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Introduction |
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Greetings, everyone! |
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Welcome back to my channel. Today, I'm excited to discuss another type of RF PCBs specifically designed for heat management: TC350 PCB. |
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Rogers TC350 laminates are advanced printed circuit board substrates, consisting of a combination of PTFE, highly thermally conductive ceramic fillers, and woven glass reinforcement. The primary advantage of TC350 is its exceptional thermal conductivity, which greatly enhances heat transfer and effectively reduces both dielectric and insertion loss. This leads to higher gains and efficiencies in amplifiers and antennas. |
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One of the key benefits of TC350 is its ability to handle higher power due to its superior thermal conductivity. By efficiently managing heat, it minimizes the occurrence of hot spots and improves overall device reliability. In designs with limited thermal management capabilities, TC350 laminates excel by enhancing heat transfer within the board. This, in turn, reduces junction temperatures and extends the lifespan of active components. Such attributes are crucial for ensuring the reliability of power amplifiers, increasing Mean Time Between Failures (MTBF), and minimizing warranty costs. |
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Furthermore, TC350 laminates operate at lower temperatures and exhibit matching thermal expansion characteristics with chips. This compatibility greatly enhances the reliability of component attachment, mitigating issues like solder fatigue and joint failure. |
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Data Sheet |
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In this section, we will delve into the typical properties of TC350, providing valuable insights into its electrical, thermal, mechanical, and physical attributes. Let's explore the key features of this remarkable laminate. |
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Electrical Properties: |
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TC350 boasts impressive electrical properties that make it an excellent choice for various applications. Some noteworthy features include: |
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Dielectric Constant: |
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At 1 MHz: TC350 exhibits a dielectric constant of 3.50 (IPC TM-650 2.5.5.3). At 1.8 GHz: The dielectric constant remains consistent at 3.50 (Resonant Cavity). At 10 GHz: TC350 maintains a dielectric constant of 3.50 (IPC TM-650 2.5.5.5). |
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Dissipation Factor: |
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At 1 MHz: TC350 demonstrates a low dissipation factor of 0.0015 (IPC TM-650 2.5.5.3). At 1.8 GHz: The dissipation factor is impressively low at 0.0018 (Resonant Cavity). At 10 GHz: TC350 maintains a low dissipation factor of 0.0020 (IPC TM-650 2.5.5.5). |
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Temperature Coefficient of Dielectric: |
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TC350 exhibits a temperature coefficient of dielectric of -9 ppm/oC at 10 GHz over a temperature range of -40 to 150°C (IPC TM-650 2.5.5.5). |
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Volume Resistivity: |
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TC350 showcases a volume resistivity of 7.4x10^6 MΩ-cm (C96/35/90, IPC TM-650 2.5.17.1). At E24/125, the volume resistivity is even higher, measuring 1.4x10^8 MΩ-cm. |
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Surface Resistivity: |
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The surface resistivity of TC350 is 3.2x10^7 MΩ (C96/35/90, IPC TM-650 2.5.17.1). At E24/125, the surface resistivity reaches 4.3x10^8 MΩ (IPC TM-650 2.5.17.1). |
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Electrical Strength: |
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TC350 demonstrates an electrical strength of 780 Volts/mil (31 kV/mm) (IPC TM-650 2.5.6.2). |
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Dielectric Breakdown: |
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The dielectric breakdown voltage of TC350 is 40 kV (IPC TM-650 2.5.6). |
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Arc Resistance: |
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TC350 exhibits an arc resistance of over 240 seconds (IPC TM-650 2.5.1). |
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Thermal Properties: |
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TC350 excels in thermal performance, providing enhanced reliability in demanding environments. Notable thermal properties include: |
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Decomposition Temperature (Td): |
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Initial: TC350 has an initial decomposition temperature of 520°C (IPC TM-650 2.4.24.6). 5%: The decomposition temperature reaches 567°C (IPC TM-650 2.4.24.6). |
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Thermal Endurance: |
