RT/duroid 6035 HTC PCB 30mil

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Rogers RT/duroid 6035HTC PCB Built on 30mil 0.762mm Laminates With Double Layer Copper and Immersion Silver

Shipped: 9th-Sep-2023

The RT/duroid 6035HTC PCB is built using ceramic filled PTFE composites, ensuring superior performance and reliability. With a process DK of 3.5 at 10 GHz/23°C and a dissipation factor of 0.0013 at the same frequency, this PCB guarantees excellent signal integrity and minimal power loss. Operating within a temperature range of -40°C to +85°C, it offers reliability and stability across various environments. Its TCDK of -66 ppm/°C during -50°C to 150°C ensures consistent performance under extreme temperature conditions.

The remarkable features of the RT/duroid 6035HTC PCB offer numerous benefits for your high-power applications. Its high thermal conductivity enables improved heat dissipation, resulting in lower operating temperatures and enhanced reliability. The low loss tangent ensures exceptional high-frequency performance, allowing for precise and accurate signal transmission. The thermally stable low profile and reverse-treated copper foil contribute to lower insertion loss and excellent thermal stability of traces. Additionally, the advanced filler system enhances drillability and extends tool life compared to alumina-containing circuit materials.

This RT/duroid 6035HTC PCB features a 2-layer rigid stackup configuration, consisting of copper layer 1 with a thickness of 35 μm, an RT/duroid 6035HTC core with a thickness of 0.762 mm (30mil), and copper layer 2 with a thickness of 35 μm. These specifications ensure optimal performance and reliability for your high-power designs.

When it comes to construction details, this RT/duroid 6035HTC PCB leaves no room for compromise. The board dimensions of 76.05mm x 53.2mm (± 0.15mm) provide ample space for your designs. It supports a minimum trace/space of 6/8 mils and a minimum hole size of 0.45mm, enabling intricate and compact circuit layouts. With no blind vias, the RT/duroid 6035HTC PCB facilitates seamless connectivity. The finished board thickness is 0.9mm, and the finished Cu weight is 1 oz (1.4 mils) on outer layers. The via plating thickness is 20 μm, ensuring robust electrical connections. The surface finish is immersion silver, which offers excellent conductivity and corrosion resistance. The PCB does not feature any silkscreen or solder mask layers. Each PCB undergoes a comprehensive 100% electrical test prior to shipment, ensuring optimal performance and reliability.

This RT/duroid 6035HTC PCB boasts impressive statistics, making it an ideal choice for your high-power applications. It supports up to 87 components and offers a total of 101 pads, including 73 thru-hole pads, 19 top SMT pads, and 9 bottom SMT pads. With 105 vias and 5 nets, this PCB provides excellent connectivity and signal routing capabilities.

Our PCBs adhere to the IPC-Class-2 quality standard, guaranteeing top-notch performance and reliability. With worldwide availability, the PCB solution is accessible to customers across the globe.

The RT/duroid 6035HTC PCB finds its applications in a wide range of high-power RF and microwave amplifiers, power amplifiers, couplers, filters, and power dividers. Its versatility and exceptional performance make it an ideal choice for demanding electronic designs.

For any technical questions or inquiries, please contact us at sales@bicheng-enterprise.com. Harness the power of the RT/duroid 6035HTC PCB and elevate your high-power applications to new heights of excellence.

PCB9

Item	Value
RT/duroid 6035HTC PCB Material	Ceramic filled PTFE composites
	Process DK 3.5, at 10 GHz/23°C
	Dissipation factor 0.0013, at 10 GHz/23°C
	TCDK -66 ppm/°C during -50°C to 150°C
	-40℃?to +85℃?operation
Features/Benefits	- High Thermal conductivity
	- Low loss tangent
	- Thermally stable low profile and reverse treat copper foil
	- Advanced filler system
Stackup	2-layer rigid PCB
	Copper Layer 1: 35 μm
	Rogers Core RT/duroid 6035HTC: 0.762?mm (30?mil)
	Copper Layer 2: 35 μm
Construction Details	Board dimensions: 76.05 mm x 53.2 mm (1 PC), +/- 0.15 mm
	Minimum Trace/Space: 6/8 mils
	Minimum Hole Size: 0.45 mm
	No blind vias
	Finished board thickness: 0.9 mm
	Finished Cu weight: 1 oz (1.4 mils) outer layers
	Via plating thickness: 20 μm
	Surface finish: Immersion Silver
	Top Silkscreen: No
	Bottom Silkscreen: No
	Top Solder Mask: No
	Bottom Solder Mask: No
	100% Electrical test used prior to shipment
PCB Statistics	Components: 87
	Total Pads: 101
	Thru Hole Pads: 73
	Top SMT Pads: 19
	Bottom SMT Pads: 9
	Vias: 105
	Nets: 5
Type of artwork supplied	Gerber RS-274-X
Accepted standard	IPC-Class-2
Availability	Worldwide
Some Typical Applications	- High power RF and microwave amplifiers
Some Typical Applications	- Power amplifiers, couplers, filters, combiners, power dividers

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