S1000-2M Impedance PCB Supplier

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S1000-2M Impedance PCB Built on 4-Layer Copper with Blind Via and Immersion Gold

Shipped: 8th-Sep-2023

Engineered with high Tg, high-performance, and low CTE FR-4 material, this S1000-2M printed circuit board offers exceptional capabilities for a wide range of applications.

The S1000-2M PCB utilizes a high Tg, high-performance, and low CTE FR-4 material, ensuring superior performance and durability. With a dielectric constant of 4.6 at 1GHz and a dissipation factor of 0.018 at the same frequency, this PCB guarantees excellent signal integrity and minimal power loss. It boasts a Tg of 185℃ and a Td of 355℃, offering exceptional thermal stability and reliability. Additionally, the z-axis coefficient of thermal expansion (CTE) is 41 ppm/°C before Tg and 208 ppm/°C after Tg, providing outstanding dimensional stability over a wide temperature range.

This S1000-2M PCB features a 4-layer rigid stackup configuration, comprising a copper layer 1 with a thickness of 35 μm, a 4.685mil prepreg 2116, a copper layer 2 with a thickness of 35 μm, an FR-4 core S1000-2M with a thickness of 0.2 mm, a copper layer 3 with a thickness of 35 μm, a 4.685mil prepreg 2116, and a copper layer 4 with a thickness of 35 μm. This stackup ensures optimal performance and reliability for your designs.

When it comes to construction details, this S1000-2M PCB is engineered to exceed expectations. With board dimensions of 255.1mm x 130.8mm (± 0.15mm), you have ample space to unleash your creativity. It supports a minimum trace/space of 4/6 mils and a minimum hole size of 0.3mm, enabling precise and intricate circuit layouts. The PCB includes L1-L2 blind vias, expanding your design possibilities. With a finished board thickness of 1.0mm and a finished copper weight of 1oz (1.4 mils) on the outer layers, the S1000-2M PCB guarantees durability and reliability. The via plating thickness is 20 μm, ensuring excellent electrical connections. The surface finish is immersion gold, providing superior conductivity and corrosion resistance. Both the top and bottom layers feature white silkscreens, enhancing readability and aesthetics. The top and bottom solder masks are green, ensuring optimal protection for your circuitry. Each PCB undergoes a comprehensive 100% electrical test prior to shipment, ensuring optimal performance and reliability. The top layer is designed with a 12mil track, offering a 50-ohm single-end impedance for high-speed applications.

This S1000-2M PCB boasts impressive statistics, making it an ideal choice for a wide range of applications. It supports up to 358 components and offers a total of 406 pads, including 186 thru-hole pads, 141 top SMT pads, and 79 bottom SMT pads. With 258 vias and 16 nets, this PCB provides excellent connectivity and signal routing capabilities.

Our S1000-2M PCB supports Gerber RS-274-X artwork, ensuring seamless integration into your manufacturing process. It adheres to the IPC-Class-2 quality standard, guaranteeing top-notch performance and reliability. With worldwide availability, this PCB solution is accessible to customers around the globe.

Unleash the power of the S1000-2M PCB in a wide range of applications, including computers, communication devices, automotive electronics, and high multilayer PCB designs. Its versatility and exceptional performance make it an ideal choice for demanding electronic designs.

For any technical questions or inquiries, please contact us at sales@bicheng-enterprise.com. Harness the power of high-performance and reliability with the S1000-2M PCB and revolutionize your electronic designs.

PCB9

Item	Value
PCB Material	S1000-2M PCB Material
	High Tg, High performance and Low CTE FR-4 Material
	Dielectric Constant at 1GHz: 4.6
	Dissipation Factor at 1GHz: 0.018
	Tg: 185℃, Td: 355℃
	Z-axis CTE before Tg: 41 ppm/°C
	Z-axis CTE after Tg: 208 ppm/°C
Features	- Anti-CAF capability
	- Lead-free compatible
	- Excellent thermal reliability
	- Excellent through-hole reliability
	- Excellent mechanical process ability
Stackup	4-layer rigid PCB
	Copper_layer_1: 35 μm
	Prepreg 2116: 4.685 mil
	Copper_layer_2: 35 μm
	FR-4 Core S1000-2M: 0.2 mm
	Copper_layer_3: 35 μm
	Prepreg 2116: 4.685 mil
	Copper_layer_4: 35 μm
Construction Details	Board Dimensions: 255.1 mm x 130.8 mm (1 PCS), +/- 0.15 mm
	Minimum Trace/Space: 4/6 mils
	Minimum Hole Size: 0.3 mm
	L1-L2 Blind vias
	Finished Board Thickness: 1.0 mm
	Finished Cu Weight: 1 oz (1.4 mils) outer layers
	Via Plating Thickness: 20 μm
	Surface Finish: Immersion Gold
	Top Silkscreen: White
	Bottom Silkscreen: White
	Top Solder Mask: Green
	Bottom Solder Mask: Green
	100% Electrical Test Used Prior to Shipment
	Top Layer, 12 mil track, 50 ohm single-end impedance
PCB Statistics	Components: 358
	Total Pads: 406
	Thru Hole Pads: 186
	Top SMT Pads: 141
	Bottom SMT Pads: 79
	Vias: 258
	Nets: 16
Type of Artwork Supplied	Gerber RS-274-X
Quality Standard	IPC-Class-2
Availability	Worldwide
Applications	- Computer
	- Communication
	- Automotive Electronics
	- Suitable for High Multilayer PCB

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