RT/duroid 6035HTC PCB Supplier

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RT/duroid 6035HTC High Frequency PCB

Introduction

Hello Everyone, Today, we’re going to talk about a type of high power RF circuit boards --- RT/duroid 6035 HTC PCB.

Rogers RT/duroid 6035HTC high frequency circuit materials are ceramic-filled PTFE composites specifically designed for high power RF and microwave applications.

These laminates possess a thermal conductivity that is nearly 2.4 times higher than the standard RT/duroid 6000 products. This enhanced thermal conductivity allows for efficient heat dissipation, making them ideal for high-power circuits that generate significant heat.

Moreover, RT/duroid 6035HTC laminates come with copper foil (ED and reverse treat) that exhibits excellent long-term thermal stability. This feature ensures that the PCB maintains its performance and reliability even under prolonged exposure to high temperatures.

Additionally, Rogers advanced filler system for these laminates offer exceptional drill-ability. This means that the material can be easily and accurately drilled, reducing drilling costs compared to standard high thermally conductive laminates that utilize alumina fillers. The improved drill-ability of RT/duroid 6035HTC PCBs enhances the manufacturing process and contributes to the overall cost-effectiveness of the product.

Data Sheets

RT/duroid 6035HTC exhibits the following properties:

Dielectric Constant (Process): The dielectric constant (εr) of RT/duroid 6035HTC is 3.50 ± 0.05 at 10 GHz and 23°C. This value indicates the material's ability to support efficient signal transmission at high frequencies. The measurement is performed using the IPC-TM-650 2.5.5.5 Clamped Stripline method.

Dielectric Constant (Design): The design dielectric constant (εr) of RT/duroid 6035HTC is 3.6. This value is applicable in the frequency range of 8 GHz to 40 GHz and is determined using the Differential Phase Length Method.

Dissipation Factor: The dissipation factor of RT/duroid 6035HTC is 0.0013 at 10 GHz and 23°C. This indicates low energy loss during signal transmission, contributing to enhanced signal integrity. The measurement is conducted according to IPC-TM-650 2.5.5.5.

Thermal Coefficient of εr: The thermal coefficient of the dielectric constant for RT/duroid 6035HTC is -66 ppm/°C in the temperature range of -50°C to 150°C. This property describes the change in dielectric constant with temperature. The measurement is modified as per IPC-TM-650 2.5.5.5.

Dielectric Strength: RT/duroid 6035HTC demonstrates a dielectric strength of 835 V/Mil at a thickness of 15 mil. This property measures the material's ability to withstand electrical stress without breakdown. The measurement is carried out according to IPC-TM-650 2.5.6.2.

Breakdown Voltage: The breakdown voltage of RT/duroid 6035HTC is 12.59 kV at a thickness of 15 mil. This value represents the voltage at which the material experiences electrical breakdown. The measurement is performed using IPC-TM-650 2.5.6.

Volume Resistivity: RT/duroid 6035HTC has a volume resistivity of 10^8 Mohm-cm under Condition A. This property indicates the material's resistance to electrical current flow through its volume. The measurement follows IPC-TM-650 2.5.17.1.

Surface Resistivity: The surface resistivity of RT/duroid 6035HTC is 10^8 Mohm under Condition A. This property describes the material's resistance to electrical current flow across its surface. The measurement is conducted according to IPC-TM-650 2.5.17.1.

Tensile Modulus: RT/duroid 6035HTC has a tensile modulus of 329 kpsi in the machine direction (MD) and 244 kpsi in the cross-machine direction (CMD). This property measures the material's stiffness and resistance to deformation. The measurement is performed after exposure to 40 hours at 23°C and 50% relative humidity, following ASTM D638.

Dimensional Stability: RT/duroid 6035HTC exhibits a dimensional stability of -0.11 mm/m (mils/inch) in the cross-machine direction (CMD) and -0.08 mm/m (mils/inch) in the machine direction (MD). This property describes the material's ability to maintain its dimensions under specific conditions. The measurement is conducted on a 0.030" 1 oz EDC foil thickness after etching, following IPC-TM-650 2.4.39A.

Coefficient of Thermal Expansion: The coefficient of thermal expansion for RT/duroid 6035HTC is 19 ppm/°C in the X direction, 19 ppm/°C in the Y direction, and 39 ppm/°C in the Z direction. This property represents the material's change in size with temperature variation. The measurement is performed at 23°C and 50% relative humidity, following IPC-TM-650 2.4.41.

Thermal Conductivity: RT/duroid 6035HTC demonstrates a thermal conductivity of 1.44 W/m/K at 80°C. This property describes the material's ability to conduct heat. The measurement follows ASTM C518.

Moisture Absorption: RT/duroid 6035HTC exhibits a moisture absorption of 0.06% according to the D24/23 method. This property indicates the material's ability to resist moisture absorption, which can affect its electrical properties. The measurement is performed following IPC-TM-650 2.6.2.1 and ASTM D570.

Density: The density of RT/duroid 6035HTC is 2.2 gm/cm3 at 23°C. This property represents the material's mass per unit volume. The measurement follows ASTM D-I apologize for the incomplete response. Here is the continuation:

Copper Peel Strength: The copper peel strength of RT/duroid 6035HTC is 7.9 pli. This property measures the adhesion strength between the copper layer and the substrate material. The measurement is conducted at 20 seconds and 288°C, following IPC-TM-650 2.4.8.

