Shenzhen Bicheng Electronics Technology Co., Ltd
深圳市碧澄电子科技有限公司
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info@bicheng-enterprise.com
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TC350 High Frequency PCB 2-Layer 20mil Thick

Shipped: 23rd-JAN-2024  

1. TC350 Introduction
Rogers TC350 laminates are printed circuit board substrates comprised of PTFE, highly thermally conductive ceramic fillers and woven glass reinforcement. TC350 materials offer designers a unique combination of low insertion loss and higher thermal conductivity. This enables superior reliability and reduced operating temperatures in high power applications.

TC350 laminates maintain excellent dielectric constant stability across various temperatures, crucial for power amplifier and antenna designers in maximizing gain and minimizing bandwidth loss. This stability is also key for phase and impedance sensitive devices like network transformers in power amplifiers or Wilkinson Power Dividers.
2. Features
- Dielectric constant (Dk) of 3.5 at 1MHz, 1.8GHz and 10GHz
- Dissipation factor of .0015 at 1MHz, 0.0018 at 1.8GHz, 0.002 at 10GHz
- CTE x-axis of 7 ppm/°C, CTE y-axis of 7 ppm/°C, CTE z-axis of 23 ppm/°C, 50°C to 150°C
- Low thermal coefficient of Dk at-9 ppm/°C, -40°C to 140°C
- High Thermal conductivity of 0.72 W/mk
- Moisture absorption of 0.05%
- T260, T288, T300 > 60 minutes
3. Benefits
- Reduced junction temperature and improved reliability
- Excellent heat dissipation and management
- Improved bandwidth utilization and efficiency for amplifiers and antennas
- Unsurpassed plated through hole reliability
4. PCB Stackup: 2-layer rigid PCB
Copper_layer_1 - 35 μm
TC350 Core - 0.508 mm (20mil)
Copper_layer_2 - 35 μm
5. PCB Construction details:
- Board dimensions: 68.35mm x 41.4 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 6/5 mils
- Minimum Hole Size: 0.5mm
- No Blind vias.
- Finished board thickness: 0.6mm
- Finished Cu weight: 1oz (1.4 mils) outer layers
- Via plating thickness: 20 μm
- Surface finish: Hot Air Soldering Level (HASL)
- Top Silkscreen: No
- Bottom Silkscreen: No
- Top Solder Mask: Green
- Bottom Solder Mask: Green
- 0.5mm via filled by resin and capped
- 100% Electrical test used prior to shipment
6. PCB Statistics:
Components: 19
Total Pads: 48
Thru Hole Pads: 26
Top SMT Pads: 22
Bottom SMT Pads: 0
Vias: 25
Nets: 3
7. Type of artwork supplied: Gerber RS-274-X
8. Quality standard: IPC-Class-2
9. Availability: worldwide
10. Some Typical Applications:
- Power Amplifiers, Filters and Couplers
- Tower Mounted Amplifiers(TMA) andTower Mounted Boosters (TMB)
- Thermally Cycled Antennas sensitive to dielectric drift
- Microwave Combiner and Power Dividers
 
 
 
 
 
 
 
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