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TC350 demonstrates excellent thermal endurance, with minimum T260, T288, and T300 values exceeding 60 minutes (IPC TM-650 2.4.24.1). |
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Thermal Expansion: |
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The thermal expansion coefficient (CTE) of TC350 is 7 ppm/oC (x,y) and 23 ppm/oC (z) in the temperature range of 50-150oC (IPC TM-650 2.4.41, 2.4.24). The z-axis expansion from 50 to 260oC is 1.2% (IPC TM-650 2.4.24). |
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Mechanical Properties: |
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TC350 offers robust mechanical properties, ensuring structural integrity and reliability. Key mechanical characteristics include: |
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Peel Strength to Copper: |
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After Thermal Stress: TC350 exhibits a peel strength of 7 lb/in (1.2 N/mm) (IPC TM-650 2.4.8). At Elevated Temperatures (150oC): The peel strength reaches 9 lb/in (1.6 N/mm) (IPC TM-650 2.4.8.2). After Process Solutions: The peel strength remains at 7 lb/in (1.2 N/mm) (IPC TM-650 2.4.8). |
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Flexural Strength: |
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TC350 demonstrates a flexural strength of 14 kpsi (97 MPa) (Machine direction) and 10 kpsi (69 MPa) (Crossdirection) (IPC TM-650 2.4.4). |
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Tensile Strength: |
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The tensile strength of TC350 is 11 kpsi (76 MPa) (Machine direction) and 8 kpsi (55 MPa) (Cross direction) (IPC TM-650 2.4.18.3). |
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Water Absorption: |
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TC350 has a low water absorption rate of 0.05% (IPC TM-650 2.6.2.1). |
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Density: |
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At ambient temperature (23oC), TC350 exhibits a density of 2.30 g/cm^3 (ASTM D792 Method A). |
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Thermal Conductivity: |
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TC350 demonstrates a thermal conductivity of 0.72 W/mK (ASTM D5470). |
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Specific Heat: |
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The specific heat of TC350 is 0.90 J/gK (ASTM D5470). |
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Flammability: |
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TC350 is classified as V-0 according to the UL-94 flammability standard. |
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NASA Outgassing: |
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Under NASA testing conditions at 125oC, TC350 exhibits minimal outgassing: Total Mass Loss: 0.02% (NASA SP-R-0022A). Collected Volatiles: 0.01% (NASA SP-R-0022A). Water Vapor Recovered: 0.01% (NASA SP-R-0022A). |
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Typical Properties:TC350 |
Property |
Units |
Value |
Test Merthod |
1. Electrical Properties |
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Dielectric Constant (may vary by thickness) |
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@1 MHz |
－ |
3.50 |
IPC TM-650 2.5.5.3 |
@1.8 GHz |
－ |
3.50 |
RESONANT CAVITY |
@10 GHz |
－ |
3.50 |
IPC TM-650 2.5.5.5 |
Dissipation Factor |
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@1 MHz |
－ |
0.0015 |
IPC TM-650 2.5.5.3 |
@1.8 GHz |
－ |
0.0018 |
RESONANT CAVITY |
@10 GHz |
－ |
0.0020 |
IPC TM-650 2.5.5.5 |
Temperature Coefficient of Dielectric |
－ |
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TC r @ 10 GHz (-40-150°C) |
ppm/ºC |
-9 |
IPC TM-650 2.5.5.5 |
Volume Resistivity |
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C96/35/90 |
MΩ-cm |
7.4x106 |
IPC TM-650 2.5.17.1 |
E24/125 |
MΩ-cm |
1.4x108 |
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Surface Resistivity |
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C96/35/90 |
MΩ |
3.2x107 |
IPC TM-650 2.5.17.1 |
E24/125 |
MΩ |
4.3x108 |
IPC TM-650 2.5.17.1 |
Electrical Strength |
Volts/mil (kV/mm) |
780 (31) |
IPC TM-650 2.5.6.2 |
Dielectric Breakdown |
kV |
40 |
IPC TM-650 2.5.6 |
Arc Resistance |
sec |
>240 |
IPC TM-650 2.5.1 |
2.Thermal Properties |
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Decomposition Temperature (Td) |
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Initial |
°C |
520 |
IPC TM-650 2.4.24.6 |
5% |
°C |
567 |
IPC TM-650 2.4.24.6 |
T260 |
min |
>60 |
IPC TM-650 2.4.24.1 |
T288 |
min |
>60 |
IPC TM-650 2.4.24.1 |
T300 |
min |
>60 |
IPC TM-650 2.4.24.1 |
Thermal Expansion, CTE (x,y) 50-150ºC |
ppm/ºC |
7, 7 |
IPC TM-650 2.4.41 |
Thermal Expansion, CTE (z) 50-150ºC |
ppm/ºC |
23 |
IPC TM-650 2.4.24 |
% z-axis Expansion (50-260ºC) |
% |
1.2 |
IPC TM-650 2.4.24 |
3. Mechanical Properties |
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Peel Strength to Copper (1 oz/35 micron) |
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After Thermal Stress |
lb/in (N/mm) |
7 (1.2) |
IPC TM-650 2.4.8 |
At Elevated Temperatures (150ºC) |
lb/in (N/mm) |
