oz), a TC350 Core with a thickness of 20mil (0.508mm), and copper layer 2 with a thickness of 35μm (1oz). With precise construction details, such as a finished board thickness of 0.6mm and immersion tin surface finish, this PCB meets the highest quality standards. The board dimensions of 98mm x 81mm (± 0.15mm) provide ample space for your designs.

We pay meticulous attention to the construction specifications of this PCB. It supports a minimum trace/space of 6/7 mils and a minimum hole size of 0.45mm. With no blind vias, the PCB ensures seamless connectivity. The finished Cu weight of 1oz (1.4 mils) on outer layers and a via plating thickness of 25μm further enhance its performance. The top solder mask is green, while the top silkscreen is provided in white. Each PCB undergoes a comprehensive 100% electrical test before shipment, ensuring its reliability.

This PCB offers impressive statistics, making it a versatile choice for your projects. It supports up to 27 components and boasts a total of 109 pads, including 75 thru-hole pads and 34 top SMT pads. With 110 vias and 6 nets, this PCB empowers your circuit designs.

Compatibility is never an issue with the PCB. It supports Gerber RS-274-X artwork, ensuring seamless integration into your manufacturing process. It adheres to the IPC-Class-2 quality standard, assuring top-notch performance. With worldwide availability, this PCB solution is accessible to customers across the globe.

The PCB finds its applications in various domains, including power amplifiers, filters, and couplers. It is ideal for tower-mounted amplifiers (TMA) and boosters (TMB), thermally cycled antennas sensitive to dielectric drift, as well as microwave combiners and power dividers.

For any technical questions or inquiries, please contact us at sales@bicheng-enterprise.com. Embrace the future of PCB technology with the PCB and unleash the true potential of your electronic projects.

Item	Value
PCB Material	Woven fiberglass reinforced, ceramic-filled, PTFE-based composite
	Dielectric Constant at 1 MHz: 3.5
	Dielectric Constant at 1.8 GHz: 3.5
	Dielectric Constant at 10 GHz: 3.5
	Dissipation Factor at 10 GHz: 0.0020
	Temperature Coefficient of Dielectric Constant: -9 ppm/°C
	x-y CTE (Coefficient of Thermal Expansion): 7.7 ppm/°C
	z CTE (Coefficient of Thermal Expansion): 23 ppm/°C
Features	"Best in Class" Thermal Conductivity (1.0 W/mK) and Dielectric Constant Stability across Wide Temperatures (-9 ppm/°C)
	- Very Low Loss Tangent provides Higher Amplifier or Antenna Efficiency
	- Priced Affordably for Commercial Applications
	- Easier to drill than traditional commercial-based laminates utilizing thick and dense style woven glass
	- High Peel Strength for Reliable Copper Adhesion in thermally stressed applications
Stackup	2-layer rigid PCB
	Copper Layer 1: 35 μm (1 oz)
	TC350 Core: 20 mil (0.508 mm)
	Copper Layer 2: 35 μm (1 oz)
Construction Details	Board dimensions: 98 mm x 81 mm (1 PCS), +/- 0.15 mm
	Minimum Trace/Space: 6/7 mils
	Minimum Hole Size: 0.45 mm
	No blind vias
	Finished board thickness: 0.6 mm
	Finished Cu weight: 1 oz (1.4 mils) outer layers
	Via plating thickness: 25 渭m
	Surface finish: Immersion Tin
	Top Silkscreen: White
	Bottom Silkscreen: No
	Top Solder Mask: Green
	Bottom Solder Mask: No
	100% Electrical test used prior to shipment
PCB Statistics	Components: 27
	Total Pads: 109
	Thru Hole Pads: 75
	Top SMT Pads: 34
	Bottom SMT Pads: 0
	Vias: 110
	Nets: 6
Type of artwork supplied	Gerber RS-274-X
Quality standard	IPC-Class-2
Availability	Worldwide
Benefits	- Heat Dissipation and Management
	- Improved Processing and Reliability
	- Large Panel Sizes for Multiple Circuit Layout for lowered Processing Costs
Typical Applications	- Power Amplifiers, Filters, and Couplers
	- Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB)
	- Thermally Cycled Antennas sensitive to dielectric drift
	- Microwave Combiner and Power Dividers

BACK TO SEPTEMBER