Flammability: RT/duroid 6035HTC has achieved a V-0 rating for flammability. This indicates that the material has passed the UL 94 test and is considered highly flame retardant.

Lead-Free Process Compatible: RT/duroid 6035HTC is compatible with lead-free processes. This means it can be used in manufacturing processes that adhere to lead-free requirements, promoting environmental and safety standards.

Property	Typical Value RT/duroid 6035HTC	Direction	Unit	Condition	Test Method
Dielectric Constant, εr Process	3.50 ± 0.05	Z	-	10 GHz/23°C	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, εr Design	3.6	Z	-	8 GHz - 40 GHz	Differential Phase Length Method
Dissipation Factor,	0.0013	Z	-	10 GHz/23°C	IPC-TM-650, 2.5.5.5
Thermal Coefficient of εr	-66	Z	ppm/°C	-50°C to 150°C	mod IPC-TM-650, 2.5.5.5
Dielectric Strength	835	-	V/Mil	15 mil thickness	IPC-TM-650, 2.5.6.2
Breakdown Voltage	12.59	-	kV	15 mil thickness	IPC-TM-650, 2.5.6
Volume Resistivity	108	-	MΩ•cm	COND A	IPC-TM-650, 2.5.17.1
Surface Resistivity	108	-	MΩ	COND A	IPC-TM-650, 2.5.17.1
Tensile Modulus	329 244	MD CMD	kpsi	40 hrs @ 23°C/50RH	ASTM D638
Dimensional Stability	-0.11 -0.08	CMD MD	mm/m (mils/inch)	0.030” 1 oz EDC foil Thickness after etch +E4/105	IPC-TM-650, 2.4.39A
Coefficient of Thermal Expansion (-55 to 288 °C)	19	X	ppm/°C	23°C/50% RH	IPC-TM-650 2.4.41
	19	Y
	39	Z
Thermal Conductivity	1.44	-	W/m/K	80°C	ASTM C518
Moisture Absorption	0.06	-	%	D24/23	IPC-TM-650 2.6.2.1 ASTM D570 ????
Density	2.2	-	gm/cm3	23°C	ASTM D-792
Copper Peel Strength	7.9	-	pli	20 sec.@ 288°C	IPC-TM-650 2.4.8
Flammability	V-0	-	-	-	UL ?94
Lead-Free Process Compatible	YES

Our PCB capability (RT/duroid 6035HTC)

At our manufacturing facility, we have the capability to produce RT/duroid 6035HTC PCBs with a range of features to meet diverse design needs. Here's a glimpse into our manufacturing capabilities:

Layer Count: We can manufacture double layer, multilayer, and hybrid PCBs using RT/duroid 6035HTC materials. Whether you require a simple two-layer board or a complex multilayer design, we have the expertise to bring your vision to life.

Copper Weight: Our facility offers flexibility in copper weight options for RT/duroid 6035HTC PCBs. You can choose from 0.5oz (17 μm), 1oz (35μm), and 2oz (70μm) copper weights, allowing you to optimize current carrying capacity and electrical performance according to your specific requirements.

Laminate Thickness: With our manufacturing capabilities, we can produce RT/duroid 6035HTC PCBs with various laminate thicknesses. Whether you need a 10mil (0.254mm), 20mil (0.508mm), 30mil (0.762mm), or 60mil (1.524mm) thickness, we can deliver the right solution for your application's mechanical strength and impedance control needs.

PCB Size: Our facility is equipped to handle PCBs with a maximum size of ≤400mm X 500mm. This ensures that we can accommodate a wide range of board sizes, providing flexibility for different project requirements.

Solder Mask: We offer a variety of solder mask colors for RT/duroid 6035HTC PCBs. Whether you prefer the classic green, black, blue, yellow, red, or any other color, we can apply the desired solder mask to meet your aesthetic or identification needs.

Surface Finish: Our manufacturing capabilities encompass a comprehensive range of surface finish options for RT/duroid 6035HTC PCBs. From bare copper to HASL, ENIG, immersion silver, immersion tin, ENEPIG, pure gold, OSP, and more, we have the expertise to apply the right surface finish for your specific requirements, ensuring excellent solderability, corrosion resistance, and environmental performance.

PCB Capability (RT/duroid 6035HTC)
PCB Material:	Ceramic-filled PTFE composites
Designation:	RT/duroid 6035HTC
Dielectric constant:	3.50±0.05
Layer count:	Double Layer, Multilayer, Hybrid PCB
Copper weight:	0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
Laminate thickness:	10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size:	≤400mm X 500mm
Solder mask:	Green, Black, Blue, Yellow, Red etc.
Surface finish:	Bare copper, HASL, ENIG, Immersion silver, Immersion tin, ENEPIG, Pure gold, OSP etc..

Applications

RT/duroid 6035HTC PCBs find their applications in a wide range of high-power RF and microwave circuits. Here are some typical applications where these PCBs excel: High power RF and microwave amplifiers, Power amplifiers, couplers, filters, combiners, and power dividers etc.