9 (1.6) |
IPC TM-650 2.4.8.2 |
After Process Solutions |
lb/in (N/mm) |
7 (1.2) |
IPC TM-650 2.4.8 |
Young’s Modulus |
kpsi (MPa) |
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IPC TM-650 2.4.18.3 |
Flexural Strength (Machine/Cross) |
kpsi (MPa) |
14/10 (97/69) |
IPC TM-650 2.4.4 |
Tensile Strength (Machine/Cross) |
kpsi (MPa) |
11/8 (76/55) |
IPC TM-650 2.4.18.3 |
Compressive Modulus |
kpsi (MPa) |
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ASTM D-3410 |
Poisson’s Ratio |
－ |
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ASTM D-3039 |
4. Physical Properties |
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Water Absorption |
% |
0.05 |
IPC TM-650 2.6.2.1 |
Density, ambient 23ºC |
g/cm3 |
2.30 |
ASTM D792 Method A |
Thermal Conductivity |
W/mK |
0.72 |
ASTM D5470 |
Specific Heat |
J/gK |
0.90 |
ASTM D5470 |
Flammability |
class |
V-0 |
UL-94 |
NASA Outgassing, 125ºC, ≤10- 6 torr |
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Total Mass Loss |
% |
0.02 |
NASA SP-R-0022A |
Collected Volatiles |
% |
0.01 |
NASA SP-R-0022A |
Water Vapor Recovered |
% |
0.01 |
NASA SP-R-0022A |
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Our PCB Capability (TC350) |
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We are equipped with a diverse range of capabilities to meet your specific requirements. |
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Layer Count: We specialize in producing Single Layer, Double Layer, Multi-layer, and Hybrid PCBs. Whether you need a simple single-layer board or a complex multi-layer design, we have the expertise to bring your ideas to life. |
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Copper Weight: We offer two options for copper weight: 1oz (35μm) and 2oz (70μm). Depending on your project's needs, we can provide the appropriate copper weight to ensure optimal electrical conductivity and current-carrying capacity. |
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PCB Thickness: Our capabilities include various PCB thicknesses to suit different applications. You can choose from options such as 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), and 60mil (1.524mm). We understand the importance of selecting the right thickness to meet mechanical strength requirements and accommodate the complexity of your circuitry. |
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PCB Size: With our manufacturing capabilities, we can handle PCB sizes up to 400mm X 500mm. Whether you require small PCBs for compact devices or larger boards for more extensive systems or equipment, we have the capacity to deliver. |
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Solder Mask: We offer a variety of solder mask colors, including Green, Black, Blue, Yellow, Red, and more. The solder mask not only provides protection against environmental factors but also aids in component placement and identification. You can choose the color that best suits your preferences or aligns with your product branding. |
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Surface Finish: Our factory provides a wide range of surface finish options to enhance the performance and reliability of your PCBs. These options include Bare Copper, HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), OSP (Organic Solderability Preservative), Immersion Silver, Immersion Tin, ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), and Pure Gold. We can help you select the most suitable surface finish based on factors such as solderability, corrosion resistance, and overall performance requirements. |
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PCB Capability (TC350) |
PCB Material: |
Woven Fiberglass Reinforced, Ceramic Filled, PTFE based Composite |
Designation: |
TC350 |
Dielectric constant: |
3.5±0.05 |
Thermal Conductivity |
0.72 W/m-K |
Dissipation Factor |
Df .002@10 GHz |
Layer count: |
Single Layer, Double Layer, Multi-layer, Hybrid PCB |
Copper weight: |
1oz (35µm), 2oz (70µm) |
PCB thickness: |
10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm) |
PCB size: |
≤400mm X 500mm |
Solder mask: |
Green, Black, Blue, Yellow, Red etc. |
Surface finish: |
Bare copper, HASL, ENIG, OSP, Immersion silver, Immersion tin, ENEPIG, Pure gold etc.. |
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A PCB and Applicatoins |
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The image presented below displays two variations of double-sided TC350 PCBs constructed on 30mil substrates. The first type features a blue solder mask with immersion silver on the pads, while the second type showcases a black solder mask with immersion gold on the pads beneath it. |
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TC350 PCBs are highly sought after for applications that require efficient heat dissipation. They are commonly utilized in various devices, including power amplifiers, backhaul radios, tower-mounted amplifiers (TMA), tower-mounted boosters (TMB), thermally cycled antennas, microwave combiners, power dividers, and many more. These PCBs are specifically engineered to facilitate fast and effective heat transfer, ensuring optimal performance in heat-intensive environments. |
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